Texas Instruments DRA726APGABCQ1

Overview

DRA726APGABCQ1 from Texas Instruments is an AEC-Q100 qualified automotive infotainment applications processor featuring a single Arm® Cortex®-A15 CPU core, one C66x VLIW DSP core, 512KB on-chip L3 RAM with ECC, dual Arm® Cortex®-M4 IPUs, and a PowerVR™ SGX544 3D GPU. It supports Full-HD video (1920×1080p @ 60 fps), HDMI 1.4a/DVI 1.0 output, and DDR3-1333 memory interface - deployed in digital cockpit systems requiring real-time multimedia processing and secure boot.

For engineers reviewing the DRA726APGABCQ1 datasheet, DRA726APGABCQ1 pinout, DRA726APGABCQ1 application, or DRA726APGABCQ1 equivalent, key selection criteria include silicon revision 2.1 security features (customer-programmable keys, secure ROM/Boot), PCIe Gen2 dual-lane support, dual DCAN 2.0B interfaces, and 215 GPIOs for HMI expansion - all within a 23 mm × 23 mm, 0.8-mm pitch, 760-pin FCBGA (ABC) package.

Technical Context

The DRA726APGABCQ1 implements a heterogeneous multi-core architecture: the Cortex-A15 handles OS and control tasks while the C66x DSP offloads compute-intensive video/audio algorithms; dual Cortex-M4 IPUs manage camera preprocessing and real-time image pipelines independently. Its IVA-HD subsystem integrates dedicated hardware accelerators for video encode/decode, and the display subsystem includes three independent video pipelines with HDMI encoder and LCD controllers.

Power and security are tightly integrated: on-die power management units support multiple OPPs (Operating Performance Points), and silicon revision 2.1 adds customer-programmable secure keys, JTAG lock, and hardware crypto accelerators with DMA. The device uses 28-nm CMOS process and meets AEC-Q100 Grade 2 (-40°C to +105°C) requirements for automotive cabin electronics.

Key Specifications

Pinout & Package

Package: 760-ball Fine-Pitch Ceramic Ball Grid Array (FCBGA), 23.0 mm × 23.0 mm body size, 0.8-mm ball pitch, ABC suffix per TI nomenclature. Pinout defined in SPRS956H Section 4.1 (Ball Map) and Table 4-2 (Ball Characteristics); unused balls include AF7, AF10, AE4, AB26, and others explicitly listed as non-pinned or reserved (e.g., A27, Y5).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar infotainment processor applications.

Compared with DRA725APGABCQ1, the DRA726APGABCQ1 adds silicon-level security features essential for secure boot and firmware updates; compared with DRA746APGABCQ1, it trades raw performance for cost-optimized implementation in mid-tier automotive infotainment systems.

Availability

DRA726APGABCQ1 is available at Aetrix Electronics and suitable for automotive infotainment systems, digital cockpit HMI development, and ADAS integration hubs requiring stable component supply across extended production lifecycles.

Supply support for DRA726APGABCQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for automotive, industrial, and consumer markets since 1930.

The DRA726APGABCQ1 belongs to TI's Jacinto™ 6 Eco family of automotive infotainment processors, designed specifically to deliver scalable, AEC-Q100 qualified SoC performance for cost-sensitive digital cockpit applications with robust multimedia and connectivity features.

FAQ

What is the maximum DDR3 speed supported by DRA726APGABCQ1?

The DRA726APGABCQ1 supports DDR3-1333 (667 MHz) operation via its EMIF module, enabling up to 2 GB of memory across a single chip select. This speed is validated for stable operation under AEC-Q100 Grade 2 temperature conditions (−40°C to +105°C) and requires strict PCB layout adherence to TI's DDR3 design guidelines in SPRS956H Section 8.7.

Does DRA726APGABCQ1 support secure boot with customer-programmable keys?

Yes, DRA726APGABCQ1 with Silicon Revision 2.1 includes customer-programmable keys, secure ROM, and hardware crypto accelerators that enable authenticated and encrypted secure boot. These features are documented in SPRS956H Section 1.1 and require proper fuse programming during manufacturing - not available on earlier silicon revisions or DRA725 variants.

Is DRA726APGABCQ1 pin-compatible with other DRA72x devices?

Yes, DRA726APGABCQ1 is fully pin-compatible with DRA722APGABCQ1, DRA724APGABCQ1, and DRA725APGABCQ1 in the same ABC package. This allows OEMs to reuse PCB designs across infotainment tiers while scaling features - confirmed in SPRS956H Section 1.3 and Table 3-1 device comparison.

What video output interfaces does DRA726APGABCQ1 provide?

DRA726APGABCQ1 integrates a display subsystem with three video pipelines supporting HDMI 1.4a (with HDCP), DVI 1.0, and up to three LCD outputs (LCD1–LCD3). The HDMI encoder supports 1080p60 output with embedded audio, and pipeline blending/scaling enables multi-layer UI composition without CPU intervention.

How many CAN interfaces does DRA726APGABCQ1 include?

DRA726APGABCQ1 includes two Controller Area Network (DCAN) modules compliant with CAN 2.0B protocol, each with dedicated TX/RX pins (e.g., dcana_tx/dcana_rx and dcanb_tx/dcanb_rx). These support bit rates up to 1 Mbps and are used for communication with instrument clusters, body control modules, and ADAS ECUs.

What is the role of the dual Cortex-M4 IPUs in DRA726APGABCQ1?

The dual Arm® Cortex-M4 Image Processing Units (IPU1/IPU2) in DRA726APGABCQ1 handle real-time camera preprocessing, sensor fusion, and low-latency image analysis tasks - offloading these from the Cortex-A15 and C66x cores. They run autonomous firmware for tasks like lens distortion correction and motion detection, as specified in SPRS956H Section 1.1 and functional block diagram.