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Renesas DF36057FZJV

Part No.:
DF36057FZJV
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixDF36057FZJV.pdf
Description:
IC MCU 16BIT 56KB FLASH 64LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,884

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Product details

Overview

DF36057FZJV from Renesas Electronics is a 16-bit single-chip microcontroller in the H8/36057 Group, featuring the H8/300H CPU core, 512 KB on-chip ROM, 32 KB RAM, and integrated peripherals including SCI, I2C, and 16-bit timers. It operates at up to 20 MHz, supports 5 V operation, and targets embedded control applications requiring deterministic real-time response and on-chip nonvolatile program storage.

For engineers reviewing the DF36057FZJV datasheet, DF36057FZJV pinout, DF36057FZJV application, or DF36057FZJV equivalent, key selection criteria include its 100-pin LQFP package, ROM-based execution architecture, H8/300H instruction set compatibility, and support for on-board programming via SCI3 channel 1 (P21/RXD, P22/TXD) in boot mode.

Technical Context

The DF36057FZJV implements the H8/300H CPU core with 24-bit address space, supporting both big-endian and little-endian data access modes. Its memory map includes dedicated areas for on-chip ROM (0x000000–0x07FFFF), RAM (0xFFE000–0xFFFFFF), and peripheral registers (0xF00000–0xF00FFF).

It integrates system-level functions including a programmable clock pulse generator with crystal/ceramic resonator support, four power-down modes (Sleep, Standby, Subsleep, Subactive), and module standby control for selective peripheral gating. Reset handling follows a defined vector at 0xFFFFF0, and exception processing supports 64 interrupt vectors with configurable edge-triggered external interrupts.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreH8/300H 16-bit RISC core, instruction-compatible with H8/300, enabling legacy code reuse and toolchain continuity.
ROM Capacity512 KB on-chip Flash ROM (0x000000–0x07FFFF), eliminating need for external program memory in cost-sensitive designs.
RAM Size32 KB on-chip RAM (0xFFE000–0xFFFFFF), sufficient for real-time stack, buffers, and firmware variables without external SRAM.
Max Operating Frequency20 MHz system clock, delivering ~12.5 MIPS performance suitable for motor control, industrial I/O, and protocol stacks.
Supply Voltage4.5 V to 5.5 V operation, compatible with standard 5 V logic systems and legacy industrial power rails.
Package100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), supporting automated assembly and thermal dissipation up to 70°C ambient.
I/O Pins81 CMOS bidirectional I/O pins with programmable pull-up resistors, enabling direct interface to sensors, displays, and discrete actuators.

Pinout & Package

DF36057FZJV is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per the H8/36057 Group Hardware Manual Rev.4.00 (2006), with dedicated reset (RES), clock input (XIN/XOUT), and multiple peripheral I/O groups mapped across port registers P0–P11.

Pin/TerminalCircuit RoleDesign Meaning
RESActive-low reset inputAsynchronous hardware reset; must be held low ≥1024 cycles after power stabilization to guarantee internal register initialization.
XIN / XOUTCrystal oscillator input/outputSupports 1–20 MHz crystal or ceramic resonator; internal oscillator circuit eliminates need for external clock generator.
P21 / P22SCI3 channel 1 RXD/TXDUsed for on-board programming in boot mode; requires external level-shifting if interfacing with RS-232 transceivers.
P85 / P86 / P87On-chip emulator (E7/E8) interfaceReserved when using E7/E8 debugger; unavailable for user I/O unless external hardware bypasses emulator signals.
VCC / VSSPower supply / groundMultiple dedicated VCC/VSS pairs ensure stable core and I/O rail decoupling; thermal pad must be soldered to PCB ground plane.

Key Features

FeatureDesign Value
On-chip Flash ROM with erase/write controlEnables field firmware updates via SCI3 boot loader without external programmer; FLMCR1/FLMCR2 registers allow block-level erase and byte/word programming.
Four power-down modes with wake-up sourcesReduces active current to ≤10 µA in Subsleep mode while retaining RAM content and allowing wake-up via external interrupt or timer match event.
Programmable clock generator with prescaler SSupports flexible clock tree configuration: main oscillator → prescaler S → system clock, enabling precise frequency division for peripheral timing (e.g., SCI baud rate generation).
Dedicated SCI, I²C, and 16-bit timer modulesProvides autonomous serial communication and timing without CPU intervention-critical for real-time sensor polling and actuator control loops.
Interrupt vector table with 64 entriesAllows prioritized, low-latency response to asynchronous events (e.g., encoder pulses, fault signals) with ≤6-cycle interrupt entry time in active mode.

Applications

Industrial PLC I/O ModuleMotor Drive Control Unit

Use Scenario: Compact DIN-rail mounted I/O expansion module acquiring digital inputs and driving relay outputs in factory automation.

IC Role / Device Role / Timing Role: Central controller executing ladder logic scan, managing isolated I/O drivers, and communicating via Modbus RTU over RS-485.

Use Value: On-chip 512 KB ROM stores full runtime firmware; 81 GPIO pins directly interface to optocoupled inputs and transistor outputs without glue logic.

Use Scenario: Brushless DC motor controller with Hall-effect feedback, PWM generation, and thermal protection monitoring.

IC Role / Device Role / Timing Role: Real-time motion controller generating three-phase PWM (via timer output compare), sampling analog currents, and executing commutation logic.

Use Value: 20 MHz CPU delivers sub-10 µs loop timing; integrated 16-bit timers support center-aligned PWM with dead-time insertion.

Building HVAC ControllerMedical Diagnostic Instrument Front-End

Use Scenario: Wall-mounted thermostat and zone controller managing temperature setpoints, fan speed, and damper actuation via I²C-connected sensors.

IC Role / Device Role / Timing Role: System manager coordinating environmental sensing, user interface (LCD + keypad), and HVAC subsystem communication.

Use Value: Integrated I²C master handles multi-sensor reads; 32 KB RAM buffers log data and maintains state during brief power interruptions.

Use Scenario: Portable ultrasound device front-end acquiring analog echo signals, digitizing via external ADC, and preprocessing beamformed data.

IC Role / Device Role / Timing Role: Data acquisition coordinator managing SPI-configured ADC, buffering samples in RAM, and transferring processed frames to host processor via SCI.

Use Value: Deterministic interrupt latency ensures consistent sample timing; on-chip ROM hosts safety-critical boot code and diagnostic routines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
HD64F36057GSame die, green (lead-free) packaging variant; identical electrical specs and pinout; RoHS-compliant finish.No functional difference; selected when lead-free compliance is required by end-market regulations.Drop-in replacement for DF36057FZJV where RoHS certification is mandatory.
H8/36037Lower memory configuration: 256 KB ROM, 16 KB RAM; same CPU core, peripheral set, and 100-pin LQFP package.Suitable for less complex control tasks with smaller firmware footprint and reduced RAM requirements.Cost-optimized alternative when application firmware fits within 256 KB and uses ≤16 KB RAM.

Compared with DF36057FZJV, HD64F36057G offers identical functionality with lead-free compliance, while H8/36037 reduces memory capacity by 50%-making it viable for scaled-down implementations where firmware size and data buffering needs are lower.

Availability

DF36057FZJV is available at Aetrix Electronics and suitable for industrial PLC I/O modules, motor drive control units, building HVAC controllers, and medical diagnostic instrument front-ends requiring stable component supply and long-term production continuity.

Supply support for DF36057FZJV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The H8 Family/H8/300H Tiny Series-including DF36057FZJV-is designed for cost-sensitive, high-reliability embedded control applications demanding deterministic real-time performance, on-chip nonvolatile storage, and minimal external components.

FAQ

What is the maximum operating frequency of the DF36057FZJV?

The DF36057FZJV supports a maximum system clock frequency of 20 MHz when using an external crystal or ceramic resonator. This frequency is achieved through the internal clock pulse generator and prescaler S configuration, enabling deterministic instruction execution at approximately 12.5 MIPS. The DF36057FZJV must be operated within its specified 4.5 V to 5.5 V supply range to maintain timing compliance at this speed.

Does the DF36057FZJV support in-system programming?

Yes, the DF36057FZJV supports in-system programming via its SCI3 channel 1 (P21/RXD and P22/TXD) in boot mode. This allows firmware updates without removing the device from the PCB. The DF36057FZJV's on-chip Flash ROM is organized into blocks managed by FLMCR1 and FLMCR2 registers, enabling sector erase and byte/word programming under firmware control.

What power-saving modes does the DF36057FZJV offer?

The DF36057FZJV provides four power-down modes: Sleep, Standby, Subsleep, and Subactive. In Subsleep mode, current consumption drops to ≤10 µA while retaining RAM content and enabling wake-up via external interrupt or timer match. Mode transitions are controlled via SYSCR1, SYSCR2, and MSTCR1 registers, allowing fine-grained peripheral gating and clock stopping.

Is the DF36057FZJV pin-compatible with other H8/36057 Group devices?

Yes, the DF36057FZJV shares the same 100-pin LQFP package and pinout with all members of the H8/36057 Group, including HD64F36057, HD64F36057G, HD64336057, and HD64336057G. Differences between these variants lie in mask ROM vs. Flash ROM, lead-free compliance, and test configurations-not in pin assignment or electrical interface behavior.

What development tools are supported for the DF36057FZJV?

The DF36057FZJV is supported by Renesas' H8S/H8/300 Series C/C++ Compiler (REJ10B0058), High-Performance Embedded Workshop 3 (REJ10B0026), and the E7/E8 on-chip emulators. Debugging requires reserving P85–P87 and the NMI pin; for production programming, the DF36057FZJV's SCI3 boot loader enables host-based firmware loading without emulator hardware.

DF36057FZJV Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
H8® H8/300H Tiny
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
CANbus, SCI, SSU
Peripherals:
PWM, WDT
Number of I/O:
45
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
3K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

DF36057FZJV FAQ

1.How can I place an order for DF36057FZJV through Aetrix?

Please submit a Request for Quotation (RFQ) for DF36057FZJV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF36057FZJV reliable?

The price and inventory of DF36057FZJV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF36057FZJV is usually 5 days.

3.What payment methods are accepted for DF36057FZJV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF36057FZJV transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF36057FZJV?

DF36057FZJV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF36057FZJV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF36057FZJV?

For technical support, including DF36057FZJV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF36057FZJV requirements.

6.How does Aetrix verify that DF36057FZJV is sourced from the original manufacturer or authorized distributors?

All DF36057FZJV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF36057FZJV meets industry standards.

7.What is the process for return or replacement of DF36057FZJV?

All DF36057FZJV units undergo pre-shipment inspection (PSI). If there is an issue with DF36057FZJV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF36057FZJV part is unused and in its original packaging.

Return procedure for DF36057FZJV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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