Analog Devices Inc./Maxim Integrated DS1321+
- Part No.:
- DS1321+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Controllers
- Package:
- 16-DIP (0.300", 7.62mm)
- Datasheet:
-
DS1321+.pdf
- Description:
- IC CTRLR NV W/BATT MON 5V 16-DIP
- Quantity:
- Payment:

- Shipping:

Inventory:1,157
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Product details
Overview
DS1321+ from Maxim Integrated is a flexible nonvolatile controller that converts CMOS SRAM into battery-backed nonvolatile memory, featuring automatic VCC fail detection (4.5–4.75 V trip), lithium battery voltage monitoring with 2.5–2.7 V trip point, and open-drain RST/BW outputs. It supports up to four SRAMs in three configurable banks and operates across –40°C to +85°C in 16-pin PDIP, SO, or 20-pin TSSOP packages.
For engineers reviewing the DS1321+ datasheet, DS1321+ pinout, DS1321+ application, or DS1321+ equivalent, key selection considerations include VCC tolerance select (TOL pin), mode-configurable SRAM bank mapping (MODE pin), battery warning timing (24-hour test cycle), and backup current capability (≤500 µA in battery mode).
Technical Context
The DS1321+ integrates precision voltage comparators for dual-threshold VCC monitoring (5% or 10% tolerance selectable via TOL), a low-leakage battery test circuit that applies a 1 MΩ internal load every 24 hours, and a controlled write-protection scheme that delays CEO inhibition up to 1.5 µs to complete in-progress memory accesses during power failure.
Its architecture includes an internal power switch with <0.2 V dropout between VBAT and VCCO, open-drain reset (RST) with 150–350 ms active hold on power-up, and battery warning (BW) latching behavior requiring physical battery replacement to clear - not resettable by power cycling alone.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Trip Point | 4.50–4.75 V (TOL=GND) or 4.25–4.50 V (TOL=VCCO); defines precise power-fail detection threshold |
| Battery Voltage Trip | 2.50–2.70 V under 1 MΩ load; triggers irreversible BW assertion before lithium cell end-of-life |
| Backup Supply Current | ≤500 µA typical in battery mode; enables multi-year SRAM retention on coin-cell backup |
| RST Active Duration | 150–350 ms after VCCI exceeds VCCTP; ensures reliable power-on reset for attached processors |
| Battery Test Interval | 24-hour periodic measurement; balances battery life preservation with early failure warning |
| CEO Propagation Delay | 12–20 ns; guarantees fast, deterministic SRAM write-protection activation during brownout |
| Operating Temperature | –40°C to +85°C; qualified for industrial embedded systems with extended thermal exposure |
Pinout & Package
DS1321+ is available in 16-pin PDIP (300 mil), 16-pin SO (150 mil), and 20-pin TSSOP packages. All variants share identical functional pin assignments except for NC placements; pin compatibility is maintained across packages for drop-in substitution where board layout permits.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCI | System Power Input | +5 V main supply; monitored for out-of-tolerance condition to trigger backup and reset |
| VCCO | SRAM Power Output | Switched output supplying SRAMs; sourced from VCCI or VBAT depending on power status |
| VBAT | Lithium Backup Input | Accepts 2.0–6.0 V lithium cell; powers SRAMs when VCCI drops below VCCTP |
| CEO1–CEO4 | SRAM Chip Enable Outputs | Open-drain signals that inhibit SRAM writes during power failure; held high ≤0.2 V below VCCO when active |
| CEI1–CEI4 | Chip Enable Inputs | Control inputs mirrored to corresponding CEOs; enable delayed write-protection hold (up to 1.5 µs) |
| RST | Reset Output | Open-drain processor reset signal; active low for ≥150 ms on power-up or power failure |
| BW | Battery Warning Output | Open-drain latched alert; remains active until battery is physically replaced |
| MODE | Memory Configuration Select | Latched at power-up to define SRAM bank grouping: 4×1, 2×2, or 1×4 topology |
| TOL | VCC Tolerance Select | GND = 5% trip (4.5–4.75 V), VCCO = 10% trip (4.25–4.50 V) |
| A / B | Address Inputs or CEI3/CEI4 | Shared pins supporting either address decoding or additional chip enable control per configuration |
| GND | Ground Reference | Common return path for all analog and digital circuitry; required for comparator accuracy |
Key Features
| Feature | Design Value |
|---|---|
| Freshness Seal Mode | Prevents battery drain during manufacturing and shipping by disabling VCCO until first VCCI power-up |
| Configurable Memory Banking | Three MODE-selectable topologies (4×1, 2×2, 1×4) allow flexible SRAM partitioning without hardware change |
| Load-Dependent Battery Monitoring | Measures VBAT under 1 MΩ internal load every 24 hours - avoids false warnings from open-circuit voltage stability |
| Controlled Write-Protection Timing | Delays CEO inhibition up to 1.5 µs after VCC failure detection to guarantee completion of active SRAM access cycles |
| Low-Battery Current Consumption | ≤100 nA battery standby current extends lithium cell life beyond 10 years in typical applications |
Applications
| Industrial Data Logger | Medical Diagnostic Device |
|---|---|
Use Scenario: Long-term environmental sensor data storage in unattended field deployments with intermittent mains power. IC Role / Device Role / Timing Role: Nonvolatile controller managing SRAM backup, power-fail detection, and battery health monitoring. Use Value: Ensures SRAM data integrity during grid outages and provides 24-hour battery warning to schedule maintenance before data loss. | Use Scenario: Patient vital sign buffers in portable ECG monitors requiring guaranteed memory retention during battery swaps. IC Role / Device Role / Timing Role: SRAM power supervisor with latched BW output and controlled RST timing for safe state capture. Use Value: Prevents clinical data corruption during power transitions and enforces battery replacement before end-of-life voltage collapse. |
| Programmable Logic Controller (PLC) | Point-of-Sale (POS) Terminal |
