Analog Devices Inc./Maxim Integrated DS1314E
- Part No.:
- DS1314E
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Controllers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
DS1314E.pdf
- Description:
- IC CTRL NV W/BATT MON 3V 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
DS1314E from Maxim Integrated is a nonvolatile SRAM controller with integrated lithium battery monitoring and power-fail reset functionality. It converts standard CMOS SRAM into nonvolatile memory by automatically switching to battery backup when VCCI drops below 2.8V (TOL=GND) or 2.5V (TOL=VCCO), provides open-drain RST and BW outputs, and operates across -40°C to +85°C in a 20-pin TSSOP package.
For engineers reviewing the DS1314E datasheet, DS1314E pinout, DS1314E application, or DS1314E equivalent, this device is selected for systems requiring reliable SRAM data retention during power loss, predictive lithium battery replacement, and processor reset coordination - especially in industrial instrumentation, point-of-sale terminals, and embedded controllers with long-term unattended operation.
Technical Context
The DS1314E integrates three core functions: precision VCCI voltage monitoring with selectable trip points (2.8V/2.5V), bidirectional power-switching logic that routes VBAT to VCCO only when VCCI falls below VSW (2.6–2.8V), and periodic loaded-battery testing every 24 hours using a 1.2 MΩ internal resistor to detect end-of-life conditions before data loss occurs.
Its RST output delivers a 200 ms nominal power-on reset pulse and activates within 15 µs of VCCI falling below VCCTP; BW asserts low when VBAT drops below 2.5–2.7V under load and remains latched until battery replacement. All critical outputs (RST, BW, CEO) are open-drain with 4 mA sink capability and require external pull-ups.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCI Trip Point | 2.8–3.0V (TOL=GND) or 2.5–2.7V (TOL=VCCO): sets precise power-fail detection threshold for write protection and reset assertion. |
| VCC/VBAT Switch Point | 2.6–2.8V (TOL=GND) or 2.4–2.6V (TOL=VCCO): defines minimum VCCI level at which battery takeover begins, ensuring <0.2V dropout on VCCO. |
| Battery Voltage Trip | 2.5–2.7V under 1.2 MΩ load: factory-programmed threshold for detecting lithium cell depletion during scheduled 1-second tests. |
| RST Pulse Width | 150–350 ms after VCCI rise: guarantees clean power-on reset timing sufficient to stabilize supply and expire tREC (12–125 ms). |
| Operating Current | 30–100 µA (CMOS inputs): ultra-low quiescent draw enabling multi-year battery life in backup mode. |
| RAM Supply Current | 140 mA max at VCCO ≥ VCCI −0.3V: supports typical 32KB–128KB SRAM loads without external regulation. |
| Battery Monitoring Interval | 24-hour cycle (tBTCN): balances battery longevity against early failure warning; suspended during power failure. |
Pinout & Package
DS1314E is housed in a 20-pin Thin Shrink Small Outline Package (TSSOP) with 0.65 mm pitch, JEDEC MO-180 compliant, RoHS-compliant (U20+1 package code), and rated for reflow soldering at 260°C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 5, 9, 11, 13, 14, 16, 17, 19, 20 | No Connection | Unbonded pins; must remain floating - no routing or grounding required. |
| 2 | VCCI | Main system supply input; monitored for out-of-tolerance condition triggering write protection and reset. |
| 3 | RST | Open-drain reset output; active-low, sinks 4 mA; asserts within 15 µs of VCCI fail and holds 200 ms on power-up. |
| 6 | BW | Open-drain battery warning output; latched low when VBAT < VBTP under load; requires external pull-up. |
| 8 | CEO | Chip enable output; driven low to write-protect SRAM when VCCI fails; held within 0.2V of VCCO during backup. |
| 10 | CEI | Chip enable input; controls CEO timing; delays write protection up to 1.5 µs to complete in-progress memory access. |
| 12 | VCCO | SRAM power supply output; sourced from VCCI or VBAT via internal low-dropout switch (<0.2V dropout). |
| 15 | VBAT | Lithium battery input; supplies VCCO during power failure; monitored every 24 hours with 1.2 MΩ test load. |
| 18 | TOL | Voltage tolerance select; GND = 3.0V nominal trip, VCCO = 2.7V nominal trip - configures VCCTP and VSW thresholds. |
