Diodes Incorporated DML1009LDS-13

Overview

DML1009LDS-13 from Diodes Incorporated is a single-channel smart load switch featuring an integrated N-channel MOSFET, 5 mΩ R_DS(ON) at 5 V V_BIAS, 10 A continuous current rating, and 3.2–5.5 V bias supply range. It enables power rail control in portable computing and SSD applications with fast 10 µs turn-on rise time and integrated quick output discharge.

For engineers reviewing the DML1009LDS-13 datasheet, DML1009LDS-13 pinout, DML1009LDS-13 application, or DML1009LDS-13 equivalent, key selection criteria include input voltage compatibility (0.8 V to V_BIAS−1.5 V), low quiescent current (35 µA), thermal resistance (θ_JA = 60 °C/W), and V-DFN3030-8 (Type R) package constraints.

Technical Context

The DML1009LDS-13 implements a logic-controlled N-channel MOSFET load switch with active high enable (ON pin threshold: 1.2 V min high, 0.5 V max low). Its internal architecture requires separate bias (V_BIAS) and input (IN) rails, where optimal R_DS(ON) is achieved only when VIN ≤ V_BIAS − 1.5 V.

It integrates a 200 Ω pull-down resistor on the OUT pin for automatic discharge when disabled, supports TTL/CMOS-compatible control, and operates across −40 °C to +85 °C ambient with junction temperature limited to +150 °C. Thermal performance relies on PCB copper area and ground plane due to its 8 °C/W θ_JC.

Key Specifications

Pinout & Package

V-DFN3030-8 (Type R) thermally enhanced 3.0 mm × 3.0 mm × 0.8 mm package with exposed EPAD for heatsinking. Pin 1 marked via laser etch; moisture sensitivity level 1 per J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar load switch applications.

Compared with TPS22965DSGR and AP22653AW-7, the DML1009LDS-13 uniquely delivers 10 A capability with integrated 200 Ω discharge and 5 mΩ R_DS(ON) in a 3×3 mm footprint-making it the only choice for compact, high-current, fast-discharge applications like SSD power gating and portable display subsystems.

Availability

DML1009LDS-13 is available at Aetrix Electronics and suitable for portable computing, SSD power management, and telecom peripheral enable applications requiring stable component supply, consistent lead-free compliance, and long-term industrial availability.

Supply support for DML1009LDS-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.

The DML1009LDS-13 belongs to Diodes' Smart Load Switch product line, engineered specifically for high-efficiency, space-constrained power rail control in portable and storage systems where low R_DS(ON), fast switching, and integrated discharge are critical.

FAQ

What is the minimum V_BIAS required for reliable operation at 1.05 V input?

The DML1009LDS-13 requires V_BIAS ≥ VIN + 1.5 V for guaranteed low R_DS(ON). At VIN = 1.05 V, minimum V_BIAS is 2.55 V-but datasheet specifies absolute minimum V_BIAS = 3.2 V. Therefore, 3.2 V is the lowest valid V_BIAS, ensuring both functional enablement and specified 6 mΩ R_DS(ON) at 3.3 V bias.

Can the ON pin be driven directly from a 1.8 V GPIO without level shifting?

Yes. The ON pin has TTL/CMOS-compatible thresholds: V_ONH = 1.2 V (min), V_ONL = 0.5 V (max). A 1.8 V GPIO output meets the high-level requirement with 0.6 V noise margin and exceeds the low-level threshold by >1.3 V, enabling direct interfacing without external level translation.

How does the integrated output discharge resistor affect system behavior during hot-plug?

The 200 Ω internal pull-down discharges the OUT node to GND within ~100 µs for a 100 nF load. During hot-plug, this prevents floating outputs, eliminates latch-up risk in downstream ICs, and ensures clean reset sequencing-removing need for external resistors and reducing PCB footprint and assembly cost.

Is thermal derating required when operating at 10 A continuous current?

Yes. At 10 A, power dissipation is ~500 mW (10² × 0.005 Ω). With θ_JA = 60 °C/W and 25 °C ambient, junction temperature rises ~30 °C-well below +150 °C limit. However, sustained 10 A requires ≥1 in² 2-oz copper pour under EPAD; derating to 7 A is recommended above +60 °C ambient without enhanced cooling.