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Texas Instruments DM3730CBPD100
- Part No.:
- DM3730CBPD100
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 515-WFBGA, FCBGA
- Datasheet:
-
DM3730CBPD100.pdf
- Description:
- IC DGTL MEDIA PROCESSOR 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:375
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Product details
Overview
DM3730CBPD100 from Texas Instruments is a high-performance digital media processor integrating an up to 1-GHz ARM® Cortex™-A8 microprocessor core, an up to 800-MHz TMS320C64x+™ DSP core, and a POWERVR SGX™ graphics accelerator. It delivers concurrent ARM/DSP/graphics execution for portable data terminals, automotive infotainment, and medical imaging systems with support for Linux and Windows Embedded CE.
For engineers reviewing the DM3730CBPD100 datasheet, DM3730CBPD100 pinout, DM3730CBPD100 application, or DM3730CBPD100 equivalent, key selection criteria include its 515-pin s-PBGA package (CBP suffix), 45-nm process node, SmartReflex™ dynamic voltage/frequency scaling, dual-core heterogeneous architecture, and integrated IVA2.2 video acceleration subsystem.
Technical Context
The DM3730CBPD100 implements a hierarchical L3/L4 interconnect fabric enabling concurrent access by MPU, DSP, IVA2.2, and peripherals. Its ARM Cortex-A8 core features 32KB L1 instruction and data caches, 256KB L2 cache, TrustZone® security, and NEON™ SIMD coprocessor - all operating at up to 1 GHz with adaptive core voltage (0.9–1.2 V).
The C64x+ DSP subsystem includes 32KB/80KB L1P/L1D RAM/cache, 64KB L2 unified cache, EDMA controller with 128 channels, and hardware accelerators for video encode/decode. The POWERVR SGX graphics engine supports OpenGLES 1.1/2.0 and OpenVG 1.0 with tile-based rendering delivering up to 20 MPoly/sec.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 + TMS320C64x+ DSP + POWERVR SGX GPU - enables true heterogeneous parallel processing for media pipelines |
| Max CPU Frequency | 1 GHz - provides real-time OS responsiveness and application throughput for embedded Linux workloads |
| Graphics Engine | POWERVR SGX530 - delivers OpenGL ES 2.0 compliance and hardware-accelerated 3D UI rendering |
| Video Acceleration | IVA2.2 subsystem - offloads H.264/MPEG-4 encode/decode, reducing ARM load by >80% in streaming applications |
| Memory Interface | SDRAM Controller (SDRC) + GPMC - supports LPDDR/DDR2 SDRAM and NAND/NOR flash with ECC for boot reliability |
| Process Technology | 45-nm CMOS - enables low-power operation with SmartReflex AVS for dynamic voltage scaling across OPPs |
| I/O Count | Up to 188 GPIO pins - supports flexible peripheral expansion including camera, display, USB, and audio interfaces |
| Package Type | 515-pin s-PBGA (CBP), 0.5 mm top / 0.4 mm bottom ball pitch - designed for high-density PCB layouts with thermal pad grounding |
Pinout & Package
The DM3730CBPD100 is housed in a 515-ball plastic ball grid array (s-PBGA) package with CBP suffix, featuring 0.5-mm ball pitch on top and 0.4-mm on bottom, optimized for thermal dissipation and signal integrity in compact industrial designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| vdd_mpu_iva | MPU & IVA Power Supply | Dedicated 0.9–1.2-V adaptive supply rail for ARM core and video accelerator - requires independent low-noise regulation |
| sys_xtalin / sys_xtalout | Crystal Oscillator Interface | Drives internal PLLs; supports 26-MHz fundamental-mode crystal for system clock generation with ±20 ppm stability |
| sdrc_dqs0–sdrc_dqs3 | SDRAM Data Strobe | Differential DQS pairs for DDR timing alignment - critical for reliable 133-MHz SDRAM interface operation |
| dss_pclk / dss_hsync / dss_vsync | Display Subsystem Timing | Pixel clock and sync signals for parallel RGB/YUV LCD or TV output - supports up to WXGA resolution |
| cam_pclk / cam_hs / cam_vs | Camera Interface | Parallel sensor interface supporting BT.656 8-/10-bit YCbCr 4:2:2 - enables direct connection to CMOS/CCD imagers |
| hsusb0_data0–hsusb0_data7 | High-Speed USB OTG PHY | 8-bit ULPI interface for 480-Mbps USB 2.0 operation - eliminates external transceiver for cost-sensitive designs |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Core Integration | ARM Cortex-A8 + C64x+ DSP + SGX GPU on single die - eliminates inter-chip latency and reduces board area vs. multi-chip solutions |