| 19 | GND | Ground reference for all analog comparators, digital logic, and output drivers. |
Key Features
| Feature | Design Value |
|---|---|
| Nonvolatile SRAM Enablement | Automatically converts standard CMOS SRAM into nonvolatile memory via seamless VCCI-to-VBAT switchover with <0.2V dropout. |
| Programmable Power-Fail Threshold | Selectable 2.8V or 2.5V VCCTP via TOL pin connection - supports both 3.3V and 3.0V system rails without redesign. |
| Lithium Battery End-of-Life Detection | Periodic 1-second loaded-voltage test every 24 hours detects VBAT decay before data corruption risk arises. |
| Latched Battery Warning | BW output remains asserted until physical battery replacement - prevents silent data loss in unattended systems. |
| Freshness Seal Mode | Prevents battery drain during shipping/storage: VCCO remains inactive until first VCCI power-up and subsequent failure event. |
Applications
| Industrial Data Loggers | Point-of-Sale Terminals |
|---|---|
|
Use Scenario: Continuous logging of sensor readings in remote environmental monitoring stations powered intermittently by solar/battery. IC Role / Device Role / Timing Role: DS1314E acts as SRAM supervisor and battery health monitor - maintaining volatile memory integrity during grid outages and signaling battery replacement before field maintenance window. Use Value: Eliminates need for EEPROM/NVRAM writes during each log entry, reducing wear and extending memory lifetime while guaranteeing last-known-good state retention. |
Use Scenario: Transaction-critical retail terminals operating 24/7 with infrequent firmware updates and high uptime requirements. IC Role / Device Role / Timing Role: DS1314E provides coordinated power-fail response: asserting RST to halt CPU execution, disabling CEI to freeze SRAM, and activating BW to flag degraded backup battery prior to transaction loss. Use Value: Prevents partial transaction commits and ensures atomic rollback capability by synchronizing memory protection with processor reset timing. |
| Medical Diagnostic Equipment | Telecom Network Edge Devices |
|
Use Scenario: Portable ultrasound or ECG units storing calibration coefficients and recent patient waveforms in local SRAM between clinical sessions. IC Role / Device Role / Timing Role: DS1314E manages VCCO sourcing and monitors lithium coin cell health - enabling >5-year shelf life with Freshness Seal Mode and accurate end-of-life prediction. Use Value: Guarantees calibration persistence across battery replacements without recalibration cycles, meeting IEC 62304 traceability requirements. |
Use Scenario: Carrier-grade DSLAMs and ONU devices deployed in temperature-variable cabinets with limited service access. IC Role / Device Role / Timing Role: DS1314E serves as autonomous power supervisor - detecting brownouts, holding CPU in reset, and alerting network management via BW status before backup battery exhaustion causes configuration loss. Use Value: Reduces mean time to repair (MTTR) by enabling proactive battery replacement scheduling based on latched BW signal rather than reactive failure reports. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile SRAM controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS1315E | Includes integrated 256-byte NV SRAM; lacks battery monitoring circuitry and BW output. | Suitable where local nonvolatile storage is needed but battery health tracking is unnecessary. | Choose DS1315E only if embedded SRAM suffices and lithium cell lifetime prediction is not required. |
| MAX6900 | Dual-function RTC + nonvolatile controller; adds real-time clock, calendar, and alarm; higher ICC (250 µA typical). | Applicable when time-stamped logging or scheduled wake-up is required alongside SRAM backup. | Select MAX6900 when timestamping of backup events or periodic wake-up capability justifies added complexity and current draw. |
Compared with DS1314E, DS1315E eliminates battery monitoring but embeds SRAM, while MAX6900 adds RTC functionality at the cost of higher quiescent current and larger footprint - making DS1314E optimal for pure SRAM supervision with predictive battery management.
