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Vishay Siliconix DG2512DN-T1-E4
- Part No.:
- DG2512DN-T1-E4
- Manufacturer:
- Vishay Siliconix
- Package:
- 6-UFDFN
- Datasheet:
-
DG2512DN-T1-E4.pdf
- Description:
- IC SW SPST-NCX1 1.3OHM 6MINIQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,992
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Product details
Overview
DG2512DN-T1-E4 from Vishay Siliconix is a low-voltage, single-pole/single-throw (SPST) monolithic CMOS analog switch in miniQFN-6 package, featuring 1.3 Ω on-resistance at 2.7 V, 1.8 V to 5.5 V supply range, and guaranteed break-before-make timing. It serves as a bidirectional signal path selector in portable battery-powered systems requiring minimal board space and low power consumption.
For engineers reviewing the DG2512DN-T1-E4 datasheet, DG2512DN-T1-E4 pinout, DG2512DN-T1-E4 application, or DG2512DN-T1-E4 equivalent, key selection criteria include on-resistance flatness (≤0.4 Ω), charge injection (3 pC typ. at 2.7 V), off-isolation (–58 dB), and compatibility with 1.8 V logic control in space-constrained analog signal routing.
Technical Context
The DG2512DN-T1-E4 implements a single SPST switch with true bidirectional conduction and rail-to-rail analog signal handling (0 V to V+). Its JI5L low-voltage CMOS process ensures latch-up immunity (>300 mA per JESD78A) and supports operation down to 1.8 V while maintaining sub-2 Ω RON across –40 °C to +85 °C.
Break-before-make timing is guaranteed (1–12 ns), preventing momentary shorting during state transitions. The device uses internal clamping diodes to protect NC/NO/COM pins against overvoltage up to V+ + 0.3 V, with leakage currents limited to ±20 nA across temperature and supply conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.8 V to 5.5 V - enables direct interface with 1.8 V, 2.5 V, 3.3 V, and 5 V logic and analog rails without level shifting. |
| On-Resistance (RON) | 1.3 Ω typ. at 2.7 V - minimizes signal attenuation and voltage drop in precision analog paths (e.g., sensor front-ends). |
| RON Flatness | ≤0.4 Ω - ensures consistent gain and linearity across full analog input range (0 V to V+), critical for ADC/DAC multiplexing. |
| Charge Injection | 3 pC typ. at 2.7 V - reduces sampling error and settling time in sample-and-hold and data acquisition circuits. |
| Off-Isolation (OIRR) | –58 dB at 1 MHz - suppresses crosstalk between adjacent channels in multi-signal routing applications. |
| Turn-On/Off Time | 18 ns / 7 ns typ. at 2.7 V - supports high-speed switching in portable comms and test equipment signal paths. |
| Input Logic Thresholds | VINH = 1.6 V min., VINL = 0.4 V max. at 3 V - ensures reliable TTL/CMOS-compatible control with margin at low supply. |
Pinout & Package
Package: miniQFN-6 (1.2 mm × 1.0 mm, 0.4 mm pitch, 0.55 mm height), Pb-free with NiPdAu terminations (–E4 suffix), thermally enhanced exposed pad (pin 6 = GND).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN) | Digital control input | Active-high logic input; drives internal CMOS gate; compatible with 1.8 V logic thresholds. |
| 2 (GND) | Ground reference | Analog and digital ground return; must be connected to system ground plane for noise immunity. |
| 3 (COM) | Common analog terminal | Bidirectional signal path; connects to source or load depending on switch state; handles full rail-to-rail analog swing. |
| 4 (NC) | No-connect terminal | Internally unconnected; must be left floating or tied to GND per layout best practice-no functional role. |
| 5 (V+) | Positive supply rail | Provides power for analog switch core and level-shifting circuitry; decoupling capacitor required near pin. |
| 6 (Exposed Pad) | Thermal & electrical GND | Integral thermal path to PCB; must be soldered to solid GND copper area for thermal dissipation and EMI reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Low on-resistance flatness | 0.4 Ω max. variation across analog voltage range - preserves signal integrity in precision instrumentation and audio routing. |
| Guaranteed break-before-make | 1–12 ns minimum interval - eliminates signal shorting during channel switching in multiplexer-based data acquisition. |
| Latch-up immunity | >300 mA per JESD78A - ensures robust operation under transient overcurrent events in portable electronics. |
| Ultra-low charge injection | 3 pC typical - enables accurate sampling in high-resolution SAR ADC interfaces without added correction circuitry. |
| Miniature footprint | 1.2 mm × 1.0 mm - saves >60% board area vs. comparable SC-70 or SOT-363 switches, critical for ultra-thin mobile designs. |
Applications
| Portable Test Equipment | Cellular Phone Front-End |
|---|---|
|
Use Scenario: Signal routing between multiple sensor inputs and a shared ADC in handheld multimeters or calibrators. IC Role / Device Role / Timing Role: SPST analog switch enabling sequential sampling of thermocouples, RTDs, and voltage sources with minimal crosstalk. Use Value: 1.3 Ω RON and –58 dB off-isolation maintain measurement accuracy across 16-bit dynamic range without calibration drift. |
Use Scenario: Antenna switching and RF front-end signal path selection in LTE/Wi-Fi combo modules. IC Role / Device Role / Timing Role: Low-capacitance (21 pF off-state), fast-switching (18 ns tON) SPST switch isolating PA output from antenna diversity paths. Use Value: 3 pC charge injection prevents DC offset in sensitive LNA bias networks; 1.8 V operation aligns with baseband processor I/O voltage. |
| Low-Voltage Data Acquisition | ADC/DAC Multiplexing |
|
Use Scenario: Battery-powered environmental monitoring node aggregating temperature, humidity, and gas sensor outputs. IC Role / Device Role / Timing Role: Rail-to-rail analog switch supporting 0–3.3 V sensor signals while operating from same 3.3 V supply as microcontroller. Use Value: 1.8 V minimum supply allows extended runtime in deep-discharge states; <20 nA leakage preserves sensor bias stability. |
Use Scenario: Channel selection in 12-bit SAR ADC subsystems with multiple analog inputs (e.g., industrial PLC analog I/O). IC Role / Device Role / Timing Role: Precision SPST switch providing matched RON and low flatness to minimize gain error across all channels. Use Value: ≤0.4 Ω RON flatness ensures <0.02% gain nonlinearity; 61 pF on-capacitance avoids bandwidth degradation at 1 MSPS sampling rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPST analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Texas Instruments TS5A23157DBVR | RON = 0.9 Ω typ. at 3 V; 1.65–5.5 V supply; no guaranteed break-before-make; 6-pin SOT-23 package (2.9 mm × 1.6 mm). | Larger footprint; higher RON flatness (0.7 Ω); lacks BBM guarantee - less suitable for precision multiplexing where channel shorting must be avoided. | Prefer DG2512DN-T1-E4 when board space is constrained or BBM timing is mandatory; choose TS5A23157DBVR only if lower RON outweighs size and timing risk. |
| Analog Devices ADG801BRMZ-REEL7 | RON = 0.3 Ω typ. at 3 V; 1.8–5.5 V supply; 6-pin MSOP package (3.0 mm × 3.0 mm); 15 pC charge injection. | 3× larger footprint; 5× higher charge injection; higher cost; better RON but worse signal integrity in sampling applications. | Select DG2512DN-T1-E4 for portable, low-power, space-sensitive designs needing low QINJ and minimal board area; ADG801BRMZ-REEL7 fits only where ultra-low RON justifies size and cost penalties. |
Compared with TS5A23157DBVR and ADG801BRMZ-REEL7, the DG2512DN-T1-E4 delivers optimal balance of miniature size (1.2 × 1.0 mm), guaranteed break-before-make, and ultra-low charge injection (3 pC) - making it uniquely suited for battery-powered precision signal routing where layout area and sampling fidelity are co-constrained.
Availability
DG2512DN-T1-E4 is available at Aetrix Electronics and suitable for portable test equipment, cellular phone front-end modules, and low-voltage data acquisition systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for DG2512DN-T1-E4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-reliability, high-performance analog solutions for industrial, automotive, and consumer markets.
The DG2512DN-T1-E4 belongs to Vishay's low-voltage analog switch family built on the JI5L process, designed specifically for space- and power-constrained portable electronics requiring rail-to-rail signal handling and robust latch-up immunity.
FAQ
What is the maximum analog signal voltage range supported by the DG2512DN-T1-E4?
The DG2512DN-T1-E4 supports analog signals from 0 V to V+, where V+ ranges from 1.8 V to 5.5 V. For example, with V+ = 3.3 V, the COM, NC, and NO pins handle signals from 0 V to 3.3 V continuously. Signals exceeding V+ + 0.3 V are clamped by internal diodes, so external protection is recommended beyond that limit. This rail-to-rail capability makes the DG2512DN-T1-E4 ideal for interfacing with modern low-voltage sensors and ADCs without level-shifting circuitry.
