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Analog Devices Inc./Maxim Integrated DS1250AB-70

Part No.:
DS1250AB-70
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Memory
Package:
32-DIP Module (0.600", 15.24mm)
Datasheet:
AetrixDS1250AB-70.pdf
Description:
IC NVSRAM 4MBIT PARALLEL 32EDIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,758

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Product details

Overview

DS1250AB-70 from Maxim Integrated is a 4,194,304-bit (512k × 8) nonvolatile static RAM with integrated lithium backup, JEDEC-standard 32-pin DIP package, 70 ns access time, ±5% VCC tolerance (4.75–5.25 V), and industrial temperature rating (-40°C to +85°C). It replaces volatile SRAM in battery-backed data logging systems requiring guaranteed 10-year data retention without external support circuitry.

For engineers reviewing the DS1250AB-70 datasheet, DS1250AB-70 pinout, DS1250AB-70 application, or DS1250AB-70 equivalent, key selection criteria include write-protection voltage threshold (4.50–4.75 V), standby current (50–150 µA at CE = VCC−0.5 V), and compatibility with standard 32-pin byte-wide memory sockets in legacy industrial controllers.

Technical Context

The DS1250AB-70 implements autonomous power-fail detection and lithium switchover: when VCC drops below 4.5 V, it unconditionally enables write protection and transitions all outputs to high-impedance within 1.5 µs. Its internal control circuitry monitors VCC continuously and disconnects the lithium source until first power-up, preserving full battery capacity.

It operates as a drop-in replacement for 512k × 8 volatile SRAMs using standard asynchronous parallel bus timing - supporting independent CE/OE/WE control, tACC = 70 ns, tWC = 70 ns, and no external write-cycle management. The device requires no initialization sequence and supports unlimited write cycles with no wear leveling.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size4,194,304 bits (524,288 words × 8 bits); directly substitutes 512k × 8 SRAM in existing designs.
Access Time70 ns maximum; ensures compatibility with 14 MHz microprocessor buses without wait states.
VCC Range4.75 V to 5.25 V (±5%); supports stable operation across industrial-grade 5 V rails with minimal regulation.
Data Retention10 years minimum without external power; enabled by sealed lithium cell and automatic VCC-monitored switchover.
Write Protection Threshold4.50–4.75 V; triggers unconditional write lock before VCC reaches critical levels for data corruption.
Operating Temperature-40°C to +85°C (IND grade); qualified for deployment in outdoor metering, factory automation, and transportation control units.
Standby Current50–150 µA (CE = VCC−0.5 V); enables ultra-low-power data hold during extended brownout conditions.

Pinout & Package

DS1250AB-70 uses a JEDEC-standard 32-pin Extended DIP (740-mil) package with through-hole mounting. Pin 1 is marked with a notch or dot; pins are arranged in two rows of 16, with A0–A18, DQ0–DQ7, CE, WE, OE, VCC, GND, and NC terminals.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address Inputs19-bit address bus for full 524,288-word addressing; compatible with standard 80Cxx/68K-style memory controllers.
DQ0–DQ7Data I/OBi-directional 8-bit data bus; TTL-compatible inputs/outputs with 2 mA sink capability and high-impedance tri-state control.
CEChip EnableActive-low chip select; deassertion forces outputs to high-Z and disables internal logic to minimize standby current.
WEWrite EnableActive-low write strobe; controls data latching and initiates write cycle timing with tWP = 55 ns minimum.
OEOutput EnableActive-low output enable; allows read data to appear on DQ lines only when asserted, preventing bus contention.
VCCPower Supply+5 V supply input; powers SRAM core and control logic; monitored for fail-detect and lithium switchover.
GNDGroundReference return path for all signals and power; must be low-impedance to ensure noise immunity during write cycles.
NCNo ConnectUnbonded pin; left floating per design; no electrical connection to die or internal circuitry.