Use Scenario: Retaining configuration and runtime variables in factory automation controllers exposed to voltage sags and surges. IC Role / Device Role / Timing Role: Dual-role controller performing VCC monitoring, SRAM write-protection, and reset generation. Use Value: Eliminates need for external supervisors and discrete backup switches while supporting industrial temperature range operation. | Use Scenario: Preserving transaction logs and tax tables in retail terminals operating on AC power with occasional UPS backup. IC Role / Device Role / Timing Role: Battery-backed memory manager with configurable banking for multi-bank SRAM layouts. Use Value: Enables modular memory expansion (e.g., 2×2 bank mode) and reduces firmware complexity via hardware-level write protection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile SRAM controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS1230Y-100+ | Fixed 100 ns access time; no MODE/TOL pins; single 5% VCC threshold (4.75 V); no battery monitoring | Lacks configurable banking and battery warning; suited only for basic backup without health tracking | Select when simplicity and cost outweigh advanced monitoring and flexibility needs |
| MAX6900A+ | Integrated real-time clock; no SRAM banking; battery monitor uses different algorithm (no 1 MΩ load test); 3.3 V only | Designed for timekeeping + backup, not pure SRAM management; incompatible voltage domain and feature set | Choose only if RTC functionality is required alongside basic nonvolatile support |
Compared with DS1321+, DS1230Y-100+ offers simpler implementation but sacrifices battery health awareness and memory topology flexibility, while MAX6900A+ adds RTC capability at the expense of SRAM control granularity and 5 V compatibility.
Availability
DS1321+ is available at Aetrix Electronics and suitable for industrial data loggers, medical diagnostic devices, programmable logic controllers, point-of-sale terminals, and embedded instrumentation requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for DS1321+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, medical, and communications applications.
The DS1321+ belongs to Maxim's nonvolatile memory interface product line, engineered specifically to eliminate external discrete components in SRAM-based data retention systems while delivering accurate battery health assessment and robust power-fail response.
FAQ
What is the primary function of the DS1321+ in a system?
The DS1321+ serves as a flexible nonvolatile controller that converts standard CMOS SRAM into battery-backed memory. It monitors VCC for out-of-tolerance conditions, automatically switches to lithium battery backup, write-protects SRAM during power failure, and provides advanced battery health warning via the BW pin. Its core role is ensuring data integrity across power disruptions without firmware intervention.
How does the DS1321+ detect impending lithium battery failure?
The DS1321+ performs a loaded-battery voltage measurement every 24 hours by connecting VBAT to an internal 1 MΩ resistor for one second. If the resulting voltage falls below the factory-trimmed 2.5–2.7 V trip point, the open-drain BW pin is latched active. This method avoids false warnings from stable open-circuit voltage and requires physical battery replacement-not power cycling-to clear the warning.
Can the DS1321+ support different SRAM configurations, and how is this controlled?
Yes, the DS1321+ supports three SRAM memory configurations via the MODE pin: 4 banks × 1 SRAM (MODE = GND), 2 banks × 2 SRAMs (MODE = VCCO), or 1 bank × 4 SRAMs (MODE floating). The MODE state is latched at VCCI = VCCTP during power-up, enabling hardware-defined memory topology without software reconfiguration.
What is the significance of the TOL pin on the DS1321+?
The TOL pin selects the VCC trip point tolerance: tied to GND for 5% tolerance (4.50–4.75 V) or to VCCO for 10% tolerance (4.25–4.50 V). This allows system designers to match the DS1321+'s power-fail detection threshold to their specific power supply regulation and noise margin requirements without changing the IC.
Does the DS1321+ require external pull-up resistors, and why?
Yes, the DS1321+ requires external pull-up resistors on both the RST and BW pins because they are open-drain outputs. These resistors establish valid logic-high levels when the outputs are inactive. The DS1321+ can sink up to 10 mA on each pin, so pull-up values must be selected to ensure proper voltage levels and timing margins under worst-case load conditions.
DS1321+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 16-DIP (0.300", 7.62mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Controller Type:
- Nonvolatile RAM
- Voltage - Supply:
- 4.75V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 16-PDIP
DS1321+ FAQ
1.How can I place an order for DS1321+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS1321+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS1321+ reliable?
The price and inventory of DS1321+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1321+ is usually 5 days.
3.What payment methods are accepted for DS1321+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1321+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS1321+?
DS1321+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS1321+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS1321+?
For technical support, including DS1321+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1321+ requirements.
6.How does Aetrix verify that DS1321+ is sourced from the original manufacturer or authorized distributors?
All DS1321+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1321+ meets industry standards.
7.What is the process for return or replacement of DS1321+?
All DS1321+ units undergo pre-shipment inspection (PSI). If there is an issue with DS1321+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS1321+ part is unused and in its original packaging.
Return procedure for DS1321+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS1321+ Tags

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BQ2201SN-N
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