Does the DG2512DN-T1-E4 require external pull-up or pull-down resistors on the IN pin?
No, the DG2512DN-T1-E4 does not require external pull-up or pull-down resistors on the IN pin. Its input structure accepts 1.8 V logic levels directly: VINH is guaranteed ≥1.6 V and VINL ≤0.4 V at 3 V supply, providing sufficient noise margin for clean switching. Input current remains below 1 µA across temperature, eliminating static loading concerns. However, in noisy environments or floating-control scenarios, a 100 kΩ pull-down is recommended to ensure defined state during power-up or MCU reset - but this is a system-level design choice, not a requirement of the DG2512DN-T1-E4 itself.
How is thermal performance managed in the miniQFN-6 package of the DG2512DN-T1-E4?
The DG2512DN-T1-E4's miniQFN-6 package features an exposed thermal pad (pin 6) that must be soldered to a dedicated GND copper pour on the PCB to achieve rated thermal performance. With proper layout - including ≥4 thermal vias under the pad connected to inner-layer GND planes - the device maintains junction temperatures within specification even at 150 mA continuous current. Derating begins above 70 °C (2 mW/°C), and maximum power dissipation is 160 mW. This thermal design enables reliable operation in sealed portable enclosures without forced airflow.
Can the DG2512DN-T1-E4 be used in bidirectional signal paths such as I²C or UART lines?
The DG2512DN-T1-E4 supports true bidirectional analog conduction when ON, but it is not recommended for digital bus isolation like I²C or UART. Its 61 pF on-capacitance and lack of bus-specific features (e.g., slew rate control, fail-safe biasing, or ESD rating beyond standard HBM) limit speed and noise immunity in open-drain or push-pull digital protocols. It is optimized for analog signal routing - e.g., sensor multiplexing or audio path selection - where signal integrity, low RON, and low charge injection matter more than digital timing margins. For digital buses, purpose-built bus switches (e.g., TS3A226AE) are preferred.
What is the significance of the "-E4" suffix in DG2512DN-T1-E4?
The "-E4" suffix in DG2512DN-T1-E4 indicates Vishay's lead (Pb)-free construction with NiPdAu (nickel-palladium-gold) device terminations, compliant with RoHS Directive 2011/65/EU. This suffix replaces older Pb-containing variants and ensures compatibility with modern reflow profiles and environmental requirements. The "DN" denotes miniQFN-6 packaging, "T1" specifies tape-and-reel delivery (3,000 units per reel), and the full part number DG2512DN-T1-E4 is orderable and traceable through Vishay's authorized distribution network. No functional or electrical differences exist between -E4 and legacy versions beyond termination material.
DG2512DN-T1-E4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Circuit:
- SPST - NC
- Multiplexer/Demultiplexer Circuit:
- 1:1
- Number of Circuits:
- 1
- On-State Resistance (Max):
- 1.3Ohm
- Channel-to-Channel Matching (ΔRon):
- 150mOhm (Max)
- Voltage - Supply, Single (V+):
- 1.8V ~ 5.5V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 35ns, 31ns
- -3db Bandwidth:
- -
- Charge Injection:
- 14pC
- Channel Capacitance (CS(off), CD(off)):
- 19pF
- Current - Leakage (IS(off)) (Max):
- 2nA
- Crosstalk:
- -64dB @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-miniQFN (1x1.2)
DG2512DN-T1-E4 FAQ
1.How can I place an order for DG2512DN-T1-E4 through Aetrix?
Please submit a Request for Quotation (RFQ) for DG2512DN-T1-E4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DG2512DN-T1-E4 reliable?
The price and inventory of DG2512DN-T1-E4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DG2512DN-T1-E4 is usually 5 days.
3.What payment methods are accepted for DG2512DN-T1-E4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DG2512DN-T1-E4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DG2512DN-T1-E4?
DG2512DN-T1-E4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DG2512DN-T1-E4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DG2512DN-T1-E4?
For technical support, including DG2512DN-T1-E4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DG2512DN-T1-E4 requirements.
6.How does Aetrix verify that DG2512DN-T1-E4 is sourced from the original manufacturer or authorized distributors?
All DG2512DN-T1-E4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DG2512DN-T1-E4 meets industry standards.
7.What is the process for return or replacement of DG2512DN-T1-E4?
All DG2512DN-T1-E4 units undergo pre-shipment inspection (PSI). If there is an issue with DG2512DN-T1-E4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DG2512DN-T1-E4 part is unused and in its original packaging.
Return procedure for DG2512DN-T1-E4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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