Key Features

FeatureDesign Value
Automatic Power-Fail SwitchoverSwitches to lithium backup within 1.5 µs of VCC decay below 4.5 V, ensuring zero data loss during abrupt power loss.
Freshness Seal TechnologyLithium cell remains electrically disconnected until first VCC application >4.25 V, guaranteeing full 10-year retention capacity at installation.
Unlimited Write CyclesNo endurance limit on write operations; eliminates need for wear-leveling firmware or write-cycle counters in host systems.
Standardized 32-Pin DIP InterfaceDirect replacement for legacy 512k × 8 SRAMs without PCB redesign; matches pinout of industry-standard byte-wide memory sockets.
Industrial Temperature QualificationValidated across -40°C to +85°C ambient; supports deployment in uncontrolled environments like utility substations and rail-side cabinets.

Applications

Smart Meter Data LoggingIndustrial PLC Configuration Storage

Use Scenario: Utility smart meters store hourly consumption, tamper events, and firmware update metadata across multi-year deployments without battery replacement.

IC Role / Device Role / Timing Role: Nonvolatile SRAM providing immediate-read/write memory with autonomous power-loss protection and 10-year data retention.

Use Value: Eliminates EEPROM/Flash write latency and endurance limits while maintaining deterministic 70 ns access for real-time metering interrupts.

Use Scenario: Programmable Logic Controllers retain ladder logic configuration, I/O mapping, and calibration constants during factory power outages or maintenance shutdowns.

IC Role / Device Role / Timing Role: Drop-in SRAM replacement that maintains volatile memory semantics while adding battery-backed persistence.

Use Value: Enables instant system recovery after power restoration without boot-time configuration reload or checksum validation delays.

Medical Device Event HistoryAvionics Black Box Buffer

Use Scenario: Portable diagnostic equipment records patient vital sign timestamps, alarm triggers, and sensor fault logs for FDA audit compliance.

IC Role / Device Role / Timing Role: High-reliability memory buffer with guaranteed data integrity during unexpected AC dropout or battery swap.

Use Value: Meets IEC 62304 Class C software requirements via hardware-enforced write protection and zero-software overhead persistence.

Use Scenario: Flight data recorders buffer real-time telemetry (attitude, engine parameters, control surface positions) prior to secure Flash storage.

IC Role / Device Role / Timing Role: Low-latency, high-endurance memory acting as a crash-proof front-end buffer during transient power anomalies.

Use Value: Provides deterministic 70 ns read/write timing and failsafe lithium switchover to capture final seconds of flight data even during total power failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DS1250Y-70IND+Wider VCC range (4.5–5.5 V, ±10%), lower write-protection threshold (4.25–4.5 V); otherwise identical pinout, timing, and retention.Better suited for systems with poorly regulated 5 V supplies or wider input voltage transients.Select DS1250Y-70IND+ if VCC ripple exceeds ±5%; DS1250AB-70IND+ preferred for tightly regulated industrial 5 V rails.
STK12C68-70ISame 512k × 8 organization and 70 ns speed, but uses external capacitor-based backup and lacks integrated lithium; requires external diode and capacitor.Lower BOM cost but demands additional board space and design validation for backup circuit reliability.Choose STK12C68-70I only when lithium-free design is mandated; DS1250AB-70IND+ provides superior long-term retention and zero-support-circuit simplicity.

Compared with DS1250Y-70IND+, the DS1250AB-70IND+ offers tighter VCC regulation tolerance and higher write-protection voltage - improving noise immunity in stable power environments. Against STK12C68-70I, DS1250AB-70IND+ delivers true plug-and-play nonvolatility with no external components or layout dependencies.

Availability

DS1250AB-70 is available at Aetrix Electronics and suitable for smart meter data logging, industrial PLC configuration storage, and medical device event history requiring stable component supply, long-lifecycle availability, and RoHS-compliant packaging.

Supply support for DS1250AB-70 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and power management ICs for industrial, automotive, and communications applications.

