Analog Devices Inc./Maxim Integrated DS1321S
- Part No.:
- DS1321S
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Controllers
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
DS1321S.pdf
- Description:
- IC CTRLR NV W/BATT MON 5V 16SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
DS1321S from Maxim Integrated is a flexible nonvolatile SRAM controller with integrated lithium battery monitoring and power-fail detection. It converts up to four CMOS SRAMs into nonvolatile memory, provides automatic battery switchover (VBAT ≥ 2.0V), unconditionally write-protects SRAM on VCCI out-of-tolerance (4.50–4.75V trip), and delivers open-drain RST and BW outputs. Used in industrial data loggers requiring persistent memory during AC power loss.
For engineers reviewing the DS1321S datasheet, DS1321S pinout, DS1321S application, or DS1321S equivalent, key selection considerations include its 16-pin SO package, 4.5–5.5V VCCI operating range, 24-hour periodic battery voltage test, 200ms power-on reset pulse, and support for three SRAM bank configurations via MODE pin.
Technical Context
The DS1321S implements precision voltage monitoring using internal comparators for both VCCI (with selectable 5% or 10% tolerance via TOL pin) and VBAT (2.50–2.70V trip point). Its battery test circuit applies a 1MΩ load for 1 second every 24 hours to measure loaded voltage-enabling early end-of-life warning without excessive battery drain.
It integrates dual-function outputs: RST provides power-on reset (200ms nominal hold time) and power-fail reset (15µs response), while BW signals low-battery condition via open-drain output. The device supports three SRAM memory configurations (1×4, 2×2, or 4×1 banks) latched at power-up based on MODE pin state (GND/VCCO/floating).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCCI Operating Range | 4.5V–5.5V; supports standard +5V systems with ±5% or ±10% power-fail detection depending on TOL pin connection. |
| VBAT Input Range | 2.0V–6.0V; enables use of common lithium backup cells (e.g., CR2032, BR2032) with 0.2V max dropout in backup mode. |
| VCCO Output Capability | 185mA max at VCCO ≥ VCCI − 0.2V; sufficient to drive four 32k×8 SRAMs simultaneously under system power. |
| Battery Test Interval | 24 hours nominal; minimizes battery self-discharge while enabling reliable early-warning detection before data loss. |
| RST Pulse Width | 150–350ms after VCCI rise; ensures stable processor reset during power-up transients and allows tREC (125ms) to complete. |
| CEO Propagation Delay | 12–20ns; guarantees fast, deterministic SRAM write-protection activation within 1.5µs of power failure detection. |
| Operating Current (CMOS) | 100–150µA; ultra-low quiescent current preserves battery life during long-term backup operation. |
Pinout & Package
DS1321S is housed in a 16-pin small-outline (SO) package (150-mil width), RoHS-compliant, with 75°C/W junction-to-ambient thermal resistance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VCCI | +5V System Power Input | Main supply input monitored for out-of-tolerance; triggers battery switchover and write protection when below VCCTP. |
| 2 RST | Open-Drain Reset Output | Asserts active-low reset during power-up (200ms) and power failure; requires external pullup for proper logic level. |
| 3 BW | Open-Drain Battery Warning | Signals impending lithium cell end-of-life; remains asserted until battery is physically replaced. |
| 4 CEO1 | Chip Enable Output #1 | Controls write-enable path to first SRAM bank; held high during power failure to enforce unconditional write protection. |
| 5 CEO2 | Chip Enable Output #2 | Controls write-enable path to second SRAM bank; synchronized with CEO1–CEO4 for coordinated memory protection. |
| 6 CEO3 | Chip Enable Output #3 | Controls write-enable path to third SRAM bank; latched behavior prevents partial writes during brownout. |
| 7 CEO4 | Chip Enable Output #4 | Controls write-enable path to fourth SRAM bank; supports all three memory configurations (1×4, 2×2, 4×1). |
| 8 MODE | Memory Configuration Select | Latched at VCCI = VCCTP on power-up; GND = 4 banks × 1 SRAM, VCCO = 2 banks × 2 SRAMs, floating = 1 bank × 4 SRAMs. |
| 9 VCCO | SRAM Power Supply Output | Delivers regulated +5V-equivalent output to SRAMs; sourced from VCCI or VBAT depending on power status. |
| 10 VBAT | Lithium Backup Battery Input | Accepts 2.0–6.0V backup source; powers VCCO and enables battery voltage monitoring via internal 1MΩ load. |
| 11 TOL | VCCI Tolerance Select | GND = 5% trip (4.50–4.75V), VCCO = 10% trip (4.25–4.50V); sets sensitivity of power-fail detection window. |
| 12 CEI1 | Chip Enable Input #1 | Active-low enable signal from host processor; controls CEO1 timing and delay behavior during power failure. |
| 13 CEI2 | Chip Enable Input #2 | Active-low enable signal from host processor; used in multi-SRAM configurations to gate access per bank. |
| 14 A/CEI3 | Address Input / CEI #3 | Dual-function pin: serves as address bit A or third chip enable input depending on MODE configuration. |