| IVA2.2 Video Acceleration | Hardware decode of H.264 [email protected], MPEG-4 ASP@L5, VC-1 AP@L3 - enables 720p30 playback with <5% ARM utilization |
| SmartReflex AVS | Real-time adaptive voltage scaling across OPP0–OPP5 - reduces dynamic power by up to 40% versus fixed-voltage operation |
| On-Chip Memory Architecture | 32KB L1P + 80KB L1D + 256KB L2 cache + 64KB SRAM - minimizes external memory bandwidth demand for real-time tasks |
| Peripheral Flexibility | 5 McBSP ports, 4 McSPI, 3 MMC/SDIO, 4 UARTs, HDQ/1-Wire - supports simultaneous camera, display, storage, and sensor connectivity |
| Security Foundation | ARM TrustZone + secure watchdog + ROM-based boot - enables secure boot chain and isolated execution environments for certified applications |
Applications
| Portable Data Terminal | Automotive Infotainment |
|---|---|
Use Scenario: Rugged handheld device for warehouse inventory management with barcode scanning, RFID, and wireless reporting. IC Role / Device Role / Timing Role: Central application processor executing Linux OS, managing camera ISP pipeline, and driving high-resolution touchscreen via DSS. Use Value: Concurrent ARM/DSP execution enables real-time image decoding while maintaining responsive GUI - eliminating need for separate vision co-processor. | Use Scenario: In-dash navigation and multimedia system with rear-seat video playback and voice-controlled UI. IC Role / Device Role / Timing Role: Main SoC handling navigation stack, HDMI video output, Bluetooth audio streaming, and CAN bus gateway functions. Use Value: Integrated IVA2.2 and SGX GPU enable smooth 720p video playback and OpenGL-based 3D map rendering without external video decoder or GPU. |
| Medical Imaging Console | Industrial Human-Machine Interface |
Use Scenario: Portable ultrasound or endoscopy display unit requiring real-time image enhancement and DICOM export. IC Role / Device Role / Timing Role: Image signal processor and display controller interfacing directly to CMOS sensor and LVDS panel with minimal latency. Use Value: On-chip camera ISP and dual-layer display processor support temporal dithering and gamma correction - meeting clinical grayscale fidelity requirements. | Use Scenario: Factory-floor HMI panel with multitouch GUI, PLC communication, and local data logging. IC Role / Device Role / Timing Role: Real-time Linux host running Qt-based UI, communicating via CAN/Ethernet, and managing SD card storage. Use Value: Dual-core architecture isolates UI rendering (GPU) from deterministic control tasks (ARM), ensuring jitter-free response to operator input. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital media processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DM3725CBPD100 | Omits POWERVR SGX graphics accelerator; identical ARM/DSP cores and IVA2.2 video engine | Suitable where 3D graphics are unnecessary but full video acceleration and ARM performance are required | Select when cost reduction is prioritized over OpenGL ES rendering capability |
| AM3715BZC | Same silicon die as DM3730 but with different temperature grade (industrial -40°C to +85°C) and qualification | Required for extended-temperature deployments in automotive or outdoor industrial equipment | Choose for applications demanding industrial-grade thermal reliability and TI's extended product lifecycle support |
Compared with DM3725CBPD100 and AM3715BZC, the DM3730CBPD100 uniquely combines full-featured SGX530 graphics, 1-GHz ARM performance, and IVA2.2 video acceleration in a commercial-grade package - making it optimal for cost-sensitive consumer and prosumer media devices requiring rich UI and HD video.
Availability
DM3730CBPD100 is available at Aetrix Electronics and suitable for portable data terminals, automotive infotainment systems, and medical imaging consoles requiring stable component supply and long-term design-in support.
Supply support for DM3730CBPD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with leadership in industrial, automotive, and communications markets.
The DM3730CBPD100 belongs to TI's OMAP™3 family of digital media processors, engineered to deliver balanced ARM/DSP/GPU performance for portable and embedded multimedia applications with low-power operation.
