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Renesas DF36057FZV

Part No.:
DF36057FZV
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixDF36057FZV.pdf
Description:
IC MCU 16BIT 56KB FLASH 64LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,280

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Product details

Overview

DF36057FZV from Renesas Electronics is a 16-bit single-chip microcontroller in the H8/36057 Group, featuring the H8/300H CPU core, 128 KB on-chip ROM, 8 KB RAM, and integrated peripherals including SCI, I2C, timer modules, and 80-pin PQFP package. It operates at up to 20 MHz and supports multiple low-power modes (Sleep, Standby, Subsleep) for embedded control applications in industrial equipment and office automation.

For engineers reviewing the DF36057FZV datasheet, DF36057FZV pinout, DF36057FZV application, or DF36057FZV equivalent, key selection considerations include its 80-pin PQFP footprint, 128 KB mask-ROM program memory, H8/300H instruction set compatibility, integrated clock pulse generator with crystal/ceramic resonator support, and system-level power-down mode sequencing via SYSCR1/SYSCR2 registers.

Technical Context

The DF36057FZV implements the H8/300H CPU core with 16-bit data bus and 24-bit address space, supporting both big-endian and little-endian data formats. Its memory map includes dedicated areas for on-chip ROM (0x000000–0x01FFFF), RAM (0xFFE000–0xFFFFF), and peripheral registers (0xF00000–0xF00FFF).

Peripheral integration includes three serial communication interfaces (SCI1–SCI3), one I2C bus interface, four 16-bit timer modules (with input capture/output compare), and a 10-bit ADC with 8 channels. Clock generation supports external crystal (1–10 MHz), ceramic resonator, or external clock input, with programmable prescaler S for system clock division.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreH8/300H 16-bit RISC core, instruction-compatible with H8/300, enabling legacy code reuse
ROM Size128 KB mask-programmed ROM - fixed firmware storage without external memory dependency
RAM Size8 KB on-chip SRAM - sufficient for real-time stack, variables, and buffer handling in control loops
Max Operating Frequency20 MHz system clock - supports deterministic timing for motor control and sensor polling at ≤50 µs resolution
Package80-pin PQFP (14 × 20 mm, 0.65 mm pitch) - standard surface-mount footprint compatible with automated assembly
Power ModesSleep, Standby, Subsleep, Subactive - enables <1 µA standby current for battery-backed systems
I/O Pins64 CMOS bidirectional I/O pins - configurable per port mode register (PMR), with pull-up options

Pinout & Package

DF36057FZV is housed in an 80-pin Plastic Quad Flat Package (PQFP) with 0.65 mm lead pitch, 14 mm × 20 mm body size, and standard JEDEC MO-118 compliance. Thermal pad is not present; mounting requires standard reflow profile for plastic packages.

Pin/TerminalCircuit RoleDesign Meaning
VCC, VSSPower supply and groundDual VCC (3.3 V or 5 V selectable) and VSS pins distributed across package edges for noise reduction and IR drop mitigation
XTAL, EXTALClock input/outputConnects to 1–10 MHz crystal or ceramic resonator; internal oscillator circuit eliminates need for external capacitors in basic config
RESETActive-low reset inputAsynchronous reset signal; internal pull-up ensures defined state on power-up; debounced externally for robust recovery
P00–P07Port 0 I/O8-bit bidirectional port with individual direction control (PMR0); default as general-purpose I/O after reset
SCI3_TXD / P22Serial transmit outputAlternate function of P22 pin; used for bootloader communication in on-board programming mode (boot mode = 1)

Key Features

FeatureDesign Value
On-chip 128 KB ROMEliminates external program memory, reducing BOM count and PCB area in cost-sensitive industrial controllers
H8/300H CPU with 20 MHz maxDelivers 12.5 MIPS throughput for real-time interrupt response ≤1.2 µs (including vector fetch and context save)
Four 16-bit timer modulesSupports PWM generation, input capture for encoder signals, and periodic interrupt intervals down to 50 ns (at 20 MHz)
Integrated I2C interfaceEnables direct connection to EEPROM, temperature sensors, or PMICs without level-shifting or external logic
Multiple low-power modesSubsleep mode draws <10 µA at 3.3 V - extends battery life in portable test equipment and remote sensors

Applications

Industrial PLC I/O ModuleOffice Equipment Motor Control

Use Scenario: Compact programmable logic controller module managing discrete inputs/outputs and analog feedback in factory automation cabinets.

IC Role / Device Role / Timing Role: Main controller executing ladder logic scan cycles, coordinating SCI-based Modbus RTU communication, and driving opto-isolated outputs via GPIO.

Use Value: 128 KB ROM stores full runtime firmware and configuration tables; 64 I/O pins directly interface with DIN-rail I/O expanders and status LEDs without glue logic.

Use Scenario: Paper feed and toner drive subsystem in multifunction printers requiring precise stepper motor sequencing and jam detection.

IC Role / Device Role / Timing Role: Real-time motion controller using timer output compare for step pulses and ADC for thermal monitoring of fuser assembly.

Use Value: Four independent 16-bit timers enable simultaneous control of up to four motors; Subactive mode maintains clocked peripherals while reducing CPU power during idle periods.

Embedded Test Instrument Front PanelBuilding Automation Sensor Node

Use Scenario: Handheld calibration tool with LCD, keypad, and USB-to-SCI bridge for field service of pressure transmitters.