| 15 B/CEI4 | Address Input / CEI #4 | Dual-function pin: serves as address bit B or fourth chip enable input depending on MODE configuration. |
| 16 GND | Ground Reference | Common return path for VCCI, VCCO, VBAT, and all digital I/O; required for accurate voltage threshold detection. |
Key Features
| Feature | Design Value |
|---|---|
| Unconditional SRAM Write Protection | CEO1–CEO4 forced high within 1.5µs of VCCI drop below VCCTP-guarantees no partial writes during brownout. |
| Configurable Memory Organization | Three modes (1×4, 2×2, 4×1) selected by MODE pin state at power-up-enables flexible SRAM layout without redesign. |
| Loaded-Battery Voltage Monitoring | 1MΩ internal load applied for 1s every 24h-measures actual battery capacity under load, not just open-circuit voltage. |
| Freshness Seal Mode | Prevents battery discharge during storage-VBAT only powers VCCO after first VCCI power-up, preserving shelf life. |
| Programmable Power-Fail Threshold | TOL pin selects between 5% (4.50–4.75V) or 10% (4.25–4.50V) VCCI trip window-matches system regulator tolerance. |
Applications
| Industrial Data Logger | Medical Device Memory Backup |
|---|---|
Use Scenario: Continuous environmental sensor data logging in remote substations with intermittent AC power. IC Role / Device Role / Timing Role: Nonvolatile controller managing four 256k×8 SRAMs; provides battery-backed write protection and 200ms power-on reset. Use Value: Ensures zero data loss during grid brownouts by switching to lithium backup within 15µs and holding memory contents for >10 years. | Use Scenario: Patient vital sign recorder in portable ECG monitors requiring FDA-compliant data retention during battery swaps. IC Role / Device Role / Timing Role: SRAM backup supervisor with Freshness Seal Mode and battery warning-prevents premature discharge before first clinical use. Use Value: Guarantees 24-hour battery test cycle detects weak cells before deployment, reducing field failures and audit risk. |
| Point-of-Sale Terminal | Telecom Base Station Controller |
Use Scenario: Transaction journaling in retail terminals subject to frequent power cycling and surges. IC Role / Device Role / Timing Role: Dual-role controller providing both RST-based processor reset and CEO-based SRAM write lock during voltage sags. Use Value: Eliminates corrupted transaction logs by enforcing atomic write completion-even if power fails mid-access (1.5µs delay window). | Use Scenario: Configuration memory preservation in outdoor 4G/LTE base station controllers exposed to wide temperature swings (-40°C to +85°C). IC Role / Device Role / Timing Role: Industrial-grade SRAM controller with extended temp rating and 75°C/W θJA-maintains reliability in sealed enclosures. Use Value: Delivers 185mA VCCO drive capability across full temperature range, supporting dense SRAM arrays without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar nonvolatile SRAM controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS1230Y | 5V-only, fixed 5% VCC trip, no MODE pin, no battery monitoring, 28-pin DIP only | Lacks configurable memory organization and battery warning; suited for legacy designs with single-SRAM topology | Select DS1230Y only if battery monitoring and multi-bank flexibility are unnecessary and PCB layout accommodates 28-pin DIP. |
| MAX690T | Microprocessor supervisory circuit with reset and watchdog only; no SRAM control or battery switchover logic | Provides reset and power monitoring but cannot replace DS1321S's core function of SRAM nonvolatility management | Use MAX690T only as supplemental reset supervisor alongside a separate SRAM controller-not as direct functional alternative. |
Compared with DS1230Y and MAX690T, the DS1321S uniquely integrates SRAM write protection, battery-backed power switchover, programmable memory configuration, and predictive lithium cell monitoring in a single 16-pin SO package-eliminating need for discrete supervisors, logic, and analog monitoring circuits.
Availability
DS1321S is available at Aetrix Electronics and suitable for industrial data loggers, medical device memory backup, point-of-sale terminals, and telecom base station controllers requiring stable component supply and long-term lifecycle support.
Supply support for DS1321S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, medical, and communications applications.
The DS1321S belongs to Maxim's nonvolatile memory controller product line, engineered specifically to eliminate external circuitry needed to convert standard SRAMs into battery-backed nonvolatile memory with intelligent health monitoring.
FAQ
What is the primary function of the DS1321S in a memory subsystem?
The DS1321S serves as a flexible nonvolatile SRAM controller that automatically converts up to four CMOS SRAMs into nonvolatile memory. It monitors VCCI for power failure, switches to battery backup, inhibits chip enables to prevent writes, and asserts RST and BW outputs. The DS1321S handles all critical functions-including voltage threshold detection, SRAM power routing, and battery health monitoring-without external components.
