My Inquiry
My Account
Texas Instruments DS10CP152TMAX/NOPB
- Part No.:
- DS10CP152TMAX/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
DS10CP152TMAX/NOPB.pdf
- Description:
- IC CROSSPOINT SW 1 X 2:2 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,030
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DS10CP152TMAX/NOPB from Texas Instruments is a 1.5 Gbps 2×2 LVDS crosspoint switch optimized for high-speed signal routing over lossy FR-4 backplanes and balanced cables. It features pin-configurable non-blocking architecture, on-chip 100 Ω differential input/output termination, and supports DC-coupled interfaces to LVDS/CML/LVPECL drivers in SD/HD SDI router applications.
For engineers reviewing the DS10CP152TMAX/NOPB datasheet, DS10CP152TMAX/NOPB pinout, DS10CP152TMAX/NOPB application, or DS10CP152TMAX/NOPB equivalent, key selection criteria include differential propagation delay skew (≤60 ps channel-to-channel), 7 kV HBM ESD protection on LVDS I/O pins, and support for 1.5 Gbps NRZ data rates with <0.07 UIP-P total jitter at full speed.
Technical Context
The DS10CP152TMAX/NOPB implements a fully differential, non-blocking 2×2 switching matrix with independent LVCMOS control of output enable (EN0/EN1) and configuration (SEL0/SEL1). Its internal 100 Ω differential termination eliminates external resistors and minimizes return loss across the 0–1.5 GHz bandwidth.
It operates from a single 3.0–3.6 V supply, draws 58–70 mA active supply current, and delivers LVDS-compliant outputs (VOD = 250–450 mV, VOS = 1.05–1.375 V) with deterministic jitter ≤35 ps peak-to-peak at 1.5 Gbps - enabling robust signal integrity in broadcast infrastructure backplanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | DC to 1.5 Gbps NRZ - supports SMPTE 292M (1.485 Gbps) and SMPTE 344M (2.97 Gbps) half-rate operation. |
| Differential Propagation Delay | 400–650 ps - ensures sub-nanosecond timing alignment critical for multi-channel SDI distribution. |
| Channel-to-Channel Skew | 25–60 ps - enables simultaneous switching across both outputs without inter-channel timing violation. |
| Input Common Mode Range | 0.05 V to VCC − 0.05 V - allows direct DC coupling to LVPECL (−0.2 V to +1.2 V), CML, and LVDS sources without level-shifting. |
| ESD Protection | ≥7 kV HBM on LVDS I/O - protects against electrostatic discharge during board handling and system integration. |
| Supply Current | 58–70 mA active, 25–30 mA powered-down - reduces thermal load and simplifies power delivery in dense router cards. |
| Package | SOIC-16 (Package D) - flow-through pinout enables straight PCB trace routing and minimizes stub length on high-speed lines. |
Pinout & Package
DS10CP152TMAX/NOPB uses a 16-pin SOIC package (TI Package D, 7.5 mm × 10.3 mm body, 1.27 mm pitch) with flow-through pin assignment optimized for minimal trace discontinuity in high-speed layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN0+, IN0− | Differential LVDS Input 0 | Accepts AC/DC-coupled signals; internally terminated with 100 Ω differential resistor. |
| IN1+, IN1− | Differential LVDS Input 1 | Independent high-speed input path; compatible with LVPECL/CML common-mode ranges. |
| OUT0+, OUT0− | Differential LVDS Output 0 | LVDS-compliant output (250–450 mV swing); supports point-to-point or 1-to-2 fanout. |
| OUT1+, OUT1− | Differential LVDS Output 1 | Matched delay and skew to OUT0; enables synchronous dual-output routing. |
| SEL0, SEL1 | LVCMOS Switch Control | Configures input-to-output mapping per truth table (e.g., SEL1=1/SEL0=0 routes IN1→OUT0, IN0→OUT1). |
| EN0, EN1 | LVCMOS Output Enable | Individually disables OUT0 or OUT1 to reduce power and prevent bus contention. |
| VDD, GND | Power Supply | Single 3.3 V ±10% supply; decoupling required within 10 mm of VDD/GND pins. |
