Texas Instruments DRV8320RSRHAT

Overview

DRV8320RSRHAT from Texas Instruments is a 6–60-V three-phase smart gate driver IC for driving high-side and low-side N-channel MOSFETs in BLDC and PMSM motor control systems. It integrates a 600-mA DC/DC buck regulator, 3.3-V/30-mA linear regulator, adjustable slew-rate control, 1-A peak source / 2-A peak sink gate drive current, and SPI interface. Used in e-bikes, power tools, and robotics.

For engineers reviewing the DRV8320RSRHAT datasheet, DRV8320RSRHAT pinout, DRV8320RSRHAT application, or DRV8320RSRHAT equivalent, key selection considerations include its 40-pin VQFN package with exposed thermal pad, integrated buck regulator (VIN = 4–60 V, VOUT = 0.8–60 V), hardware- and SPI-configurable PWM modes (6x/3x/1x/independent), and fault reporting via nFAULT open-drain output.

Technical Context

The DRV8320RSRHAT implements a Smart Gate Drive architecture with independently configurable high-side charge pump and low-side linear regulator, enabling 100% duty-cycle operation. Its gate drivers support programmable peak currents (10 mA–1 A source, 20 mA–2 A sink) and adjustable slew rate to balance EMI and switching loss.

It features dual power domains: VM (6–60 V) powers gate drive circuitry and charge pump; VIN (4–60 V) feeds the integrated LMR16006X buck regulator. Fault detection includes VM UVLO, charge pump UVLO, MOSFET overcurrent, thermal warning/shutdown, and gate driver fault - all reported via nFAULT and readable through SPI registers.

Key Specifications

Pinout & Package

VQFN-40 package (6.00 mm × 6.00 mm, 0.4-mm pitch) with exposed thermal pad - optimized for thermal dissipation in high-current motor drive PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar three-phase gate driver applications.

Compared with DRV8320RHRTJT, the DRV8320RSRHAT adds SPI configurability and diagnostic visibility without sacrificing buck integration or thermal performance; compared with DRV8323RSRTJT, it omits current sense amplifiers to reduce cost and complexity where sensing is handled externally.

Availability

DRV8320RSRHAT is available at Aetrix Electronics and suitable for e-mobility, cordless power tools, and industrial robotics requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for DRV8320RSRHAT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with broad industrial and automotive qualification.

The DRV832x product line delivers highly integrated, protected three-phase gate drivers targeting high-efficiency, compact, and reliable motor control in battery-powered and industrial equipment.

FAQ

What is the maximum gate drive supply voltage supported by the DRV8320RSRHAT?

The DRV8320RSRHAT supports a VM supply voltage range of 6 V to 60 V - this powers the high-side charge pump, low-side linear regulator, and gate drivers. The absolute maximum rating is 65 V, but continuous operation above 60 V is not recommended. This range accommodates common 24-V, 36-V, and 48-V battery systems found in e-bikes, power tools, and robotics, and ensures robust operation across varying battery states of charge. The DRV8320RSRHAT must be used within this specified range to maintain reliability and avoid damage.

Does the DRV8320RSRHAT include integrated current sense amplifiers?

No, the DRV8320RSRHAT does not integrate low-side current sense amplifiers. That feature is present only in the DRV8323 and DRV8323R variants (e.g., DRV8323RSRTJT). The DRV8320RSRHAT provides the SLA/SLB/SLC pins for external current sense amplifier connections or VDS monitoring, but lacks on-chip amplification circuitry. Designers requiring shunt-based phase current measurement must add external op-amps or use a DRV8323-series device. This omission reduces cost and die size while retaining full gate drive and buck functionality in the DRV8320RSRHAT.

How does the buck regulator in the DRV8320RSRHAT differ from the one in the DRV8320RHRTJT?

The buck regulator in the DRV8320RSRHAT is functionally identical to that in the DRV8320RHRTJT: both integrate the LMR16006X SIMPLE SWITCHER® with 4–60-V input, 0.8–60-V output, and 600-mA capability. The difference lies solely in interface - DRV8320RSRHAT uses SPI for configuration and status, while DRV8320RHRTJT relies on hardware pins (MODE, IDRIVE, VDS). The buck circuitry, FB feedback path, SW node behavior, and thermal performance are unchanged between the two variants. Both require the same external components: inductor, output capacitor, and FB resistor divider.

Can the DRV8320RSRHAT operate without an external microcontroller?

Yes, the DRV8320RSRHAT supports standalone operation using hardware control pins (INHA–INHC, INLA–INLC, MODE, ENABLE) in 6x, 3x, or 1x PWM modes - no microcontroller or SPI communication is required. However, SPI is needed to access fault registers, configure advanced protections (e.g., VDS trip level), or dynamically adjust parameters like IDRIVE. For basic open-loop motor control (e.g., fans or simple pumps), hardware-only mode suffices. For closed-loop FOC, diagnostics, or adaptive protection, a microcontroller with SPI is necessary. The DRV8320RSRHAT retains full gate drive functionality regardless of interface choice.

What thermal management provisions does the DRV8320RSRHAT include?

The DRV8320RSRHAT includes thermal warning (OTW) and thermal shutdown (OTSD) protection, both reported via the nFAULT pin and SPI status registers. Its 6.00 mm × 6.00 mm VQFN package features an exposed thermal pad that must be soldered to a large PCB copper pour for effective heat dissipation. TI recommends ≥250 mm² of 2-oz copper connected to the pad with ≥4 thermal vias (0.3-mm diameter, 0.8-mm pitch). Junction-to-board thermal resistance (θJB) is 12.5°C/W, and junction-to-ambient (θJA) is 32.5°C/W in standard JEDEC 2S2P layout. These provisions ensure reliable operation up to 105°C ambient in motor drive applications with proper PCB layout.