The DS1250AB-70 belongs to Maxim's nonvolatile SRAM product line, designed specifically to eliminate external backup circuitry while delivering guaranteed 10-year data retention in mission-critical industrial and instrumentation systems.

FAQ

What is the guaranteed data retention period for the DS1250AB-70?

The DS1250AB-70 guarantees a minimum 10-year data retention period in the absence of external power, measured from the time VCC is first applied. This is achieved via an integrated lithium energy source and freshness seal technology that preserves full battery capacity until initial power-up. The DS1250AB-70 meets this specification under industrial temperature conditions (-40°C to +85°C) without requiring external support components.

Does the DS1250AB-70 require external circuitry for battery backup operation?

No, the DS1250AB-70 does not require any external circuitry for battery backup operation. It integrates a lithium energy source, power-fail detection circuitry, and automatic switchover logic into a single JEDEC-standard 32-pin DIP package. The DS1250AB-70 manages all backup functions autonomously - including write protection activation, lithium connection/disconnection, and high-impedance output control - eliminating the need for diodes, capacitors, or supervisory ICs.

What is the difference between DS1250AB-70 and DS1250Y-70?

The DS1250AB-70 and DS1250Y-70 share identical memory size, timing (70 ns), pinout, and industrial temperature rating, but differ in VCC tolerance and write-protection voltage. The DS1250AB-70 operates over 4.75–5.25 V (±5%) with write protection triggered at 4.50–4.75 V, while the DS1250Y-70 supports 4.5–5.5 V (±10%) and protects at 4.25–4.5 V. Both are valid for DS1250AB-70IND+ and DS1250Y-70IND+ variants.

Can the DS1250AB-70 be used as a direct replacement for standard 512k × 8 SRAMs?

Yes, the DS1250AB-70 is designed as a direct pin-compatible replacement for standard 512k × 8 volatile SRAMs in JEDEC 32-pin DIP sockets. Its address (A0–A18), data (DQ0–DQ7), and control (CE, WE, OE) signals match industry-standard timing and voltage levels. No PCB changes, firmware modifications, or external components are needed to integrate the DS1250AB-70 into existing designs originally using volatile SRAM.

What is the purpose of the "Freshness Seal" feature in the DS1250AB-70?

The Freshness Seal feature in the DS1250AB-70 electrically disconnects the internal lithium energy source until the first application of VCC >4.25 V, preserving full battery capacity and ensuring the full 10-year data retention specification is met from installation. This prevents shelf-life degradation and guarantees optimal performance at deployment. The DS1250AB-70 activates the lithium source automatically on initial power-up - no user intervention or configuration is required.

DS1250AB-70 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
32-DIP Module (0.600", 15.24mm)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
NVSRAM
Technology:
NVSRAM (Non-Volatile SRAM)
Memory Size:
4Mbit
Memory Organization:
512K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
70ns
Access Time:
70 ns
Voltage - Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
32-EDIP

DS1250AB-70 FAQ

1.How can I place an order for DS1250AB-70 through Aetrix?

Please submit a Request for Quotation (RFQ) for DS1250AB-70 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS1250AB-70 reliable?

The price and inventory of DS1250AB-70 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1250AB-70 is usually 5 days.

3.What payment methods are accepted for DS1250AB-70?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1250AB-70 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS1250AB-70?

DS1250AB-70 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS1250AB-70 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS1250AB-70?

For technical support, including DS1250AB-70 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1250AB-70 requirements.

6.How does Aetrix verify that DS1250AB-70 is sourced from the original manufacturer or authorized distributors?

All DS1250AB-70 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1250AB-70 meets industry standards.

7.What is the process for return or replacement of DS1250AB-70?

All DS1250AB-70 units undergo pre-shipment inspection (PSI). If there is an issue with DS1250AB-70, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS1250AB-70 part is unused and in its original packaging.

Return procedure for DS1250AB-70:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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