Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Analog Devices Inc./Maxim Integrated DS2030AB-70#

Part No.:
DS2030AB-70#
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Memory
Package:
256-BGA
Datasheet:
AetrixDS2030AB-70#.pdf
Description:
IC NVSRAM 256KBIT PAR 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,397

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

DS2030AB-70# from Maxim Integrated is a 256kb (32k × 8) reflowable nonvolatile SRAM integrating static RAM, NV controller, and rechargeable manganese lithium (ML) battery in a single 256-ball BGA module. It operates at 5V ±5%, provides 70ns access time, unconditionally write-protects on VCC drop below 4.5V, and delivers up to 3 years of data retention per charge-used in RAID systems, industrial controllers, and fire alarms where power-fail resilience is critical.

For engineers reviewing the DS2030AB-70# datasheet, DS2030AB-70# pinout, DS2030AB-70# application, or DS2030AB-70# equivalent, key selection considerations include its 5% VCC trip point, open-drain RST supervisor output, 27mm² BGA footprint, industrial temperature range (–40°C to +85°C), and compatibility with standard convection reflow soldering without battery removal.

Technical Context

The DS2030AB-70# implements autonomous power-fail detection using an internal voltage reference (VTP = 4.50V nominal) that triggers unconditional SRAM write-protection and seamless switchover to ML battery backup within 1.5µs. Its integrated charger regulates battery voltage with temperature-stabilized reference and short-circuit protection, enabling full charge in 96 hours.

Functionally, it behaves as a drop-in replacement for standard 32k×8 SRAMs with identical address/data/control interface (A0–A14, DQ0–DQ7, CE/OE/WE), while adding system-level supervision via the open-drain RST output-asserted low when VCC falls below trip threshold and held active for 225–525ms after recovery to ensure microprocessor readiness.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size256kb (32k × 8 bits): matches standard SRAM footprint for direct substitution in legacy designs.
Access Time70ns: enables reliable operation with 14MHz microcontrollers and fast bus cycles.
VCC Trip Point4.50V (5% below 5V nominal): precise undervoltage detection ensures early write-protection before logic corruption.
Data Retention3 years per charge: sustained by internal ML battery without external circuitry or user intervention.
Operating Temperature–40°C to +85°C: validated for industrial control, networking, and safety-critical environments.
Package256-ball BGA, 27mm² footprint: surface-mount compatible with automated assembly and reflow processes.
RST OutputOpen-drain, 10mA sink capability: directly interfaces with 5V microprocessor reset inputs using standard pull-up resistor.

Pinout & Package

DS2030AB-70# uses a 256-ball PBGA package (27mm²) with 1.0mm ball pitch. Pin assignments follow JEDEC-standard BGA layout with dedicated ground planes, address/data buses, and isolated control signals.

Pin/TerminalCircuit RoleDesign Meaning
A0–A14Address Inputs15-bit address bus supporting full 32k-word addressing; tolerant of asynchronous transitions during power-down.
DQ0–DQ7Data I/O8-bit bidirectional data bus with 2mA drive strength; high-impedance during standby and power-fail modes.
CE, OE, WEControl InputsStandard SRAM control interface; CE active-low enables chip, OE controls output drivers, WE gates writes-fully compliant with 8051 and Z80 timing.
RSTOpen-Drain Reset OutputAsserts low on VCC failure; requires external 1kΩ–10kΩ pull-up; holds active ≥225ms after VCC recovery to guarantee processor reset integrity.
VCCSupply Voltage5V ±5% main supply; powers SRAM and charges internal ML battery simultaneously during normal operation.
GNDGroundMultiple dedicated ground balls (A1/A2/A3/A4, V1/V2/V3/V4, W1/W2/W3/W4, Y1/Y2/Y3/Y4, A17–A20, W17–W20, Y17–Y20) minimize noise and improve power integrity.

Key Features

FeatureDesign Value
Single-piece reflowable constructionEliminates manual battery handling; withstands 225°C convection reflow without degradation-enables full SMT automation.
Unconditional write-protectionActivates instantly at VCC ≤4.50V, preventing partial writes and data corruption regardless of software state or bus activity.
Integrated ML battery chargingSelf-regulating charger achieves full capacity in 96 hours; UL-recognized circuitry includes thermal stabilization and short-circuit protection.
System-level CPU supervisionRST output meets microprocessor reset timing requirements (tRPU = 225–525ms), replacing discrete supervisor ICs in compact designs.
Industrial-grade reliabilityValidated across –40°C to +85°C; UL Recognized (File E99151); supports >20 deep-discharge cycles with 60-year worst-case service life.

Applications

RAID Systems and ServersIndustrial Controllers

Use Scenario: Maintaining cache metadata and configuration registers during unexpected AC loss or hot-swap events in enterprise storage arrays.

IC Role / Device Role / Timing Role: Nonvolatile SRAM providing instant power-fail write-protection and battery-backed memory retention for critical firmware state.

Use Value: Prevents RAID rebuild failures and configuration loss by preserving 32k bytes of volatile context without external backup capacitors or EEPROM wear-out.

Use Scenario: Storing PLC ladder logic variables, I/O mapping tables, and calibration constants in factory automation systems subject to brownouts.

IC Role / Device Role / Timing Role: Direct-replacement SRAM with embedded power-monitoring and reset generation for deterministic fail-safe behavior.

Use Value: Ensures deterministic state recovery after power interruption-no firmware reboot delay or initialization sequence required upon restoration.

Fire Alarm Control PanelsData-Acquisition Systems

Use Scenario: Retaining alarm event logs, sensor fault history, and device commissioning data during extended mains outages in life-safety systems.

