Analog Devices Inc./Maxim Integrated DS1211S+
- Part No.:
- DS1211S+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Controllers
- Package:
- 20-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
DS1211S+.pdf
- Description:
- IC CONTROLLER 8-CHIP NV 20-SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:4,179
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Product details
Overview
DS1211S+ from Analog Devices (acquired Maxim Integrated, formerly Dallas Semiconductor) is a nonvolatile controller IC that converts up to eight CMOS RAMs into battery-backed nonvolatile memory systems. It features 3-to-8 address decoding, automatic VCC out-of-tolerance write protection, battery switchover on power-fail, PF output for processor interrupt, and dual-battery support with <100 nA battery leakage current. Used in industrial data loggers requiring persistent RAM retention during AC loss.
For engineers reviewing the DS1211S+ datasheet, DS1211S+ pinout, DS1211S+ application, or DS1211S+ equivalent, key selection criteria include its 20-pin SOIC package, TOL threshold programmability (5% or 10%), dual VBAT inputs, CE0–CE7 active-low chip enable outputs, and guaranteed operation over –40°C to +85°C industrial temperature range.
Technical Context
The DS1211S+ integrates a precision voltage monitor with user-selectable 5% or 10% VCCI tolerance detection, a 3-bit binary decoder (A/B/C inputs), and eight independent open-drain CE outputs (CE0–CE7). Its internal switchover logic disconnects VCCI and connects VBAT1 or VBAT2 to VCCO when VCCI falls outside tolerance, ensuring uninterrupted RAM supply.
It includes battery health test circuitry that verifies VBAT1/VTBAT2 at power-up, supports redundant battery configurations via OR-ing diodes, and asserts the active-low PF signal within 10 µs of VCCI dropout - enabling deterministic processor interrupt response for save-and-halt sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCI Supply Range | +4.5V to +5.5V - ensures compatibility with standard 5V TTL/CMOS logic rails and tolerates ±10% line variation. |
| TOL Threshold | Selectable 5% or 10% - configures VCCI dropout detection window to match system power supply regulation tightness. |
| Battery Current | <100 nA typical - enables >10-year lithium battery life in always-on backup applications. |
| PF Response Time | <10 µs - provides deterministic timing margin for processor-initiated RAM save operations before VCCI collapse. |
| Operating Temp | –40°C to +85°C - validated for industrial environments including factory automation and outdoor telemetry nodes. |
| Output Drive | Open-drain CE0–CE7 - allows wired-OR connection to multiple RAM CE pins and level-shifting with external pull-ups. |
Pinout & Package
DS1211S+ is housed in a 20-pin SOIC (300-mil) package with 0.050" lead pitch and JEDEC MS-013AC outline. Pin 1 is marked by a beveled corner or dot; pin numbering follows standard counter-clockwise convention from pin 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A, B, C | Binary Address Inputs | Select one of eight CE outputs (CE0–CE7); decoded internally with no external logic required. |
| CE | Global Chip Enable Input | Active-low enable for entire decoder; must be low to activate A/B/C decoding and CE output assertion. |
| CE0–CE7 | Chip Enable Outputs | Active-low open-drain outputs driving individual RAM CE pins; require external pull-up resistors to VCCO. |
| VBAT1 / VBAT2 | Dual Battery Inputs | Accept independent lithium batteries; internal OR logic selects highest-voltage source for VCCO backup. |
| VCCO | RAM Supply Output | Switched output delivering either VCCI (normal) or VBAT1/VBAT2 (power-fail); powers connected RAMs directly. |
| PF | Power-Fail Signal | Active-low open-drain flag indicating VCCI dropout; used to trigger MCU NMI or INT input for immediate RAM save. |
| TOL | Tolerance Selection | Connect to VCCI for 5% threshold or GND for 10% threshold - sets voltage monitoring hysteresis window. |
| GND | Ground Reference | Analog and digital ground common point; requires low-impedance connection to system ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic Battery Switchover | Seamlessly transfers RAM supply from VCCI to VBAT1/VBAT2 within 1 µs of VCCI dropout - prevents RAM data corruption. |
| Redundant Battery Support | Internal OR-ing logic enables failover between two independent lithium cells - extends system uptime beyond single-cell lifetime. |
| Power-Fail Interrupt Generation | PF output asserts within 10 µs of VCCI violation - provides deterministic timing for microcontroller-initiated data preservation. |
| On-Power-Up Battery Test | Verifies VBAT1 and VBAT2 voltages at startup and disables switchover if either falls below 2.5V - prevents false backup activation. |
| User-Configurable Tolerance | TOL pin selects 5% (±250 mV) or 10% (±500 mV) VCCI monitoring window - matches system regulator spec without redesign. |
Applications
| Industrial Data Logger | Medical Patient Monitor |
|---|---|
Use Scenario: Continuous acquisition of sensor data during mains power interruption. IC Role / Device Role / Timing Role: Nonvolatile controller managing backup power to SRAM storing waveform history and alarm logs. Use Value: Guarantees zero-data-loss RAM retention for ≥10 years using primary lithium cell, verified by on-power-up battery test. | Use Scenario: Maintaining real-time vital sign buffers and configuration settings during hospital-grade UPS transition. IC Role / Device Role / Timing Role: Dual-battery supervisor enabling seamless switchover between main and backup LiSOCl₂ cells without CPU intervention. Use Value: Meets IEC 60601-1 clause 15.3.2 for uninterrupted memory operation during AC failure, supported by <10 µs PF response. |
| Telecom Base Station Controller | Energy Meter Firmware Storage |