How does the DS1321S determine which SRAM memory configuration to use?
The DS1321S latches the MODE pin state at the moment VCCI crosses the VCCTP threshold during power-up. If MODE = GND, it configures four independent banks (1 SRAM each); if MODE = VCCO, it configures two banks (2 SRAMs each); if MODE is floating, it configures one bank (4 SRAMs). This configuration is fixed for the power cycle and cannot be changed dynamically. The DS1321S uses this setting to route CEI inputs to the appropriate CEO outputs.
What happens to the DS1321S outputs during a power failure event?
During a power failure, the DS1321S immediately activates RST (open-drain, active-low) and forces CEO1–CEO4 high (within 15µs) to disable SRAM writes. VCCO remains powered by VBAT, preserving SRAM data. CEI inputs are sampled: if any CEI is low when failure occurs, the corresponding CEO stays low for up to 1.5µs to complete the ongoing access, then goes high. The DS1321S maintains these states until VCCI recovers above VCCTP and tREC (125ms) expires.
Can the DS1321S monitor battery health while the system is powered down?
No-the DS1321S performs battery voltage monitoring only when VCCI is nominal (≥ VCCTP). It applies a 1MΩ internal load for 1 second every 24 hours to measure loaded voltage-but this test is suspended during power failure or VCCI undervoltage. Systems using DS1321S battery monitoring must be powered up periodically (at least once every few months) to ensure timely detection of battery degradation; otherwise, the cell may deplete fully without warning.
What are the key electrical differences between the DS1321S and the DS1321E package variants?
The DS1321S (16-pin SO) and DS1321E (20-pin TSSOP) share identical electrical specifications, functionality, and timing parameters-including VCCI trip points, battery test intervals, RST pulse width, and CEO propagation delay. The only differences are mechanical: pin count (16 vs. 20), package type (SO vs. TSSOP), thermal resistance (75°C/W vs. 73.8°C/W θJA), and pin assignment (e.g., DS1321E has dedicated A/B pins, while DS1321S multiplexes A/CEI3 and B/CEI4). The DS1321S does not support the extra NC pins present in the TSSOP variant.
DS1321S Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Controller Type:
- Nonvolatile RAM
- Voltage - Supply:
- 4.75V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
DS1321S FAQ
1.How can I place an order for DS1321S through Aetrix?
Please submit a Request for Quotation (RFQ) for DS1321S on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS1321S reliable?
The price and inventory of DS1321S are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS1321S is usually 5 days.
3.What payment methods are accepted for DS1321S?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS1321S transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS1321S?
DS1321S orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS1321S order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS1321S?
For technical support, including DS1321S datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS1321S requirements.
6.How does Aetrix verify that DS1321S is sourced from the original manufacturer or authorized distributors?
All DS1321S products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS1321S meets industry standards.
7.What is the process for return or replacement of DS1321S?
All DS1321S units undergo pre-shipment inspection (PSI). If there is an issue with DS1321S, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS1321S part is unused and in its original packaging.
Return procedure for DS1321S:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS1321S Tags

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BQ2201SN-N
Texas Instruments

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DS1314S+
Analog Devices Inc./Maxim Integrated
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BQ2205LYPW
Texas Instruments
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MXD1210CSA+
Analog Devices Inc./Maxim Integrated

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MXD1210CPA+
Analog Devices Inc./Maxim Integrated

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4RCD0232KC1ATG
Renesas Electronics Corporation
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DS1312S-2+
Analog Devices Inc./Maxim Integrated
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DS1314S-2+T&R
Analog Devices Inc./Maxim Integrated

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DS1321S+
Analog Devices Inc./Maxim Integrated

-
DS1312S+
Analog Devices Inc./Maxim Integrated
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MXD1210ESA+
Analog Devices Inc./Maxim Integrated

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DS1321E+
Analog Devices Inc./Maxim Integrated
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