Diodes Incorporated DML3009LDC-7

Overview

DML3009LDC from Diodes Incorporated is a single-channel smart load switch integrating an N-channel MOSFET with 4.8 mΩ typical R_ON at 5V V_IN, adjustable slew-rate-controlled soft-start, power-good (PG) signaling, and comprehensive fault protection including thermal shutdown, VIN undervoltage lockout, and short-circuit detection. It operates across 0.5V–13.5V input voltage and supports up to 15A DC load current in portable power domain switching.

For engineers reviewing the DML3009LDC datasheet, DML3009LDC pinout, DML3009LDC application, or DML3009LDC equivalent, this device is selected for hot-swap sequencing, low-leakage standby control, inrush-limited power-up of high-capacitance loads, and system-level power rail monitoring where ultra-low on-resistance and integrated bleed discharge are critical.

Technical Context

The DML3009LDC implements a charge-pump-based gate driver enabling full enhancement of its internal N-channel MOSFET across 0.5V–13.5V input range while maintaining sub-1 µA shutdown supply current. Its SR pin accepts an external capacitor (0–4.7 nF) to linearly adjust output rise time from 142 µs to 2040 µs, directly controlling inrush peak current into downstream capacitance.

Power-good signaling uses an open-drain PG output synchronized to MOSFET gate charge completion, with turn-on delay tightly coupled to slew rate (t_{PG_ON} ≈ t_R + 800 µs). Fault protection is hierarchical: short-circuit detection monitors V_IN–V_BLEED differential voltage ≥100–500 mV depending on V_IN, triggering immediate latch-off and automatic bleed activation.

Key Specifications

Pinout & Package

Package: V-DFN3030-12 (Type B), 3.0 mm × 3.0 mm × 0.8 mm, exposed thermal pad, RoHS-compliant NiPdAu-plated copper leadframe, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar smart load switch applications.

Compared with TPS22992DRLR and RT9759GJ5, the DML3009LDC uniquely combines 4.8 mΩ R_ON, fully adjustable slew rate, integrated bleed, and PG signaling in a 3×3 mm package-enabling compact, self-contained power sequencing without external components or timing compromises.

Availability

DML3009LDC is available at Aetrix Electronics and suitable for USB-C power delivery ports, DDR memory rail switching, medical imaging sensor modules, and industrial PLC I/O expansion slots requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for DML3009LDC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal devices, with emphasis on power management, signal integrity, and connectivity solutions for industrial, computing, and consumer markets.

The DML3009LDC belongs to Diodes' Smart Load Switch product line, engineered specifically for high-current, low-R_ON, and feature-rich power domain control in space-constrained portable and infrastructure equipment.

FAQ

What is the maximum allowable external resistor between BLEED and VOUT?

The BLEED pin must connect to VOUT either directly or through an external resistor not exceeding 1 kΩ. This limit ensures short-circuit protection remains functional, as the internal comparator relies on accurate V_IN–V_BLEED differential measurement. Exceeding 1 kΩ degrades fault detection speed and may cause false negatives during output shorts.

Does the DML3009LDC require an external pull-up on the PG pin?

Yes - the PG pin is an active-high open-drain output and requires an external pull-up resistor ≥1 kΩ to a compatible voltage source (e.g., VTERM = 1.8V–5.5V). If unused, PG must be tied to GND; leaving it floating violates the absolute maximum rating and risks undefined logic states during power transitions.

How does thermal shutdown interact with the EN pin state?

Thermal shutdown is disabled when EN = 0V, reducing standby current. When EN is asserted and junction temperature exceeds 145°C, the MOSFET turns off immediately and the internal bleed activates. Recovery occurs only after temperature falls by ≥20°C hysteresis and EN remains high - then normal slew-controlled turn-on resumes.

Can the SR pin be left floating to achieve minimum rise time?

Yes - leaving SR unconnected (floating) yields the fastest rise time (142 µs at V_IN = 1.8V), as confirmed in Table 1 of the datasheet. However, this configuration eliminates inrush control; designers must verify downstream capacitance and supply droop margins meet system requirements before omitting the SR capacitor.