Diodes Incorporated DPS1113FIA-13

Overview

DPS1113FIA-13 from Diodes Incorporated is a 1-channel USB Power Delivery (USB PD) compliant power switch with fast role-swap support, integrated adjustable current limit (up to 3.5 A), input overvoltage protection (6 V threshold), and 2 µs short-circuit response time. It operates from 4.5 V to 5.5 V and delivers robust hot-swap protection in docking stations and USB-C hubs.

For engineers reviewing the DPS1113FIA-13 datasheet, DPS1113FIA-13 pinout, DPS1113FIA-13 application, or DPS1113FIA-13 equivalent, key selection considerations include its programmable DV/DT ramp control, dual port-discharge capability (IN/OUT), fault-blanking timing (7 ms), and compliance with USB PD 3.0 V1.0a Fast Role Swap requirements.

Technical Context

The DPS1113 implements a single N-channel MOSFET power switch with R_DS(ON) = 29–33 mΩ and integrated analog control circuitry for real-time monitoring of VIN–VOUT differential (reverse-voltage protection), output current (via IMON), and input voltage (OVP). Its FRS pin triggers a hardware-defined sequence that meets USB PD 3.0's ≤60 µs turn-on delay under role-swap conditions.

It features independent discharge paths controlled by DISC1/DISC2 pins (105 Ω typical discharge resistance), programmable ILIM via external resistor (27–200 kΩ sets 0.5–3.5 A), and VLIM-based OVP threshold (0.1 × R_VLIM + 0.5 V). Thermal shutdown activates at +155 °C with +20 °C hysteresis, and fault reporting occurs only after 7 ms deglitching on FAULTB.

Key Specifications

Pinout & Package

Housed in a thermally enhanced V-QFN4040-17 package (4.0 mm × 4.0 mm × 0.85 mm, exposed thermal pad), the DPS1113FIA-13 uses a 17-pin layout with three IN pins (1–3), three OUT pins (15–17), and dedicated analog control terminals for precision system integration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB PD power switch applications.

Compared with TPS25750RWER and RTQ2132BGQW, the DPS1113FIA-13 uniquely combines USB PD 3.0 FRS hardware acceleration, dual independent port discharge, and calibrated IMON output-enabling full compliance in minimal footprint without firmware or external components.

Availability

DPS1113FIA-13 is available at Aetrix Electronics and suitable for USB-C docking stations, universal multimedia hubs, and notebook power interface modules requiring stable component supply, long-term lifecycle support, and USB PD 3.0 compliance.

Supply support for DPS1113FIA-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and connectivity applications.

The DPS1113 belongs to Diodes' USB Power Delivery and Hot-Swap Power Switch product line, engineered specifically for robust, standards-compliant 5 V power routing in computing and consumer electronics.

FAQ

What is the minimum recommended CDV/DT capacitor value for stable 5 V ramp-up?

A 1 nF capacitor on the DV/DT pin yields a typical 0.83 ms ramp time from 0 to 5 V, satisfying USB PD inrush limits for 100 µF output capacitance. Values below 0.5 nF risk excessive dV/dt and false OCP triggering; Diodes recommends 1–6.8 nF for most designs.

How does the DPS1113 handle reverse-voltage conditions during cable hot-plug?

It monitors VIN–VOUT continuously and disables the MOSFET within 2 µs if the differential falls below −30 mV. Recovery requires VIN–VOUT > 0 mV and re-enabling via EN or FRS-preventing backfeed into host systems during misinsertion.

Can the FAULTB pin drive a microcontroller GPIO directly?

Yes-FAULTB is an open-drain output rated for 10 mA sink. A 10 kΩ pull-up to 3.3 V yields ~0.3 V low-level voltage, compatible with standard CMOS inputs. No level-shifting is required for 3.3 V or 5 V MCUs.

Is the exposed thermal pad (Pin 18) electrically connected to any internal node?

No-the exposed pad is solely for thermal conduction and must be soldered to a PCB copper pour. It is not connected to GND, IN, or any other signal; connecting it to any net risks shorting internal circuitry or degrading thermal performance.