STMicroelectronics DIP1524-01D3

Overview

DIP1524-01D3 from STMicroelectronics is a GPS/GLONASS and 2.4 GHz RF diplexer designed to separate GPS-GLONASS received signals from RF received signals in the 2.4 GHz to 2.7 GHz band. The device uses STMicroelectronics IPD integrated passive device technology on a non-conductive glass substrate and is supplied in a 4-bump Flip-Chip package for compact RF front-end integration.

For engineers reviewing the DIP1524-01D3 datasheet, DIP1524-01D3 pinout, DIP1524-01D3 application, or DIP1524-01D3 equivalent, this RF diplexer is most relevant for multi-band front-end modules, mobile handsets, GPS/GLONASS receiver paths, WLAN / Bluetooth / LTE Band VII coexistence designs, and compact antenna-sharing circuits requiring low insertion loss, high attenuation between bands, and a very low-profile chip-scale package.

Technical Context

DIP1524-01D3 routes the WLAN / Bluetooth / LTE Band VII path through P1 to P3 over the 2400 MHz to 2700 MHz band, while the GPS/GLONASS receiver path is routed through P2 to P3 over 1573.42 MHz to 1605.89 MHz. The RF table lists P1-P3 insertion loss of 0.85 dB typical and 0.90 dB maximum in the 2.4 GHz band, with P2-P3 insertion loss of 0.60 dB typical and 0.65 dB maximum for GPS and 0.65 dB typical and 0.75 dB maximum for GLONASS.

The diplexer provides attenuation between the two RF paths, with 20 dB minimum attenuation from P1-P3 in the GPS/GLONASS band and 18 dB minimum attenuation from P2-P3 in the 2.4 GHz band. Maximum RF input power is 28 dBm on P1 and 25 dBm on P2, supporting integration into multi-band RF modules where WLAN/Bluetooth/LTE and satellite-navigation receive paths share a compact antenna-side passive network.

Key Specifications

Pinout & Package

DIP1524-01D3 is supplied in a lead-free 4-bump Flip-Chip package on glass substrate, with a very low profile below 630 µm and a compact footprint suitable for dense RF front-end layouts. The package uses a 400 µm bump pitch and supports short RF routing from antenna, GPS/GLONASS, and 2.4 GHz paths, helping reduce parasitic effects and board area in mobile RF modules.

Key Features

• GPS/GLONASS and 2.4 GHz RF diplexer for separating satellite-navigation and WLAN / Bluetooth / LTE Band VII receive paths.
• 2400 MHz to 2700 MHz f1 pass band and 1573.42 MHz to 1605.89 MHz GPS/GLONASS f2 pass band.
• Low insertion loss: up to 0.90 dB maximum on the 2.4 GHz path and up to 0.75 dB maximum on the GLONASS path.
• 20 dB minimum attenuation in the GPS/GLONASS band from P1-P3 and 18 dB minimum attenuation in the 2.4 GHz band from P2-P3.
• 28 dBm maximum input power on P1 and 25 dBm maximum input power on P2 for RF front-end module use.
• 4-bump lead-free Flip-Chip package using ST IPD technology on non-conductive glass substrate.

Applications

Equivalent & Alternatives

When evaluating DIP1524-01D3 equivalent devices, engineers should compare RF band split, insertion loss, attenuation between paths, input power rating, return loss, package pitch, antenna-port routing, and whether the design separates GPS/GLONASS from 2.4 GHz traffic or separates different WLAN frequency bands.

Compared with DIP2450-01D3, DIP1524-01D3 is optimized for GPS/GLONASS and 2.4 GHz RF coexistence rather than dual-band WLAN routing. DIP1524-01D3 vs DIP2450-01D3 selection depends mainly on the required pass bands, shared antenna architecture, RF isolation target, and whether the system includes a satellite-navigation receive path.

Quality

DIP1524-01D3 should be sourced as original STMicroelectronics components through traceable and controlled supply channels. Quality verification procedures may include Flip-Chip package inspection, RT marking validation, reel and label verification, solderability and bump-condition review, RF insertion-loss screening, attenuation and return-loss verification, port-to-port continuity checks, and incoming inspection according to RF front-end module production requirements.

Availability

DIP1524-01D3 is available at Aetrix Electronics and suitable for GPS/GLONASS receiver front ends, 2.4 GHz RF coexistence modules, multi-band mobile RF designs, and compact antenna-sharing circuits requiring stable component supply and repeatable production support.

Supply support may include scheduled delivery planning, volume procurement support, BOM continuity assistance, traceable sourcing management, and long-term availability support for OEM manufacturers, RF module builders, smartphone hardware designers, tablet platform developers, and electronics production programs.

For production deployment, confirming the 4-bump Flip-Chip package, P1 / P2 / P3 RF port mapping, GPS/GLONASS and 2.4 GHz pass-band requirements, insertion-loss budget, attenuation target, environmental specifications, and sourcing continuity helps reduce procurement risk and improve manufacturing stability.

Manufacturer

STMicroelectronics supplies integrated passive devices, RF filters, baluns, diplexers, protection components, and semiconductor solutions for mobile, wireless, industrial, and embedded applications. DIP1524-01D3 belongs to ST's IPD RF component portfolio, using glass-substrate integrated passive technology to combine compact package size with RF filtering and band-separation performance.

FAQ

What is DIP1524-01D3 used for?

DIP1524-01D3 is used to separate GPS/GLONASS receive signals from WLAN, Bluetooth, and LTE Band VII signals in the 2.4 GHz to 2.7 GHz band. It is used in multi-band RF front-end modules, mobile phones, smartphones, tablets, netbooks, and antenna-sharing RF receive designs.

What frequency bands does DIP1524-01D3 support?

DIP1524-01D3 supports a 2400 MHz to 2700 MHz f1 path for WLAN, Bluetooth, and LTE Band VII through P1-P3, and a GPS/GLONASS f2 path from 1573.42 MHz to 1605.89 MHz through P2-P3.

Is DIP1524-01D3 an active RF IC?

No. DIP1524-01D3 is an integrated passive RF diplexer made with STMicroelectronics IPD technology on a non-conductive glass substrate. It does not require a supply voltage or logic control pins; its function is defined by the passive RF network between P1, P2, P3, and GND.

What package is used by DIP1524-01D3?

DIP1524-01D3 uses a lead-free 4-bump Flip-Chip package with a compact body around 840 µm × 1360 µm and thickness below 630 µm. The package is intended for dense RF module layouts requiring short antenna and band-path routing.

What should be considered in DIP1524-01D3 pinout design?

DIP1524-01D3 pinout design should keep P1, P2, and P3 RF traces short and impedance-controlled. P1 should route to the WLAN / Bluetooth / LTE Band VII path, P2 to the GPS/GLONASS receive path, P3 to the shared antenna node, and GND to a low-inductance RF ground connection.

What is a common DIP1524-01D3 alternative?

DIP2450-01D3 is a related STMicroelectronics IPD diplexer, but it is designed for 2.4 GHz and 5 GHz WLAN separation rather than GPS/GLONASS and 2.4 GHz separation. It should only be considered when the RF band plan matches a dual-band WLAN requirement.