| NC (Pins 8, 9) | No Connect | Not bonded; must remain unconnected and unstubbed to avoid impedance discontinuity. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip 100 Ω differential termination | Eliminates four external 100 Ω resistors per channel, reducing BOM count and PCB area by >12 mm². |
| Flow-through SOIC-16 pinout | Enables straight microstrip routing from input to output pins, minimizing via count and impedance mismatch. |
| Wide input common-mode range (0.05 V to VCC−0.05 V) | Supports direct DC coupling to LVPECL drivers without AC coupling capacitors or bias networks. |
| 7 kV HBM ESD protection on LVDS I/O | Meets IEC 61000-4-2 Level 4 requirements without external TVS diodes on signal paths. |
| Low pulse skew (≤120 ps) and channel skew (≤60 ps) | Preserves eye opening in multi-lane SDI systems where timing alignment between parallel data paths is critical. |
Applications
| SD/HD SDI Router Core | Broadcast Equipment Backplane |
|---|---|
Use Scenario: Signal routing in 3G-SDI video routers with up to 64×64 crosspoint density using modular card architecture. IC Role / Device Role / Timing Role: 2×2 LVDS switch on input/output interface cards, providing selectable path connectivity between baseband video processing modules and backplane lanes. Use Value: Enables hot-swappable card designs with deterministic 1.5 Gbps signal integrity and <60 ps inter-output skew for frame-synchronized video distribution. | Use Scenario: High-density video transport across FR-4 backplanes in production switchers and master control rooms. IC Role / Device Role / Timing Role: Loss compensation and path selection element between video source cards and destination cards over 10+ cm striplines. Use Value: Maintains >15 dB return loss up to 1.5 GHz via integrated termination, eliminating need for external matching networks and reducing insertion loss variation. |
| Multi-format Video Interface Card | Professional Camera Link Distribution |
Use Scenario: Field-upgradeable I/O module supporting SD-SDI, HD-SDI, and 3G-SDI via software-configurable routing. IC Role / Device Role / Timing Role: Reconfigurable signal path selector that adapts to varying data rates and cable lengths without hardware change. Use Value: Single hardware design supports multiple broadcast standards through SEL/EN pin programming, reducing inventory SKUs and qualification effort. | Use Scenario: Distribution of Camera Link Base/Medium/Full configurations in machine vision systems requiring low-jitter clock/data recovery. IC Role / Device Role / Timing Role: Low-skew, low-jitter repeater and mux for serialized pixel data streams between frame grabbers and cameras. Use Value: Delivers <0.07 UIP-P total jitter at 850 Mbps (Camera Link Full), preserving eye margin for reliable 8-bit/10-bit pixel capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LVDS crosspoint switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN65LVDS12 | 2×2 LVDS mux with fixed IN0→OUT0/IN1→OUT1 routing; no SEL pins; 850 Mbps max data rate. | Limited to static path assignment; unsuitable for dynamic SDI routing where input-output pairing must be reconfigured. | Select when only simple 2:1 muxing is needed and cost sensitivity outweighs configurability requirements. |
| MAX9152 | 2×2 LVDS crosspoint with 2.5 Gbps capability; requires external 100 Ω termination; higher supply current (110 mA). | Supports higher bandwidth but increases layout complexity and power dissipation in space-constrained router cards. | Select when future-proofing for 6G-SDI or custom serial protocols beyond 1.5 Gbps is required. |
Compared with SN65LVDS12 and MAX9152, DS10CP152TMAX/NOPB uniquely balances 1.5 Gbps performance, on-chip termination, flow-through SOIC layout, and 7 kV ESD protection - making it optimal for cost-sensitive, high-reliability SD/HD SDI infrastructure where board space and signal integrity are constrained.
