Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Analog Devices Inc./Maxim Integrated DS1212+

Part No.:
DS1212+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Controllers
Package:
28-DIP (0.600", 15.24mm)
Datasheet:
AetrixDS1212+.pdf
Description:
IC CONTROLLER NV 16-CHIP 28-DIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,895

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

DS1212+ from Maxim Integrated (formerly Dallas Semiconductor) is a nonvolatile controller IC that converts up to 16 CMOS RAMs into battery-backed nonvolatile memory. It provides 4-to-16 decoding, automatic VCCI-to-battery switchover (<0.2 V drop), precision power-fail detection (4.50–4.74 V trip), write protection during supply out-of-tolerance, and dual-battery redundancy with <100 nA battery standby current. Used in industrial data loggers requiring persistent RAM retention during main power loss.

For engineers reviewing the DS1212+ datasheet, DS1212+ pinout, DS1212+ application, or DS1212+ equivalent, key selection criteria include its dual-battery support, programmable power-fail threshold (via TOL pin), CE0–CE15 decoder outputs with guaranteed low-leakage hold state, and compatibility with standard 28-pin DIP/PLCC packages for legacy system upgrades.

Technical Context

The DS1212+ integrates six tightly coupled functions: a 4-bit address decoder driving 16 independent CE outputs; a bidirectional power switch selecting between VCCI and VBAT1/VBAT2; a precision comparator monitoring VCCI against two selectable thresholds (TOL = GND or VCCO); write-protection logic holding CE outputs within 0.2 V of active supply; a battery-status checker verifying ≥2.0 V on power-up; and an internal isolation switch enabling transparent dual-battery redundancy.

Its operation requires no external timing components and delivers deterministic behavior across temperature: CE propagation delay ≤20 ns, power-fail assertion latency ≤300 µs, and recovery time ≤125 ms after VCCI restoration. All CE outputs remain stable during VCCI brownout, preserving RAM data integrity without processor intervention.

Key Specifications

Parameter Value and Actual Design Meaning
VCCI Supply Range 4.75–5.5 V (TOL = GND) or 4.5–5.5 V (TOL = VCCO); defines valid operating window for main power monitoring
Power-Fail Trip Voltage 4.50–4.74 V (TOL = GND) or 4.25–4.49 V (TOL = VCCO); precise hysteresis prevents false triggering during supply ripple
Battery Current (Standby) <100 nA; enables >10-year lithium battery life in always-on backup mode
CE Propagation Delay 5–20 ns; ensures glitch-free RAM selection during normal operation and fast response to address changes
CE Output Voltage Drop VBAT − 0.2 V max; maintains sufficient voltage headroom for CMOS RAM VCCO requirements during battery backup
Battery Input Range 2.0–4.0 V per input; supports common lithium coin cells and allows mixed-chemistry redundancy
Operating Temperature 0°C to +70°C (standard); industrial-grade variant available at −40°C to +85°C

Pinout & Package

DS1212+ is available in 28-pin DIP (600-mil) and 28-pin PLCC surface-mount packages. Both share identical pin mapping and electrical functionality.

Pin/Terminal Circuit Role Design Meaning
A, B, C, D Address Inputs 4-bit binary select lines for 4-to-16 decoder; determine which CE0–CE15 output is asserted
CE Chip Enable Input Global enable for decoder logic; when low, CE0–CE15 follow A–D; when high during power fail, outputs retain last state
CE0–CE15 Chip Enable Outputs Active-low outputs driving RAM chip enables; held within 0.2 V of VCCI or battery during power fail to prevent writes
PF Power-Fail Output Open-drain signal driven low during VCCI undervoltage; used to interrupt CPU or trigger save routines
TOL Tolerance Select Configures power-fail threshold: grounded → 4.50–4.74 V; tied to VCCO → 4.25–4.49 V
VBAT1 / VBAT2 Battery Inputs Dual isolated inputs; internal switch selects higher-voltage battery; both <2.0 V triggers battery warning
VCCI Main Supply Input +5 V nominal supply monitored for power-fail detection; powers internal logic and drives CE outputs
VCCO RAM Supply Output Switched output delivering VCCI or battery voltage to RAM VCC pins; includes internal 5 kΩ series resistor
GND Ground Reference Common return for all supplies, signals, and internal comparators

