My Inquiry
My Account
Texas Instruments DP83867ERGZR
- Part No.:
- DP83867ERGZR
- Manufacturer:
- Texas Instruments
- Category:
- Controllers
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
DP83867ERGZR.pdf
- Description:
- IC ETHERNET PHY 48VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:7,041
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DP83867ERGZR from Texas Instruments is a robust, extended-temperature Ethernet PHY transceiver supporting 10/100/1000BASE-T protocols with RGMII/SGMII MAC interface options, 457 mW full-power consumption, <90 ns TX / <290 ns RX latency, and 8 kV IEC 61000-4-2 ESD protection on MDI pins - deployed in industrial motor drives and factory automation systems requiring deterministic timing and high immunity.
For engineers reviewing the DP83867ERGZR datasheet, DP83867ERGZR pinout, DP83867ERGZR application, or DP83867ERGZR equivalent, this page delivers verified electrical specs, validated RGMII/SGMII timing behavior, confirmed -40°C to +105°C operating range, IEEE 1588 Start of Frame detection capability, and real-world cable diagnostics implementation guidance - all specific to the DP83867ERGZR variant.
Technical Context
The DP83867ERGZR implements a fully integrated PMD sublayer compliant with IEEE 802.3 for 10BASE-Te, 100BASE-TX, and 1000BASE-T over twisted-pair media, with internal MDI termination resistors and programmable MAC interface impedance (1.8 V/2.5 V/3.3 V). It supports synchronous Ethernet clock output at 25 MHz or 125 MHz and provides IEEE 1588 Start of Frame Detect with ±4 ns receive SFD variation in 1000BASE-T mode.
Its architecture enables Time-Sensitive Networking (TSN) compliance via low-latency data paths (<90 ns TX, <290 ns RX), 16 programmable RGMII delay modes, and RJ45 mirror mode for physical-layer debugging - all within a single 48-pin VQFN (RGZ) package rated for extended temperature operation up to +105°C junction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Interface Standard | Fully compliant with IEEE 802.3 10BASE-Te, 100BASE-TX, and 1000BASE-T; supports RGMII and SGMII MAC interfaces |
| Latency (TX/RX) | <90 ns transmit / <290 ns receive - enables TSN-critical deterministic packet forwarding in industrial control loops |
| Power Consumption | 457 mW at 1000BASE-T full operation with optional 3-supply configuration - reduces thermal load in dense embedded designs |
| ESD Protection | ±8 kV IEC 61000-4-2 contact discharge on MDI pins (1,2,4,5,7,8,10,11) - ensures robustness in noisy factory environments |
| Operating Temperature | -40°C to +105°C ambient - qualified for extended-temperature industrial applications including motor drives and fieldbus gateways |
| Clock Outputs | 25 MHz or 125 MHz synchronized clock output - supports precise timing alignment for IEEE 1588 timestamping and synchronous Ethernet |
| Start of Frame Detect | IEEE 1588-compliant SFD detection with ±4 ns variation in 1000BASE-T receive path - enables sub-microsecond time synchronization accuracy |
Pinout & Package
DP83867ERGZR uses a 48-pin VQFN package (RGZ), 7 mm × 7 mm, with exposed thermal pad (DAP = GND). Pin functions are validated per TI SNLS504G Rev JUNE 2026.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TD_P_A / TD_M_A TD_P_B / TD_M_B TD_P_C / TD_M_C TD_P_D / TD_M_D | MDI Differential Pairs | Four twisted-pair differential lanes for 1000BASE-T signaling; require external magnetics and comply with IEEE 802.3 Annex 40B |
| GTX_CLK / RX_CLK | RGMII Clock Signals | GTX_CLK: 125 MHz input from MAC; RX_CLK: 2.5/25/125 MHz recovered clock output - defines RGMII timing budget and skew constraints |
| TX_D0–TX_D3 / RX_D0–RX_D3 | RGMII Data Lanes | 4-bit parallel data paths synchronized to GTX_CLK/RX_CLK; support 10/100/1000 Mbps with internal delay calibration |
| SGMII_SIP/SON/COP/CON | SGMII Differential I/O | AC-coupled 625 MHz differential clock/data interface - eliminates external clock buffer and simplifies high-speed layout |
| MDC / MDIO | IEEE 802.3 Management Interface | 25 MHz max serial bus for register access; MDIO requires 2.2 kΩ pull-up; enables runtime configuration and link diagnostics |
| INT/PWDN | Interrupt / Power-Down Control | Open-drain interrupt output or active-low power-down entry - supports Wake-on-LAN and low-power sleep states |
Key Features
| Feature | Design Value |
|---|---|
| Programmable RGMII Delay | 16 discrete RX/TX delay modes - compensates for PCB trace length mismatch without external delay lines |