Availability
DS10CP152TMAX/NOPB is available at Aetrix Electronics and suitable for SD/HD SDI routers, broadcast equipment backplanes, and professional video interface cards requiring stable component supply and long-term industrial availability.
Supply support for DS10CP152TMAX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.
The DS10CP152TMAX/NOPB belongs to TI's high-speed interface portfolio, designed specifically for broadcast video infrastructure requiring robust LVDS signal routing over lossy PCBs and cables.
FAQ
What is the maximum supported data rate for DS10CP152TMAX/NOPB?
The DS10CP152TMAX/NOPB supports data rates from DC up to 1.5 Gbps NRZ, as confirmed by TI's SNLS261E datasheet. At 1.5 Gbps, it maintains <0.07 UIP-P total jitter and ≤60 ps channel-to-channel skew - meeting SMPTE 292M timing requirements for HD-SDI distribution. Operation above 1.5 Gbps is not characterized or guaranteed.
Does DS10CP152TMAX/NOPB require external termination resistors?
No, DS10CP152TMAX/NOPB does not require external termination resistors. Each differential input and output pair is internally terminated with a matched 100 Ω resistor, as specified in the "On-chip 100Ω Input and Output Termination" feature and verified in the DC Electrical Characteristics table. This eliminates four external resistors per channel and reduces board space.
Can DS10CP152TMAX/NOPB interface directly with LVPECL drivers?
Yes, DS10CP152TMAX/NOPB can interface directly with LVPECL drivers using DC coupling. Its wide input common-mode voltage range (0.05 V to VCC − 0.05 V) accommodates typical LVPECL output levels (≈1.0–1.3 V common-mode), as validated in Figure 7 of the DS10CP152TMAX/NOPB datasheet and confirmed by the VCMR specification.
What is the function of the NC pins (8 and 9) on DS10CP152TMAX/NOPB?
Pins 8 and 9 on DS10CP152TMAX/NOPB are designated NC (No Connect) and are not bonded internally. Per TI's Pin Descriptions table, they must remain unconnected and unstubbed on the PCB to prevent impedance discontinuities that could degrade signal integrity on adjacent high-speed LVDS traces.
How does DS10CP152TMAX/NOPB manage power during unused output states?
DS10CP152TMAX/NOPB uses dedicated LVCMOS enable pins (EN0 and EN1) to individually disable each output. When an output is disabled, supply current drops from 58–70 mA (active) to 25–30 mA (powered-down), as specified in the ICC and ICCZ parameters. This reduces heat generation and prevents bus contention in multi-drop backplane configurations.
DS10CP152TMAX/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Crosspoint Switch
- Circuit:
- 1 x 2:2
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
DS10CP152TMAX/NOPB FAQ
1.How can I place an order for DS10CP152TMAX/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for DS10CP152TMAX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS10CP152TMAX/NOPB reliable?
The price and inventory of DS10CP152TMAX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS10CP152TMAX/NOPB is usually 5 days.
3.What payment methods are accepted for DS10CP152TMAX/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS10CP152TMAX/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS10CP152TMAX/NOPB?
DS10CP152TMAX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS10CP152TMAX/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS10CP152TMAX/NOPB?
For technical support, including DS10CP152TMAX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS10CP152TMAX/NOPB requirements.
6.How does Aetrix verify that DS10CP152TMAX/NOPB is sourced from the original manufacturer or authorized distributors?
All DS10CP152TMAX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS10CP152TMAX/NOPB meets industry standards.
7.What is the process for return or replacement of DS10CP152TMAX/NOPB?
All DS10CP152TMAX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with DS10CP152TMAX/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS10CP152TMAX/NOPB part is unused and in its original packaging.
Return procedure for DS10CP152TMAX/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS10CP152TMAX/NOPB Tags
-
SN74HC138DR
Texas Instruments
-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage
-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments
-
74CBTLV3257GUX
Nexperia USA Inc.
-
74HC154BQ,118
Nexperia USA Inc.
-
P3S0200GMX
NXP USA Inc.
-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments
-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments
-
SN74HC138N
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