IC Role / Device Role / Timing Role: UL-recognized nonvolatile memory with guaranteed 3-year data retention per charge cycle under continuous backup conditions.

Use Value: Meets NFPA 72 compliance for minimum 24-hour backup without external batteries-reducing bill-of-materials and field maintenance.

Use Scenario: Capturing transient sensor readings (e.g., vibration, temperature spikes) in remote monitoring nodes powered by intermittent solar or battery sources.

IC Role / Device Role / Timing Role: High-speed (70ns) SRAM buffer that preserves last-valid measurement set during power collapse before shutdown.

Use Value: Eliminates need for slow-write EEPROM or flash; avoids data loss during rapid power cycling typical in energy-harvesting deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar nonvolatile SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DS2030AB-100#Slower 100ns access time; identical 5% VCC trip point, package, and pinout.Suitable for cost-sensitive designs with relaxed timing budgets (e.g., low-speed PLCs).Select DS2030AB-100# only if system clock rate permits longer memory access latency.
DS2030Y-70#Same 70ns speed but 10% VCC trip point (4.25V); otherwise identical architecture and package.Better suited for systems with wider VCC tolerance or higher noise immunity requirements.Choose DS2030Y-70# when operating near 5V lower limit or in electrically noisy industrial environments.

Compared with DS2030AB-70#, DS2030AB-100# trades speed for cost in timing-tolerant applications, while DS2030Y-70# shifts undervoltage detection threshold downward-neither offers pin-to-pin or functional equivalence without verifying system-level voltage margin and timing slack.

Availability

DS2030AB-70# is available at Aetrix Electronics and suitable for RAID systems, industrial controllers, and fire alarm panels requiring stable component supply with long-term lifecycle support and RoHS-compliant manufacturing.

Supply support for DS2030AB-70# includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power-management ICs for industrial, automotive, and communications markets.

The DS2030AB-70# belongs to Maxim's nonvolatile memory product line, engineered specifically for mission-critical applications demanding zero-data-loss power failover without external support components.

FAQ

What is the guaranteed data retention time for DS2030AB-70# under continuous backup conditions?

The DS2030AB-70# provides a minimum expected data-retention time of 2 years and a typical value of 3 years per full charge cycle at +25°C. This specification assumes initial 96-hour charging period and accounts for two 230°C reflow exposures. Retention is maintained solely by the internal ML battery without external circuitry or user intervention.

Does DS2030AB-70# require external components to function as a nonvolatile SRAM?

No, DS2030AB-70# operates as a self-contained nonvolatile SRAM-no external battery, capacitor, or supervisor IC is needed. It integrates rechargeable ML battery, charger, voltage monitor, and power-switching circuitry. Only a 0.1µF ceramic decoupling capacitor on VCC and a pull-up resistor on RST are recommended for optimal performance.

How does the RST output of DS2030AB-70# behave during power-up and power-down sequences?

During power-down, RST asserts low within 3.0µs after VCC falls below 4.50V and remains active until VCC drops below battery voltage. During power-up, RST stays low for 225–525ms after VCC exceeds 4.50V-ensuring the SRAM completes recovery (tREC = 125ms) before the microprocessor resumes operation.

Can DS2030AB-70# be soldered using standard lead-free reflow profiles?

Yes, DS2030AB-70# is qualified for standard convection reflow with peak temperature of 225°C (+0/–5°C), time above liquidus of 60–150 seconds, and ramp rates compliant with IPC/JEDEC J-STD-020. Its internal ML battery is designed to survive these thermal profiles without capacity loss or safety hazard.

What is the write-protection voltage threshold (VTP) for DS2030AB-70# and how does it vary with temperature?

The DS2030AB-70# has a nominal VTP of 4.50V at +25°C, with variation bounded between 4.37V (–40°C) and 4.62V (+85°C) as specified in the datasheet's VTP vs. Temperature plot. This tight tolerance ensures consistent write-protection activation across the full industrial temperature range.

DS2030AB-70# Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
NVSRAM
Technology:
NVSRAM (Non-Volatile SRAM)
Memory Size:
256Kbit
Memory Organization:
32K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
70ns
Access Time:
70 ns
Voltage - Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27x27)

DS2030AB-70# FAQ

1.How can I place an order for DS2030AB-70# through Aetrix?

Please submit a Request for Quotation (RFQ) for DS2030AB-70# on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS2030AB-70# reliable?

The price and inventory of DS2030AB-70# are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS2030AB-70# is usually 5 days.

3.What payment methods are accepted for DS2030AB-70#?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS2030AB-70# transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS2030AB-70#?

DS2030AB-70# orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS2030AB-70# order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS2030AB-70#?

For technical support, including DS2030AB-70# datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS2030AB-70# requirements.

6.How does Aetrix verify that DS2030AB-70# is sourced from the original manufacturer or authorized distributors?

All DS2030AB-70# products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS2030AB-70# meets industry standards.

7.What is the process for return or replacement of DS2030AB-70#?

All DS2030AB-70# units undergo pre-shipment inspection (PSI). If there is an issue with DS2030AB-70#, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS2030AB-70# part is unused and in its original packaging.

Return procedure for DS2030AB-70#:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DS2030AB-70# Tags

  • DS2030AB-70#
  • DS2030AB-70# PDF
  • DS2030AB-70# Datasheet
  • DS2030AB-70# Specifications
  • DS2030AB-70# Images
  • Analog Devices Inc./Maxim Integrated
  • Analog Devices Inc./Maxim Integrated DS2030AB-70#
  • Buy DS2030AB-70#
  • DS2030AB-70# Price
  • DS2030AB-70# Distributor
  • DS2030AB-70# Supplier
  • DS2030AB-70# Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER