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Vishay Siliconix DG507BEW-T1-GE3
- Part No.:
- DG507BEW-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Package:
- 28-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
DG507BEW-T1-GE3.pdf
- Description:
- IC MUX DUAL 8:1 300OHM 28SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,101
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Product details
Overview
DG507BEW-T1-GE3 from Vishay Siliconix is a dual 8-channel differential CMOS analog multiplexer designed to route one of eight differential input pairs to a common dual output. It features break-before-make switching, ±15 V or single 12 V supply operation, 44 V absolute max rating, -40 °C to +125 °C temperature range, and ultra-low 1 pC charge injection-enabling high-precision data acquisition in avionics and medical instrumentation.
For engineers reviewing the DG507BEW-T1-GE3 datasheet, DG507BEW-T1-GE3 pinout, DG507BEW-T1-GE3 application, or DG507BEW-T1-GE3 equivalent, key selection criteria include differential channel count, on-resistance matching (≤10 Ω), off-isolation (-84 dB at 1 MHz), crosstalk (-84 dB), and SOIC28 package compatibility with industrial-grade thermal performance.
Technical Context
The DG507BEW-T1-GE3 implements a 3-bit binary address decoder driving dual 8:1 differential switch arrays with independent enable control. Its enhanced SG-II CMOS process minimizes parasitic capacitance (CD(off) = 17 pF, CS(off) = 4 pF) and leakage (<50 pA over full temperature range), supporting low-glitch, high-fidelity signal routing.
Break-before-make timing (tOPEN ≤ 10 ns at full temperature) prevents momentary shorting between adjacent differential channels. TTL-compatible digital inputs (VIL ≤ 0.8 V, VIH ≥ 2.4 V) ensure robust interfacing with microcontrollers and FPGAs across its extended operating range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Analog Channels | Dual 8-channel differential - routes one of eight differential input pairs (S1a/S1b through S8a/S8b) to Da/Db outputs |
| Supply Range | ±5 V to ±20 V dual or 10 V to 24 V single supply - supports wide-range industrial and avionics power architectures |
| On-Resistance | 400 Ω max at ±15 V, 650 Ω max at 12 V - ensures minimal signal attenuation and gain error in precision measurement paths |
| Charge Injection | 1 pC (full temp) - reduces voltage glitch on sampled-hold capacitors in data acquisition front-ends |
| Off-Isolation | -84 dB at 1 MHz - maintains signal integrity by suppressing coupling between inactive and active differential channels |
| Bandwidth | 217 MHz (dual supply) - enables high-speed analog routing up to video and intermediate-frequency signals |
| Leakage Current | ±50 pA max over -40 °C to +125 °C - preserves accuracy in high-impedance sensor interfaces and battery-powered systems |
Pinout & Package
Package: 28-pin SOIC (wide-body), 0.3525" width, RoHS-compliant, JEDEC MS-013AC compliant, thermal resistance θJ-A = 95.3 °C/W.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1, 28 | V+ | Positive supply rail - accepts up to +44 V; powers internal level shifters and switch drivers |
| 2–8, 20–27 | S1a–S8a / S1b–S8b | Differential source terminals - eight matched pairs for balanced input signal routing |
| 9, 10 | GND | Analog/digital ground reference - must be low-impedance for optimal THD and crosstalk performance |
| 11–13 | A0, A1, A2 | 3-bit binary channel select - determines which differential pair connects to Da/Db outputs |
| 14 | EN | Enable input - logic low disables all switches; allows stacking multiple DG507B devices |
| 15, 16 | Da, Db | Differential outputs - deliver selected input pair with matched delay and amplitude response |
| 17 | V- | Negative supply rail - accepts down to -44 V; required for bipolar analog signal swing |
| 18, 19 | NC | No-connect pins - internally unused; must remain unconnected per datasheet |
Key Features
| Feature | Design Value |
|---|---|
| Dual differential architecture | Enables noise-rejecting signal routing in EMI-prone environments like avionics and motor control feedback loops |
| Break-before-make switching | Guarantees <10 ns channel separation - eliminates transient shorts during address transitions in safety-critical systems |
| Ultra-low charge injection (1 pC) | Minimizes sampling errors in 16-bit+ SAR ADC front-ends and precision integrator circuits |
| TTL-compatible logic inputs | Direct interface with 3.3 V/5 V microcontrollers without level-shifting - reduces BOM count and layout complexity |
| Extended temperature range (-40 °C to +125 °C) | Validated operation in under-hood automotive, industrial PLC, and downhole oil/gas electronics |
Applications
| High-Speed Data Acquisition | Medical Instrumentation |
|---|---|
Use Scenario: Multiplexing multiple sensor channels (e.g., EEG, ECG electrodes) into a single high-resolution ADC path. IC Role / Device Role / Timing Role: Differential analog multiplexer selecting one of eight isolated biopotential inputs while rejecting common-mode noise. Use Value: -84 dB off-isolation and 217 MHz bandwidth preserve signal fidelity across 0.1–100 Hz physiological bands without added filtering. | Use Scenario: Routing calibrated reference voltages and patient signals in portable ultrasound beamformers. IC Role / Device Role / Timing Role: Precision differential switch enabling time-multiplexed transmit/receive path selection with sub-ns timing control. Use Value: 1 pC charge injection prevents baseline drift in low-noise amplifiers; 44 V abs max rating accommodates HV bias rails. |
| Avionics Signal Management | ATE Test Channel Switching |
Use Scenario: Consolidating discrete transducer outputs (pressure, temperature, position) onto shared flight-control data buses. IC Role / Device Role / Timing Role: Ruggedized differential MUX handling MIL-STD-704 compliant supplies and EMI-hardened signal paths. Use Value: -40 °C to +125 °C operation and >250 mA latch-up immunity meet DO-160E environmental requirements. | Use Scenario: Automated test equipment switching between DUTs and calibration standards in semiconductor wafer probers. IC Role / Device Role / Timing Role: High-reliability analog switch enabling fast, repeatable channel reconfiguration during parametric testing sequences. Use Value: 10 Ω RDS(on) matching ensures consistent gain across 16 test channels; SOIC28 package supports automated optical inspection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADG507A | Same 3-bit dual 8:1 differential topology but higher RDS(on) (max 500 Ω @ ±15 V) and higher charge injection (3 pC) | Limited to lower-precision applications where 16-bit resolution is not required | Select ADG507A only if legacy design reuse or cost sensitivity outweighs need for lowest glitch energy |
| DG507A | Pre-B revision with higher leakage (±100 pA) and no guaranteed -40 °C to +125 °C operation | Not qualified for extended temperature industrial or aerospace deployments | Use DG507A only in commercial-grade systems with ambient temperature <85 °C |
Compared with ADG507A and DG507A, the DG507BEW-T1-GE3 delivers superior precision via 1 pC charge injection, tighter RDS(on) matching (≤10 Ω), and full automotive-grade temperature validation-making it the preferred choice for next-generation high-integrity signal routing.