Key Features

Feature Design Value
Dual-battery redundancy with automatic selection Internal isolation switch selects highest-voltage battery; transparent failover preserves RAM power without software or hardware change
Programmable power-fail threshold TOL pin configures trip point to 4.50–4.74 V or 4.25–4.49 V, matching system-level supply tolerance requirements
Write protection during brownout CE0–CE15 outputs held near supply rail during VCCI undervoltage, preventing partial writes that corrupt RAM data
Battery health check at power-up Compares battery voltage to 2.0 V threshold; inhibits second memory cycle if failed, enabling firmware to detect low battery before data loss
Low-leakage CMOS process <100 nA battery standby current extends lithium cell life beyond 10 years in typical data logger applications

Applications

Industrial Data Logger POS Terminal Memory Backup

Use Scenario: Continuous recording of sensor readings or transaction logs in remote equipment with intermittent AC power.

IC Role / Device Role / Timing Role: Nonvolatile controller managing battery switchover and RAM write protection during grid outages.

Use Value: Ensures zero data loss during unannounced power interruptions by maintaining RAM voltage and blocking writes until safe shutdown.

Use Scenario: Retail point-of-sale terminals storing daily sales totals and inventory updates in SRAM between sessions.

IC Role / Device Role / Timing Role: Power-fail monitor and RAM enable manager coordinating with host MCU to save volatile session data.

Use Value: Enables deterministic save-on-power-loss using PF interrupt and CE hold, eliminating need for supercapacitor-based backup circuits.

Medical Device Configuration Storage Telecom Base Station Parameter Retention

Use Scenario: Storing calibration coefficients and user preferences in diagnostic instruments powered by wall adapters.

IC Role / Device Role / Timing Role: Dual-battery supervisor ensuring configuration persistence across multiple battery replacements.

Use Value: Redundant VBAT1/VBAT2 inputs eliminate single-point failure; battery warning flag alerts service staff before data corruption occurs.

Use Scenario: Preserving baseband configuration registers and real-time clock settings in outdoor telecom cabinets with wide ambient temperature swings.

IC Role / Device Role / Timing Role: Temperature-stable nonvolatile controller interfacing with industrial-grade SRAM and lithium batteries.

Use Value: Operates reliably from −40°C to +85°C; low 100 nA battery drain supports 10+ year field deployment without maintenance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile RAM controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
DS1230Y Integrated 256-kbit NV SRAM + controller in 28-pin DIP; no external RAM required; higher cost per bit; no dual-battery support Best for space-constrained designs needing self-contained NV memory; unsuitable where existing RAM must be reused Select DS1230Y only when board area is critical and external RAM count exceeds 16 devices
MAX6900 Single-battery RTC + NV controller; includes real-time clock; no 4-to-16 decoder; CE outputs limited to 2; lower integration density Used in systems requiring time-stamped logging but not multi-RAM expansion; lacks redundancy and scalable CE drive Choose MAX6900 when RTC functionality is mandatory and RAM count is ≤2; DS1212+ remains optimal for ≥4 RAMs with redundancy

Compared with DS1230Y and MAX6900, the DS1212+ uniquely supports up to 16 external CMOS RAMs with dual-battery failover and programmable power-fail threshold-making it the only solution for high-density, mission-critical nonvolatile memory expansion where legacy RAM reuse and long-term reliability are mandatory.

Availability

DS1212+ is available at Aetrix Electronics and suitable for industrial data loggers, POS terminal memory backup, medical device configuration storage, and telecom base station parameter retention requiring stable component supply and long-lifecycle support.

Supply support for DS1212+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (acquired by Analog Devices in 2021) is a semiconductor company specializing in analog, mixed-signal, and power management ICs for industrial, automotive, and communications markets.

The DS1212+ belongs to Maxim's legacy nonvolatile memory controller product line, designed specifically to extend the functional lifetime of CMOS RAM subsystems in systems where data persistence during power loss is non-negotiable.

FAQ

What is the primary function of the DS1212+ in a memory subsystem?

The DS1212+ serves as a dedicated nonvolatile controller that monitors the main VCCI supply, automatically switches RAM power to battery backup during power failure, and enforces write protection by holding CE0–CE15 outputs stable. It enables up to 16 external CMOS RAMs to retain data indefinitely without software intervention. The DS1212+ achieves this through integrated decoding, precision voltage detection, and dual-battery management-all in a single 28-pin IC.

How does the DS1212+ handle dual-battery redundancy?