IC Role / Device Role / Timing Role: Host processor managing user interface, sensor data acquisition via ADC, and serial protocol translation to PC host.

Use Value: Integrated SCI3 supports bootloader updates over UART; 8 KB RAM accommodates display frame buffer and command queue without external SRAM.

Use Scenario: Wireless HVAC node measuring temperature, humidity, and CO₂, transmitting data via sub-GHz RF link controlled by GPIO.

IC Role / Device Role / Timing Role: Low-duty-cycle supervisor that wakes periodically via RTC alarm, samples sensors, processes data, and triggers RF transmission.

Use Value: Standby mode draws <1 µA, enabling 5-year operation on CR2032; I²C interface connects directly to digital environmental sensors (e.g., Sensirion SHT3x).

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
HD64F36057GSame die, identical ROM/RAM/timer/peripheral specs; differs only in marking and screening - G suffix denotes green (halogen-free) packagingNo functional difference; suitable for RoHS-compliant designs requiring halogen-free materialsSelect HD64F36057G when environmental compliance mandates halogen-free construction
H8/36037Lower memory: 64 KB ROM, 4 KB RAM; same CPU core, pin-compatible 80-pin PQFP, but reduced peripheral count (no SCI3, fewer timers)Targeted at simpler control tasks where firmware size and I/O count are constrainedChoose H8/36037 for cost-optimized designs with smaller code footprint and fewer real-time peripherals

Compared with HD64F36057G and H8/36037, DF36057FZV provides full 128 KB ROM capacity and complete peripheral set (including SCI3 and four timers) in the same 80-pin PQFP package - making it the highest-spec variant for feature-rich embedded control without layout change.

Availability

DF36057FZV is available at Aetrix Electronics and suitable for industrial PLC modules, office equipment motor controllers, embedded test instruments, and building automation sensor nodes requiring stable component supply and long-term lifecycle support.

Supply support for DF36057FZV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The H8 Family/H8/300H Tiny Series - including DF36057FZV - was designed for cost-effective, low-power embedded control in resource-constrained applications such as office automation, industrial I/O, and consumer electronics.

FAQ

What is the maximum operating frequency of the DF36057FZV?

The DF36057FZV supports a maximum system clock frequency of 20 MHz, achievable using an external crystal (1–10 MHz) with internal PLL multiplication or direct external clock input. This allows deterministic instruction execution at 12.5 MIPS, suitable for real-time control loops with sub-100 µs response requirements. The DF36057FZV's clock pulse generator includes prescaler S for flexible division ratios to derive peripheral clocks from the main system clock.

Does the DF36057FZV include on-chip flash or ROM memory?

The DF36057FZV integrates 128 KB of mask-programmed ROM, not flash memory. This ROM is programmed during wafer fabrication and cannot be field-updated. It provides secure, tamper-resistant firmware storage ideal for high-volume, fixed-function applications like industrial controllers. For field-programmable variants, Renesas offers other members of the H8/36057 Group with flash memory, but DF36057FZV specifically uses mask ROM.

Is the DF36057FZV pin-compatible with other H8/36057 Group devices?

Yes, the DF36057FZV shares the same 80-pin PQFP package and pinout with all members of the H8/36057 Group, including HD64F36057, HD64F36057G, and HD64336057. Pin functions - including power, clock, reset, I/O ports, and peripheral alternate functions - are identical across these variants. This enables hardware reuse across different memory configurations or environmental grades without PCB redesign.

What low-power modes does the DF36057FZV support, and how are they controlled?

The DF36057FZV supports Sleep, Standby, Subsleep, and Subactive modes, managed through SYSCR1 and SYSCR2 registers. Sleep mode stops the CPU clock while preserving RAM and register contents; Standby halts all clocks except RTC; Subsleep reduces internal voltage for ultra-low leakage; Subactive maintains selected peripherals active while slowing CPU clock. Entry is triggered by STOP or SLEEP instructions, with wake-up sources including external interrupts, RTC alarm, or SCI receive events.

Can the DF36057FZV be programmed in-system, and what interface is used?

The DF36057FZV supports on-board programming via SCI3 using the boot mode feature. When boot mode is enabled (via external pin configuration), the device boots from SCI3 (P21/RXD and P22/TXD) to accept firmware images from a host PC or programmer. This eliminates the need for dedicated programming hardware and enables field firmware updates. Note that SCI3 is reserved for this purpose during boot mode and cannot serve dual roles simultaneously.

DF36057FZV Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
H8® H8/300H Tiny
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
CANbus, SCI, SSU
Peripherals:
PWM, WDT
Number of I/O:
45
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
3K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

DF36057FZV FAQ

1.How can I place an order for DF36057FZV through Aetrix?

Please submit a Request for Quotation (RFQ) for DF36057FZV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF36057FZV reliable?

The price and inventory of DF36057FZV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF36057FZV is usually 5 days.

3.What payment methods are accepted for DF36057FZV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF36057FZV transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF36057FZV?

DF36057FZV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF36057FZV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF36057FZV?

For technical support, including DF36057FZV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF36057FZV requirements.

6.How does Aetrix verify that DF36057FZV is sourced from the original manufacturer or authorized distributors?

All DF36057FZV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF36057FZV meets industry standards.

7.What is the process for return or replacement of DF36057FZV?

All DF36057FZV units undergo pre-shipment inspection (PSI). If there is an issue with DF36057FZV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF36057FZV part is unused and in its original packaging.

Return procedure for DF36057FZV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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