Availability
DG507BEW-T1-GE3 is available at Aetrix Electronics and suitable for high-speed data acquisition, medical instrumentation, avionics signal management, and ATE test channel switching requiring stable component supply across extended temperature and voltage ranges.
Supply support for DG507BEW-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-reliability analog switches, MOSFETs, and precision resistors for demanding industrial and aerospace applications.
The DG507B product line was engineered to replace legacy DG507 variants with enhanced CMOS process technology-delivering lower leakage, reduced charge injection, and extended temperature capability for mission-critical analog signal routing.
FAQ
What is the maximum analog signal voltage range supported by the DG507BEW-T1-GE3?
The DG507BEW-T1-GE3 supports analog signals from V− to V+, with absolute maximum ratings of ±44 V. Under standard ±15 V dual supply, the usable analog range is ±15 V; under 12 V single supply, it is 0 V to 12 V. This rail-to-rail capability enables direct interfacing with sensors and DACs without external level shifting.
Does the DG507BEW-T1-GE3 support break-before-make switching, and what is its typical interval?
Yes, the DG507BEW-T1-GE3 guarantees break-before-make operation with a maximum tOPEN of 10 ns over its full -40 °C to +125 °C temperature range. This ensures no momentary shorting between adjacent differential channels during address changes-critical for preventing signal corruption in high-accuracy measurement systems.
Can the DG507BEW-T1-GE3 operate from a single 12 V supply, and how does performance differ from dual supply?
Yes, the DG507BEW-T1-GE3 supports single 12 V operation. In this mode, on-resistance increases to 650 Ω max (vs. 400 Ω at ±15 V), bandwidth reduces to 191 MHz (vs. 217 MHz), and charge injection rises to 4 pC (vs. 1 pC). These trade-offs are documented in the single-supply specifications table and remain suitable for most portable instrumentation designs.
What is the thermal resistance and power dissipation limit for the DG507BEW-T1-GE3 in SOIC28 package?
The DG507BEW-T1-GE3 in 28-pin SOIC has a junction-to-ambient thermal resistance (θJ-A) of 95.3 °C/W and a maximum power dissipation of 840 mW at 25 °C. Derating is 10.5 mW/°C above 70 °C, limiting usable power to ~420 mW at 125 °C ambient-sufficient for typical analog switching loads with <1 mA channel current.
How does the DG507BEW-T1-GE3 handle digital input compatibility with modern 3.3 V logic systems?
The DG507BEW-T1-GE3 features TTL-compatible inputs with VIL ≤ 0.8 V and VIH ≥ 2.4 V, ensuring reliable recognition of 3.3 V logic levels. Input currents are limited to ±1 µA across temperature, allowing direct connection to FPGA GPIOs or MCU pins without external pull-ups or level translators-reducing system complexity and board area.
DG507BEW-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Circuit:
- -
- Multiplexer/Demultiplexer Circuit:
- 8:1
- Number of Circuits:
- 2
- On-State Resistance (Max):
- 300Ohm
- Channel-to-Channel Matching (ΔRon):
- 10Ohm
- Voltage - Supply, Single (V+):
- 12V ~ 44V
- Voltage - Supply, Dual (V±):
- ±5V ~ 20V
- Switch Time (Ton, Toff) (Max):
- 250ns, 200ns
- -3db Bandwidth:
- 217MHz
- Charge Injection:
- 1pC
- Channel Capacitance (CS(off), CD(off)):
- 3pF, 17pF
- Current - Leakage (IS(off)) (Max):
- 1nA
- Crosstalk:
- -84dB @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOIC
DG507BEW-T1-GE3 FAQ
1.How can I place an order for DG507BEW-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for DG507BEW-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DG507BEW-T1-GE3 reliable?
The price and inventory of DG507BEW-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DG507BEW-T1-GE3 is usually 5 days.
3.What payment methods are accepted for DG507BEW-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DG507BEW-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DG507BEW-T1-GE3?
DG507BEW-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DG507BEW-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DG507BEW-T1-GE3?
For technical support, including DG507BEW-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DG507BEW-T1-GE3 requirements.
6.How does Aetrix verify that DG507BEW-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All DG507BEW-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DG507BEW-T1-GE3 meets industry standards.
7.What is the process for return or replacement of DG507BEW-T1-GE3?
All DG507BEW-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with DG507BEW-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DG507BEW-T1-GE3 part is unused and in its original packaging.
Return procedure for DG507BEW-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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