The DS1212+ features two isolated battery inputs-VBAT1 and VBAT2-with an internal analog switch that continuously selects the higher-voltage source. If one battery drops below 2.0 V while the other remains above, the healthy battery seamlessly assumes full load. The DS1212+ only asserts battery warning if both fall below 2.0 V, ensuring maximum uptime. This redundancy is implemented entirely in hardware, requiring no firmware control or external circuitry.

Can the DS1212+ be used with modern low-voltage RAMs?

No-the DS1212+ is designed exclusively for 5 V CMOS RAMs. Its VCCI and VCCO specifications (4.5–5.5 V), CE output voltage drop (≤0.2 V), and battery input range (2.0–4.0 V) align with standard 5 V SRAM families. It does not support 3.3 V, 2.5 V, or 1.8 V RAMs. Using the DS1212+ with non-5 V RAMs risks insufficient VCCO headroom, unreliable CE logic levels, or premature battery depletion due to mismatched voltage thresholds.

What happens to the CE outputs during a power-fail event?

During a VCCI undervoltage event, the DS1212+ forces all CE0–CE15 outputs to remain within 0.2 V of the active supply rail (VCCI or battery), effectively disabling writes to connected RAMs. If CE is low when power fail occurs, outputs retain their pre-failure state until CE is driven high-ensuring ongoing memory cycles complete before protection engages. This behavior is hardwired and requires no configuration, making the DS1212+ inherently safe for data-critical applications.

Is the DS1212+ compatible with both DIP and PLCC packages?

Yes-the DS1212+ is offered in both 28-pin DIP (600-mil) and 28-pin PLCC packages with identical pinout, electrical characteristics, and thermal performance. The mechanical drawings confirm full footprint compatibility, allowing direct substitution in legacy through-hole designs or new surface-mount layouts. No redesign or layout change is needed when migrating between packages; only soldering process differs.

DS1212+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
28-DIP (0.600", 15.24mm)
Packaging:
Tube
Product Status:
Obsolete
Controller Type:
Nonvolatile RAM
Voltage - Supply:
4.75V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Supplier Device Package:
28-PDIP

DS1212+ FAQ

1.How can I place an order for DS1212+ through Aetrix?

Please submit a Request for Quotation (RFQ) for DS1212+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS1212+ reliable?

The price and inventory of DS1212+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1212+ is usually 5 days.

3.What payment methods are accepted for DS1212+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1212+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS1212+?

DS1212+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS1212+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS1212+?

For technical support, including DS1212+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1212+ requirements.

6.How does Aetrix verify that DS1212+ is sourced from the original manufacturer or authorized distributors?

All DS1212+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1212+ meets industry standards.

7.What is the process for return or replacement of DS1212+?

All DS1212+ units undergo pre-shipment inspection (PSI). If there is an issue with DS1212+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS1212+ part is unused and in its original packaging.

Return procedure for DS1212+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DS1212+ Tags

  • DS1212+
  • DS1212+ PDF
  • DS1212+ Datasheet
  • DS1212+ Specifications
  • DS1212+ Images
  • Analog Devices Inc./Maxim Integrated
  • Analog Devices Inc./Maxim Integrated DS1212+
  • Buy DS1212+
  • DS1212+ Price
  • DS1212+ Distributor
  • DS1212+ Supplier
  • DS1212+ Wholesale
Related Products
BQ2201SN-N
BQ2201SN-N

Texas Instruments

DS1314S+
DS1314S+

Analog Devices Inc./Maxim Integrated

BQ2205LYPW
BQ2205LYPW

Texas Instruments

MXD1210CSA+
MXD1210CSA+

Analog Devices Inc./Maxim Integrated

MXD1210CPA+
MXD1210CPA+

Analog Devices Inc./Maxim Integrated

4RCD0232KC1ATG
4RCD0232KC1ATG

Renesas Electronics Corporation

DS1312S-2+
DS1312S-2+

Analog Devices Inc./Maxim Integrated

DS1314S-2+T&R
DS1314S-2+T&R

Analog Devices Inc./Maxim Integrated

DS1321S+
DS1321S+

Analog Devices Inc./Maxim Integrated

DS1312S+
DS1312S+

Analog Devices Inc./Maxim Integrated

MXD1210ESA+
MXD1210ESA+

Analog Devices Inc./Maxim Integrated

DS1321E+
DS1321E+

Analog Devices Inc./Maxim Integrated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER