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Analog Devices Inc./Maxim Integrated DS1321E+T&R

Part No.:
DS1321E+T&R
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Controllers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixDS1321E+T&R.pdf
Description:
IC CTRL NV W/BATT MON 5V 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,541

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Product details

Overview

DS1321E+T&R from Maxim Integrated is a flexible nonvolatile SRAM controller with integrated lithium battery monitoring and power-fail detection. It converts up to four CMOS SRAMs into nonvolatile memory, provides automatic battery switchover (VBAT ≥ 2.0V), write-protection during VCCI out-of-tolerance (4.25–4.75V trip range), and open-drain RST/BW outputs. Used in industrial data loggers requiring persistent memory retention during AC loss.

For engineers reviewing the DS1321E+T&R datasheet, DS1321E+T&R pinout, DS1321E+T&R application, or DS1321E+T&R equivalent, this page delivers verified functional architecture, mode-selectable memory bank configuration (1/2/4 banks), battery voltage trip point (2.50–2.70V), and TSSOP-20 package-specific timing (tRPU = 150–350ms, tREC = 125ms).

Technical Context

The DS1321E+T&R implements a precision dual-threshold VCCI comparator (selectable 5% or 10% tolerance via TOL pin) that triggers both CEO inhibition and RST assertion within 15µs of power failure. Its internal 1MΩ battery test load enables loaded-voltage measurement every 24 hours to detect end-of-life lithium cells before data loss occurs.

It supports three memory configurations latched at power-up via MODE pin state (GND/VCCO/floating), drives VCCO ≤ VCCI − 0.2V during main supply operation, and sustains VCCO ≥ VBAT − 0.2V in backup mode with <0.2V switch drop. CEO outputs are actively held high for tREC (125ms) after VCCI recovery to prevent premature SRAM access.

Key Specifications

ParameterValue and Actual Design Meaning
VCCI Trip Range4.25–4.75V (selectable 5% or 10% tolerance via TOL pin)
VBAT Trip Point2.50–2.70V factory-programmed threshold for battery warning activation
RST Active Duration150–350ms nominal power-on reset pulse ensures stable system boot
Battery Test Interval24-hour periodic loaded-voltage measurement using internal 1MΩ resistor
VCCO Output Capability185mA max at VCCO ≥ VCCI − 0.2V; 260mA max at VCCO ≥ VCCI − 0.3V
CEO Propagation Delay12–20ns CEI-to-CEO delay preserves memory access timing integrity
Operating Temp Range−40°C to +85°C industrial grade operation without derating

Pinout & Package

DS1321E+T&R is housed in a RoHS-compliant 20-pin TSSOP (U20+1) package with 0.65mm pitch, 6.5mm × 4.4mm body size, and thermal resistance θJA = 73.8°C/W.

Pin/TerminalCircuit RoleDesign Meaning
1, 20NCNo connection - unused pins per device function mapping
2VCCI+5V main supply input; monitored for out-of-tolerance condition
3RSTOpen-drain reset output active low; holds processor in reset for 150–350ms on power-up
4BWOpen-drain battery warning output; asserts when loaded VBAT falls below 2.50–2.70V
5–8CEO1–CEO4Chip enable outputs; inhibited during power failure to write-protect attached SRAMs
10MODEMemory configuration select input; latched at VCCI = VCCTP to define 1/2/4-bank SRAM layout
11VCCOSRAM power supply output; sourced from VCCI or VBAT depending on supply status
12VBATLithium battery input (2.0–6.0V); powers SRAMs when VCCI fails
13TOLVCCI tolerance select; GND = 5% (4.50–4.75V), VCCO = 10% (4.25–4.50V)
14–15CEI1–CEI2Chip enable inputs; control corresponding CEO outputs in normal operation
16NCNo connection - reserved for package symmetry
17A/CEI3Address input or third chip enable input; dual-function pin per memory mode
18B/CEI4Address input or fourth chip enable input; dual-function pin per memory mode
19GNDGround reference for all analog and digital circuitry

Key Features

FeatureDesign Value
Flexible SRAM Bank ConfigurationThree selectable modes (1/2/4 banks) via single MODE pin, enabling optimal memory partitioning without hardware change
Loaded Battery Voltage Monitoring24-hour periodic test using internal 1MΩ load ensures accurate end-of-life prediction without continuous drain
Controlled Write-Protection TimingUp to 1.5µs delay before CEO inhibition guarantees completion of in-progress SRAM accesses during power failure
Freshness Seal ModePrevents battery discharge during shipping/storage by blocking VCCO until first VCCI power-up
Open-Drain RST/BW OutputsSupports mixed-voltage systems via external pull-ups; each sinks ≥4mA at 0.4V for robust interfacing

Applications

Industrial Data LoggerMedical Device Memory Backup

Use Scenario: Continuous sensor data acquisition in remote environmental monitoring stations with intermittent AC power.

IC Role / Device Role / Timing Role: Nonvolatile controller managing four 256K×8 SRAMs; provides seamless battery switchover and write-protection during grid outage.

Use Value: Ensures zero data loss during 100ms–5s brownouts via tREC = 125ms hold time and <0.2V VCCO switch drop.

Use Scenario: Patient vital sign recorder requiring FDA-compliant data persistence across unplanned power cycles.

IC Role / Device Role / Timing Role: Lithium-backed memory supervisor with battery health monitoring; activates BW output 72 hours before cell depletion.

Use Value: Enables proactive battery replacement during maintenance windows, avoiding unlogged critical events.

Point-of-Sale TerminalProgrammable Logic Controller

Use Scenario: Transaction rollback protection in retail terminals where power interruption must not corrupt sales records.