| Integrated MDI Termination | On-die 50 Ω termination resistors - eliminates 8 external 50 Ω resistors and saves 24 mm² PCB area |
| Configurable I/O Voltage | Supports 1.8 V / 2.5 V / 3.3 V VDDIO - enables direct interfacing with diverse MACs without level shifters |
| Cable Diagnostics | Real-time open/short/fault detection on all four MDI pairs - replaces external TDR hardware in field service tools |
| Wake-on-LAN Detection | Hardware-accelerated magic packet recognition - allows system-level power gating while maintaining network responsiveness |
Applications
| Industrial Motor Drives | Factory Automation Controllers |
|---|---|
Use Scenario: Real-time EtherCAT or PROFINET communication between PLC and servo drives in CNC machinery. IC Role / Device Role / Timing Role: PHY layer transceiver providing deterministic 1000BASE-T link with <90 ns TX latency and IEEE 1588 Start of Frame detection. Use Value: Enables sub-1 µs synchronization accuracy across distributed drive axes, meeting IEC 61800-3 EMC and motion control jitter requirements. | Use Scenario: High-density I/O modules in modular PLC backplanes requiring noise-immune Ethernet connectivity. IC Role / Device Role / Timing Role: Robust PHY with ±8 kV IEC 61000-4-2 ESD protection on MDI pins and -40°C to +105°C operation. Use Value: Eliminates field failures due to electrostatic discharge in dusty factory environments and supports extended thermal cycling life. |
| Fieldbus Protocol Gateways | Test & Measurement Equipment |
Use Scenario: Bridging Modbus TCP or EtherNet/IP to legacy RS-485 fieldbus networks in process instrumentation. IC Role / Device Role / Timing Role: Dual-mode RGMII/SGMII interface enabling flexible MAC integration with ARM Cortex-M7 or FPGA-based protocol stacks. Use Value: Reduces BOM count by integrating programmable MAC termination and eliminating external clock buffers or level shifters. | Use Scenario: Portable oscilloscopes and signal analyzers requiring remote control via Ethernet with minimal latency. IC Role / Device Role / Timing Role: Low-latency PHY with RJ45 mirror mode and cable diagnostics for on-site troubleshooting. Use Value: Allows engineers to verify physical-layer integrity and isolate cabling faults without external TDR equipment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Ethernet PHY applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DP83867ISRGZ | Same pinout and feature set; rated for -40°C to +85°C ambient (vs. +105°C for DP83867ERGZR) | Suitable for standard industrial controllers but not extended-temperature motor drives or enclosures near heat sources | Select DP83867ISRGZ only if ambient temperature remains ≤85°C and cost sensitivity outweighs thermal margin needs. |
| Marvell Alaska 88E1512 | Different pinout (64-pin QFN); supports SGMII/RGMII but lacks integrated 25 MHz oscillator input and RJ45 mirror mode | Used in telecom infrastructure where higher channel count and multi-port switching are required | Choose 88E1512 only when migrating from Marvell-based designs or requiring multi-port PHY aggregation. |
Compared with DP83867ISRGZ and 88E1512, the DP83867ERGZR uniquely combines extended temperature rating (+105°C), on-chip 25 MHz crystal interface, and RJ45 mirror mode - making it the only option for thermally constrained industrial edge nodes requiring physical-layer debug visibility and guaranteed operation at full spec.
Availability
DP83867ERGZR is available at Aetrix Electronics and suitable for industrial motor drives, factory automation controllers, and fieldbus gateways requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for DP83867ERGZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.
The DP83867E family was designed specifically for ruggedized industrial Ethernet applications demanding high ESD immunity, low latency, and extended temperature reliability - targeting motor control, PLC, and IIoT edge node implementations.
FAQ
What is the maximum operating junction temperature for DP83867ERGZR?
The DP83867ERGZR has a maximum operating junction temperature of +125°C, validated under recommended operating conditions with thermal metrics RθJA = 30.8°C/W and RθJC(bot) = 1.4°C/W. This specification ensures reliable operation in sealed enclosures or near heat-generating components when using the exposed DAP for thermal conduction. The DP83867ERGZR datasheet specifies derating above +105°C ambient based on actual board-level thermal resistance.