Availability
DS1314E is available at Aetrix Electronics and suitable for industrial data loggers, point-of-sale terminals, medical diagnostic equipment, and telecom network edge devices requiring stable component supply, long-lifecycle support, and guaranteed RoHS compliance.
Supply support for DS1314E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, medical, and communications applications.
The DS1314E belongs to Maxim's nonvolatile memory interface product line, engineered specifically to extend SRAM data retention in mission-critical systems where battery-backed reliability and predictive maintenance are essential.
FAQ
What is the primary function of the DS1314E in an SRAM-based system?
The DS1314E serves as a nonvolatile SRAM controller that ensures data integrity during power loss by automatically switching SRAM power from VCCI to VBAT, inhibiting chip enable to prevent writes, and asserting RST to halt processor activity. Its design enables standard CMOS SRAM to behave like nonvolatile memory without requiring changes to memory architecture or software - a key capability confirmed in the DS1314E functional block diagram and memory backup section.
How does the DS1314E determine when to activate the Battery Warning (BW) output?
The DS1314E activates BW by performing a 1-second loaded-voltage test every 24 hours: it connects VBAT to a 1.2 MΩ internal resistor and compares the resulting voltage to a factory-programmed trip point (2.5–2.7V). If VBAT falls below this threshold under load, BW is latched low and remains active until the battery is physically replaced - a behavior explicitly defined in the Battery Voltage Monitoring section and confirmed by tBTCN and VBTP specifications.
Can the DS1314E be used with both 3.3V and 3.0V system supplies?
Yes - the DS1314E supports dual supply configurations via the TOL pin: connecting TOL to GND selects a 2.8–3.0V VCCI trip point for 3.3V systems, while connecting TOL to VCCO selects a 2.5–2.7V trip point for 3.0V systems. This configurability is documented in the Recommended Operating Conditions table and POWER MONITORING section, and applies directly to the DS1314E variant.
What is the purpose of Freshness Seal Mode in the DS1314E?
Freshness Seal Mode prevents battery discharge during manufacturing, shipping, and storage by withholding VCCO output until after the first VCCI power-up and subsequent power-fail event. This ensures zero standby current draw from the lithium cell prior to system activation - a feature explicitly described in the DS1314E datasheet's "FRESHNESS SEAL MODE" subsection and unique to the DS1314 family.
Does the DS1314E require external pull-up resistors on its open-drain outputs?
Yes - the DS1314E's RST, BW, and CEO outputs are open-drain and must be pulled up externally to function correctly. The datasheet specifies that both RST and BW can sink 4 mA, and recommends external pull-up resistors for proper logic-level translation and noise immunity - a requirement stated in Note 11 of the DC Electrical Characteristics table and reinforced in the Timing Diagrams section.
DS1314E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Controller Type:
- Nonvolatile RAM
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
DS1314E FAQ
1.How can I place an order for DS1314E through Aetrix?
Please submit a Request for Quotation (RFQ) for DS1314E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS1314E reliable?
The price and inventory of DS1314E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1314E is usually 5 days.
3.What payment methods are accepted for DS1314E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1314E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS1314E?
DS1314E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS1314E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS1314E?
For technical support, including DS1314E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1314E requirements.
6.How does Aetrix verify that DS1314E is sourced from the original manufacturer or authorized distributors?
All DS1314E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1314E meets industry standards.
7.What is the process for return or replacement of DS1314E?
All DS1314E units undergo pre-shipment inspection (PSI). If there is an issue with DS1314E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS1314E part is unused and in its original packaging.
Return procedure for DS1314E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS1314E Tags

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BQ2201SN-N
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DS1314S+
Analog Devices Inc./Maxim Integrated
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BQ2205LYPW
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MXD1210CSA+
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4RCD0232KC1ATG
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DS1314S-2+T&R
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Analog Devices Inc./Maxim Integrated

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MXD1210ESA+
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DS1321E+
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