IC Role / Device Role / Timing Role: SRAM write-protector and reset generator; inhibits CEO outputs within 15µs of VCCI dip below 4.5V.

Use Value: Guarantees atomic transaction commit by completing final memory writes before asserting RST.

Use Scenario: Real-time I/O state retention in factory automation controllers operating 24/7 in harsh electrical environments.

IC Role / Device Role / Timing Role: Dual-role controller providing both power-fail reset (tRPU = 200ms nominal) and battery-backed RAM management.

Use Value: Maintains deterministic PLC scan cycle execution by synchronizing RST deassertion with VCCI stabilization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DS1230Y-100+Fixed 100ns RST pulse width; no battery monitoring; PDIP-28 onlyLacks BW output and 24-hour battery test; suitable only for basic backup without health reportingSelect when battery life prediction is unnecessary and board space allows larger PDIP package
MAX6900AESA+Integrated RTC + NV SRAM controller; I²C interface; no MODE-selectable bank configurationProvides real-time clock functionality but requires software configuration; no hardware-mode flexibilitySelect when time-stamped logging is required and firmware can manage memory mapping

Compared with DS1321E+T&R, DS1230Y-100+ offers simpler reset timing but no battery health awareness, while MAX6900AESA+ adds RTC capability at the cost of fixed memory topology and I²C dependency-neither matches DS1321E+T&R's hardware-configurable bank architecture and autonomous 24-hour battery testing.

Availability

DS1321E+T&R is available at Aetrix Electronics and suitable for industrial data loggers, medical device memory backup, and programmable logic controllers requiring stable component supply with guaranteed long-term lifecycle support.

Supply support for DS1321E+T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, automotive, and communications systems.

The DS1321E+T&R belongs to Maxim's nonvolatile memory controller product line, engineered specifically to eliminate external discrete components in SRAM battery-backup systems while delivering autonomous battery health monitoring and configurable memory topology.

FAQ

What is the function of the MODE pin on the DS1321E+T&R?

The MODE pin on the DS1321E+T&R determines SRAM bank organization at power-up: grounded for four independent banks (1 SRAM each), tied to VCCO for two banks (2 SRAMs each), or floating for one bank (4 SRAMs). Its state is latched when VCCI crosses VCCTP, enabling hardware-defined memory mapping without firmware intervention. This behavior is confirmed in the DS1321E+T&R functional description and Figure 1 of the datasheet.

How does the DS1321E+T&R perform battery voltage monitoring without draining the lithium cell?

The DS1321E+T&R performs battery voltage monitoring by connecting VBAT to an internal 1MΩ test resistor for exactly one second every 24 hours (tBTCN), measuring loaded voltage against a 2.50–2.70V trip point. This infrequent, short-duration test minimizes cumulative current draw-typical battery current in backup mode is just 100nA-ensuring multi-year cell life. The DS1321E+T&R datasheet explicitly states this method prevents excessive drain while enabling reliable end-of-life prediction.

What is the maximum SRAM load current the DS1321E+T&R can drive in normal operation?

The DS1321E+T&R can supply up to 185mA to attached SRAMs when VCCO ≥ VCCI − 0.2V, and up to 260mA when VCCO ≥ VCCI − 0.3V. These values are specified in the DC Electrical Characteristics table under ICCO1 and ICCO2 parameters. Exceeding these limits risks VCCO droop and memory corruption; design margin should be maintained per DS1321E+T&R recommended operating conditions.

Can the DS1321E+T&R operate with a 3.3V main supply?

No-the DS1321E+T&R is specified only for 5V operation: VCCI min is 4.5V (TOL=VCCO) or 4.75V (TOL=GND), with absolute max 5.5V. It lacks 3.3V-compatible input thresholds or VCCO regulation for lower voltages. Attempting 3.3V operation violates the DS1321E+T&R recommended operating conditions and will cause unreliable power-fail detection, incorrect CEO timing, and potential latch-up per Absolute Maximum Ratings.

What happens to the CEO outputs during a power failure event on the DS1321E+T&R?

During a VCCI power failure, the DS1321E+T&R inhibits CEO1–CEO4 by holding them within 0.2V of VCCO to enforce SRAM write-protection. If any CEI input is active (low) when failure occurs, the corresponding CEO remains low until that CEI goes high-or is forced high after 1.5µs if CEI stays low. This ensures ongoing memory accesses complete before protection engages, as defined in the DS1321E+T&R memory backup section and AC timing specifications.

DS1321E+T&R Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Controller Type:
Nonvolatile RAM
Voltage - Supply:
4.75V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP

DS1321E+T&R FAQ

1.How can I place an order for DS1321E+T&R through Aetrix?

Please submit a Request for Quotation (RFQ) for DS1321E+T&R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS1321E+T&R reliable?

The price and inventory of DS1321E+T&R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1321E+T&R is usually 5 days.

3.What payment methods are accepted for DS1321E+T&R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1321E+T&R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS1321E+T&R?

DS1321E+T&R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS1321E+T&R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS1321E+T&R?

For technical support, including DS1321E+T&R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1321E+T&R requirements.

6.How does Aetrix verify that DS1321E+T&R is sourced from the original manufacturer or authorized distributors?

All DS1321E+T&R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1321E+T&R meets industry standards.

7.What is the process for return or replacement of DS1321E+T&R?

All DS1321E+T&R units undergo pre-shipment inspection (PSI). If there is an issue with DS1321E+T&R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS1321E+T&R part is unused and in its original packaging.

Return procedure for DS1321E+T&R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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