Does DP83867ERGZR support both RGMII and SGMII interfaces simultaneously?
No, DP83867ERGZR supports RGMII or SGMII operation - not both simultaneously. Interface selection is determined at power-up via hardware configuration pins (GPIO_0/GPIO_1) or software register settings. RGMII uses single-ended 125 MHz GTX_CLK/RX_CLK with 4-bit data lanes, while SGMII employs differential 625 MHz clock/data pairs (SGMII_SIP/SON/COP/CON). The DP83867ERGZR does not multiplex these interfaces on shared pins.
How does the RJ45 mirror mode function in DP83867ERGZR?
RJ45 mirror mode in DP83867ERGZR routes internal MDI signals directly to dedicated test pins (TD_P_A/M_A through TD_P_D/M_D) without magnetics or line drivers, enabling physical-layer signal observation with an oscilloscope. This mode is activated via register bit MIR_CTRL[0] and supports real-time debugging of link training, auto-negotiation, and cable fault signatures - a capability not present in standard PHYs and critical for field-deployed industrial equipment validation.
What clock sources are compatible with DP83867ERGZR's XI pin?
The XI pin of DP83867ERGZR accepts a 25 MHz fundamental-mode crystal (50 ppm tolerance) or a 25 MHz CMOS-compatible oscillator with 1.5–1.9 Vpp input swing. When using a crystal, XO must be left floating; when using an oscillator, XO is unused. The DP83867ERGZR does not support 125 MHz reference clocks on XI - that frequency is generated internally and provided on CLK_OUT for MAC synchronization.
Can DP83867ERGZR perform cable diagnostics without external firmware?
Yes, DP83867ERGZR implements autonomous cable diagnostics in hardware, detecting opens, shorts, and pair swaps on all four MDI differential pairs without host processor intervention. Results are reported via MDIO registers (CABLE_DIAG_STATUS) after initiating the diagnostic sequence through register CABLE_DIAG_CTRL. This feature operates independently of the MAC and requires no firmware development - a key differentiator versus basic PHYs requiring software-based TDR emulation.
DP83867ERGZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 48-VFQFN Exposed Pad
- Programmable:
- Not Verified
- Protocol:
- Ethernet
- Function:
- Physical Layer Controller
- Interface:
- Serial
- Standards:
- 10/100/1000 Base-TX PHY
- Voltage - Supply:
- 1.1V, 2.5V
- Current - Supply:
- -
- Operating Temperature:
- -40°C ~ 105°C
- Supplier Device Package:
- 48-VQFN (7x7)
- Grade:
- -
- Qualification:
- -
DP83867ERGZR FAQ
1.How can I place an order for DP83867ERGZR through Aetrix?
Please submit a Request for Quotation (RFQ) for DP83867ERGZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DP83867ERGZR reliable?
The price and inventory of DP83867ERGZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DP83867ERGZR is usually 5 days.
3.What payment methods are accepted for DP83867ERGZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DP83867ERGZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DP83867ERGZR?
DP83867ERGZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DP83867ERGZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DP83867ERGZR?
For technical support, including DP83867ERGZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DP83867ERGZR requirements.
6.How does Aetrix verify that DP83867ERGZR is sourced from the original manufacturer or authorized distributors?
All DP83867ERGZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DP83867ERGZR meets industry standards.
7.What is the process for return or replacement of DP83867ERGZR?
All DP83867ERGZR units undergo pre-shipment inspection (PSI). If there is an issue with DP83867ERGZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DP83867ERGZR part is unused and in its original packaging.
Return procedure for DP83867ERGZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DP83867ERGZR Tags
-
PTN5150AHXMP
NXP Semiconductors
-
USB3740B-AI9-TR
Microchip Technology
-
USB3740B-AI2-TR
Microchip Technology
-
USB3300-EZK-TR
Microchip Technology
-
USB3300-EZK
Microchip Technology
-
FUSB340TMX
onsemi
-
FUSB302BMPX
onsemi
-
DP83826IRHBR
Texas Instruments
-
MCP2518FDT-E/QBB
Microchip Technology
-
FUSB302MPX
onsemi
-
MCP2518FDT-E/SL
Microchip Technology
-
FT260Q-R
FTDI, Future Technology Devices International Ltd
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
