Analog Devices Inc./Maxim Integrated DS1013M-20

Overview

DS1013M-20 from Dallas Semiconductor is a 3-channel all-silicon logic delay line in an 8-pin DIP package, delivering precisely matched 20 ns fixed delays on all three outputs (tPLH/tPHL = 20/20/20 ns), ±2 ns tolerance, TTL/CMOS-compatible input/output, and capable of driving up to 10 × 74LS loads - used in digital timing alignment, clock skew correction, and pulse width adjustment in test instrumentation and industrial control systems.

For engineers reviewing the DS1013M-20 datasheet, DS1013M-20 pinout, DS1013M-20 application, or DS1013M-20 equivalent, key selection criteria include guaranteed edge-matched delay accuracy across temperature (0°C to 70°C), low-power CMOS operation at 5 V, and compatibility with wave/IR/vapor-phase soldering processes for high-reliability PCB assembly.

Technical Context

The DS1013M-20 implements three independent buffered delay paths using monolithic silicon logic, each reproducing both rising and falling edges with equal precision (tPLH ≈ tPHL). Delay stability is maintained over supply voltage (4.75 V–5.25 V) and ambient temperature (0°C–70°C), with unidirectional delay drift across channels under varying conditions.

No internal PLL or feedback loop is used; delay is fixed by on-die propagation path design. Input pulse width must exceed 100% of tPLH (≥20 ns), and output loading is specified per 74F04 gate equivalence (≈15 pF), ensuring predictable timing without external termination.

Key Specifications

Pinout & Package

DS1013M-20 uses an 8-pin plastic DIP (300-mil width) with gull-wing leads. Pin 1 is IN1; pins 2, 3, and 6 are NC; pin 4 is IN2; pin 5 is IN3; pin 7 is GND; pin 8 is VCC; outputs OUT3, OUT2, and OUT1 are on pins 16, 15, and 14 respectively - but this 8-pin variant maps outputs to pins 13, 12, and 11 per mechanical drawing. Confirmed pinout below reflects DS1013M 8-pin DIP layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-delay logic applications.

Compared with DS1013-20 and MC100EP195FA, the DS1013M-20 offers identical 20 ns delay accuracy and TTL/CMOS compatibility in a space-saving 8-pin DIP, making it optimal for cost-sensitive, volume-manufactured 5 V digital systems where board area and assembly simplicity are prioritized over ultra-fine delay resolution.

Availability

DS1013M-20 is available at Aetrix Electronics and suitable for digital test equipment, industrial PLCs, high-speed data acquisition, and legacy bus interface applications requiring stable component supply, long-term obsolescence management, and consistent parametric performance across production lots.

Supply support for DS1013M-20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Dallas Semiconductor (now part of Maxim Integrated, then Analog Devices) specialized in precision timing, memory, and analog interface ICs for industrial and embedded systems before acquisition.

The DS1013 series was designed specifically to replace aging hybrid delay lines with monolithic silicon equivalents - targeting cost reduction, improved reliability, and simplified PCB assembly in digital timing-critical applications.

FAQ

What is the guaranteed delay tolerance for DS1013M-20 over temperature and voltage?

The DS1013M-20 guarantees ±2 ns delay tolerance for all three outputs across the full operating range (0°C to 70°C, VCC = 4.75 V to 5.25 V). This specification holds for the 20 ns nominal delay; tolerance increases to ±3% for delays ≥70 ns and ±5% for ≥150 ns, but DS1013M-20 remains strictly within ±2 ns per the datasheet's Table 1 and Notes 3–5. DS1013M-20 achieves this via matched on-die propagation paths and low-drift CMOS buffering.

Can DS1013M-20 drive standard TTL loads directly?

Yes, DS1013M-20 can drive up to 10 × 74LS loads per output, verified by its IOL = 12 mA (min) and IOH = –1 mA (min) specifications at VCC = 4.75 V. Its output voltage levels (VOH ≥ 4.0 V, VOL ≤ 0.5 V) meet TTL interface requirements. No external buffer or level shifter is needed when interfacing with 74LS, 74F, or modern 5 V CMOS logic. DS1013M-20 maintains this drive capability across its full temperature and voltage range.

Is DS1013M-20 pin-compatible with hybrid delay line replacements?

No - DS1013M-20 uses an 8-pin DIP package with specific NC pin assignments (pins 2, 3, 6), whereas hybrid-compatible versions like DS1013-20 use a 14-pin DIP with different pinout. The DS1013M-20 is not pin-compatible with legacy hybrid sockets. DS1013M-20 was engineered for board space savings, not drop-in hybrid replacement. For hybrid socket compatibility, DS1013-20 (14-pin) or DS1013S-20 (16-pin SOIC) must be selected instead of DS1013M-20.

What is the maximum input pulse width requirement for reliable DS1013M-20 operation?

DS1013M-20 requires a minimum input pulse width (tWI) of ≥100% of its nominal delay - i.e., ≥20 ns - to ensure proper edge detection and delay replication. The datasheet specifies tWI ≥ tPLH in AC Electrical Characteristics. Pulses narrower than 20 ns may result in incomplete propagation or inconsistent output timing. DS1013M-20 does not specify a maximum pulse width; however, period must allow full power-up (tPU = 100 ms) after power application before valid timing behavior is guaranteed.

Does DS1013M-20 support both rising and falling edge delay accuracy?

Yes, DS1013M-20 delivers matched delay accuracy on both signal edges: tPLH (rising edge) and tPHL (falling edge) are both 20 ns ±2 ns. The datasheet explicitly states "reproduces both leading and trailing edges with equal precision" and confirms edge-matching in Notes 3 and 6. This dual-edge fidelity ensures duty cycle integrity and eliminates timing distortion in square-wave or PWM applications - a key differentiator versus single-edge delay devices. DS1013M-20 achieves this via symmetrical internal buffer design.