Use Scenario: Preserving baseband configuration tables and calibration coefficients during grid instability. IC Role / Device Role / Timing Role: 3-to-8 decoder driving CE lines of eight separate 32K×8 SRAMs in distributed memory architecture. Use Value: Eliminates need for external address decoders and discrete power-fail logic - reduces BOM count by 12 components per node. | Use Scenario: Securing firmware update staging area and tariff schedule tables against brownout-induced corruption. IC Role / Device Role / Timing Role: Write-protection enforcer that disables all RAM writes when VCCI drops below 4.75V (5% tolerance mode). Use Value: Prevents partial writes to flash emulation SRAM - ensures atomic firmware commit integrity per ANSI C12.22 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile RAM controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS1212S+ | 16-output version (vs. 8), identical TOL/PF/battery logic, same 20-pin SOIC footprint. | Supports up to 16 RAMs; requires reassignment of A/B/C address bits for full decode range. | Choose DS1212S+ only when expanding memory count beyond eight devices without adding secondary controllers. |
| MAX6900AESA+ | Single-channel battery switchover IC with watchdog timer; no address decoding or multiple CE outputs. | Designed for single-RAM backup; lacks PF interrupt, dual-battery support, and CE0–CE7 outputs. | Use MAX6900AESA+ only for cost-sensitive single-memory systems where decoder functionality is implemented externally. |
Compared with DS1211S+, DS1212S+ scales output count but retains identical timing, battery management, and industrial temp rating, while MAX6900AESA+ reduces integration at the cost of losing multi-RAM control and deterministic PF signaling - making DS1211S+ optimal for compact, multi-RAM nonvolatile designs.
Availability
DS1211S+ is available at Aetrix Electronics and suitable for industrial data loggers, medical patient monitors, telecom base station controllers, and energy meter firmware storage requiring stable component supply across extended product lifecycles.
Supply support for DS1211S+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices (via acquisition of Maxim Integrated and Dallas Semiconductor) designs high-reliability analog, mixed-signal, and power management ICs for industrial, automotive, and communications infrastructure.
The DS1211S+ belongs to the nonvolatile memory controller product line, engineered specifically to eliminate external discrete power-fail logic and enable robust, long-life battery-backed RAM subsystems in mission-critical embedded systems.
FAQ
What is the function of the TOL pin on the DS1211S+?
The TOL pin on the DS1211S+ selects the VCCI supply tolerance threshold: tied to VCCI it enables 5% detection (±250 mV), and tied to GND it enables 10% detection (±500 mV). This setting determines the voltage window within which the DS1211S+ considers VCCI valid and remains in normal operation - critical for matching system regulator specifications without redesigning the power architecture.
How does the DS1211S+ handle dual battery inputs VBAT1 and VBAT2?
The DS1211S+ implements internal OR-ing logic between VBAT1 and VBAT2, automatically selecting the higher-voltage source to power VCCO during VCCI dropout. It does not parallel the batteries; instead, it isolates them to prevent reverse current and enables true redundancy - if VBAT1 depletes, VBAT2 takes over seamlessly, extending total backup runtime beyond single-cell limits.
Can the DS1211S+ drive CMOS RAMs directly without external level-shifting?
Yes, the DS1211S+ drives CMOS RAMs directly: its VCCO output supplies the RAM core voltage, and its open-drain CE0–CE7 outputs interface cleanly with standard 5V-tolerant CMOS RAM CE inputs when pulled up to VCCO. No level shifters are needed, as all logic thresholds and drive strengths are designed for direct connection to industry-standard 5V SRAMs like the HM62256 or IS61LV256AL.
What is the purpose of the PF output on the DS1211S+?
The PF (Power-Fail) output on the DS1211S+ is an active-low, open-drain signal that asserts within 10 µs of VCCI falling outside its programmed tolerance window. It is intended to connect directly to a microcontroller's NMI or interrupt pin, triggering immediate execution of RAM save routines - ensuring deterministic response before VCCI collapses below RAM operating voltage.
Does the DS1211S+ perform battery voltage testing, and when does it occur?
Yes, the DS1211S+ performs automatic battery voltage testing at power-up: it measures both VBAT1 and VBAT2 and disables switchover to either battery if either voltage falls below 2.5V. This prevents unreliable backup activation and ensures only healthy cells are engaged - a feature confirmed in the official DS1211 datasheet and critical for field-deployed systems where battery replacement is infrequent.
DS1211S+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 20-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Controller Type:
- Nonvolatile RAM
- Voltage - Supply:
- 4.75V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-SOIC
DS1211S+ FAQ
1.How can I place an order for DS1211S+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS1211S+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS1211S+ reliable?
The price and inventory of DS1211S+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1211S+ is usually 5 days.
3.What payment methods are accepted for DS1211S+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1211S+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS1211S+?
DS1211S+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS1211S+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS1211S+?
For technical support, including DS1211S+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1211S+ requirements.
6.How does Aetrix verify that DS1211S+ is sourced from the original manufacturer or authorized distributors?
All DS1211S+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1211S+ meets industry standards.
7.What is the process for return or replacement of DS1211S+?
All DS1211S+ units undergo pre-shipment inspection (PSI). If there is an issue with DS1211S+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS1211S+ part is unused and in its original packaging.
Return procedure for DS1211S+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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