FAQ
What is the maximum operating frequency of the ARM Cortex-A8 core in the DM3730CBPD100?
The DM3730CBPD100 supports an ARM Cortex-A8 core operating at up to 1 GHz under OPP5 conditions. This frequency is achievable with SmartReflex-enabled adaptive core voltage (0.9–1.2 V) and proper thermal management. Lower OPPs (e.g., OPP3 at 800 MHz) provide reduced power consumption while maintaining full feature compatibility. The DM3730CBPD100 datasheet specifies timing margins and voltage requirements for each OPP level.
Does the DM3730CBPD100 include hardware video acceleration, and what codecs does it support?
Yes, the DM3730CBPD100 integrates the IVA2.2 video acceleration subsystem, which provides dedicated hardware for encoding and decoding multiple video standards. Supported codecs include H.264 High Profile up to Level 4.0, MPEG-4 Advanced Simple Profile up to Level 5, and VC-1 Advanced Profile up to Level 3. This offloads video processing from the ARM core, enabling 720p30 decode with less than 5% CPU utilization - a key capability documented in the DM3730CBPD100 technical reference manual.
What package type and ball pitch does the DM3730CBPD100 use?
The DM3730CBPD100 uses a 515-ball s-PBGA package with CBP suffix, featuring 0.5-mm ball pitch on the top side and 0.4-mm ball pitch on the bottom side. This asymmetric pitch design optimizes solder joint reliability and thermal conduction. The package includes a thermal pad on the underside for enhanced heat dissipation - a mechanical specification confirmed in the DM3730CBPD100 datasheet revision SPRS685D.
Can the DM3730CBPD100 support both camera input and display output simultaneously?
Yes, the DM3730CBPD100 supports concurrent camera capture and display output through dedicated hardware blocks. Its camera interface handles BT.656/BT.601 8-/10-bit YCbCr 4:2:2 streams via parallel pins (cam_pclk, cam_hs, cam_vs), while the Display Subsystem (DSS) drives RGB, YUV, or LCD panels using dss_pclk, dss_hsync, and dss_vsync. The DM3730CBPD100's internal memory bandwidth and L3 interconnect ensure zero-copy data flow between ISP and DSS - verified in TI's DM3730CBPD100 platform reference designs.
What is the role of SmartReflex technology in the DM3730CBPD100?
SmartReflex technology in the DM3730CBPD100 enables dynamic voltage and frequency scaling (DVFS) by continuously monitoring process, voltage, and temperature (PVT) variations. It adjusts the ARM and IVA supply voltages in real time across five Operating Performance Points (OPPs), reducing dynamic power consumption by up to 40% compared to fixed-voltage operation. This adaptive control is implemented in hardware and requires no software intervention - a feature explicitly defined for the DM3730CBPD100 in TI's SmartReflex documentation and datasheet sections.
DM3730CBPD100 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320DM37x, DaVinci™
- Package/Case:
- 515-WFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Digital Media System-on-Chip (DMSoC)
- Interface:
- 1-Wire®, EBI/EMI, I2C, McBSP, McSPI, MMC/SD, UART, USB, USB OTG
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (32kB)
- On-Chip RAM:
- 384kB
- Voltage - I/O:
- 1.80V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
DM3730CBPD100 FAQ
1.How can I place an order for DM3730CBPD100 through Aetrix?
Please submit a Request for Quotation (RFQ) for DM3730CBPD100 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DM3730CBPD100 reliable?
The price and inventory of DM3730CBPD100 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DM3730CBPD100 is usually 5 days.
3.What payment methods are accepted for DM3730CBPD100?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DM3730CBPD100 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DM3730CBPD100?
DM3730CBPD100 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DM3730CBPD100 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DM3730CBPD100?
For technical support, including DM3730CBPD100 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DM3730CBPD100 requirements.
6.How does Aetrix verify that DM3730CBPD100 is sourced from the original manufacturer or authorized distributors?
All DM3730CBPD100 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DM3730CBPD100 meets industry standards.
7.What is the process for return or replacement of DM3730CBPD100?
All DM3730CBPD100 units undergo pre-shipment inspection (PSI). If there is an issue with DM3730CBPD100, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DM3730CBPD100 part is unused and in its original packaging.
Return procedure for DM3730CBPD100:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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