Texas Instruments DS250DF210ABMR

Overview

DS250DF210ABMR from Texas Instruments is a dual-channel, multi-rate retimer IC designed for high-speed serial link regeneration in 100GbE, InfiniBand EDR, and OIF-CEI-25G-LR/MR/SR/VSR systems. It operates from 20.6 to 25.8 Gbps per channel with adaptive CTLE/DFE equalization, ultra-low latency (<500 ps at 25.78 Gbps), and integrated 2×2 crosspoint switching. Its single 2.5-V supply and on-chip eye monitor support front-port optical jitter cleaning and active cable assembly design.

For engineers reviewing the DS250DF210ABMR datasheet, DS250DF210ABMR pinout, DS250DF210ABMR application, or DS250DF210ABMR equivalent, key selection criteria include full-rate data lock range (20.6–25.8 Gbps), integrated CDR + FIR + CTLE + DFE signal conditioning, 6-mm × 6-mm fcBGA-101 package routing compatibility, and SMBus-configurable operation in master/slave modes.

Technical Context

The DS250DF210ABMR implements independent per-channel CDRs with PLL-based clock recovery and adaptive decision feedback equalization (DFE) across five taps, plus continuous-time linear equalization (CTLE) optimized for lossy channels up to 35+ dB at 12.9 GHz. Its low-jitter transmitter uses a 3-tap FIR filter with programmable coefficients and supports adjustable output amplitude (205–1225 mVppd).

Configuration is handled via SMBus (slave or master mode) or external EEPROM, enabling up to 16 devices on one bus using 4-level address straps (ADDR0/ADDR1). Calibration relies on a 25-MHz ±100-PPM single-ended CMOS clock (CAL_CLK_IN), with CAL_CLK_OUT supporting daisy-chained calibration across multiple devices.

Key Specifications

Pinout & Package

DS250DF210ABMR is housed in a 101-pin flip-chip ball grid array (fcBGA) package with 0.5-mm pitch and nominal body size of 6.0 mm × 6.0 mm. The package supports standard reflow profiles and requires controlled impedance routing for high-speed differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar retimer applications.

Compared with DS250DF230ABMR, DS250DF210ABMR offers optimal channel count and power efficiency for dual-lane 25G systems; versus DS125DF410ABMR, it delivers essential 25G+ rate support, DFE-based channel compensation, and tighter jitter compliance required for next-gen optical and active cable deployments.

Availability

DS250DF210ABMR is available at Aetrix Electronics and suitable for 100GbE optical module design, active cable assembly production, and high-speed backplane signal integrity enhancement requiring stable component supply and long-term lifecycle assurance.

Supply support for DS250DF210ABMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-speed interface solutions, with decades of expertise in signal integrity, clocking, and data converter technologies.

The DS250DF210ABMR belongs to TI's high-speed retimer product line, engineered specifically for 25G+ serial link regeneration in cloud infrastructure, optical networking, and AI/ML accelerator interconnects where jitter, loss, and crosstalk mitigation are critical.

FAQ

What is the supported data rate range for DS250DF210ABMR?

The DS250DF210ABMR supports a continuous full-rate data range from 20.6 Gbps to 25.8 Gbps per channel, including standardized sub-rates such as 10.3125 Gbps and 12.5 Gbps. This enables FEC pass-through and compatibility with IEEE 802.3bj, InfiniBand EDR, and OIF-CEI-25G-LR/MR/SR specifications. The DS250DF210ABMR achieves lock independently on each channel without requiring external reference clocks.

Does DS250DF210ABMR require an external reference clock?

No, the DS250DF210ABMR does not require a low-jitter reference clock for CDR operation. It uses an internal PLL architecture that locks directly to the incoming data stream. A 25-MHz ±100-PPM CMOS calibration clock (CAL_CLK_IN) is required solely for VCO frequency range calibration and is not used for timing recovery. This simplifies system clock tree design and reduces board-level component count.

How is DS250DF210ABMR configured - via SMBus or EEPROM?

The DS250DF210ABMR supports both SMBus (master or slave mode) and external EEPROM configuration. SMBus mode uses ADDR0/ADDR1/EN_SMB straps to assign a unique 7-bit address and select operation mode; up to 16 devices can share one SMBus bus. EEPROM mode allows non-disruptive register loading at power-up, with Common Channel format supporting shared configuration across multiple DS250DF210ABMR devices.

What package type and pin count does DS250DF210ABMR use?

The DS250DF210ABMR is packaged in a 101-pin flip-chip BGA (fcBGA) with 0.5-mm pitch and nominal dimensions of 6.0 mm × 6.0 mm. This ABM package variant supports flow-through routing, thermal dissipation via solder balls to internal ground planes, and compatibility with standard PCB fabrication processes for high-density interconnects.

Can DS250DF210ABMR operate with 3.3-V I/Os?

The DS250DF210ABMR uses a 2.5-V core supply (VDD = 2.375–2.625 V), but its SMBus pins (SDA, SDC) and interrupt output (INT_N) are 3.3-V LVCMOS tolerant. These pins accept 3.3-V logic levels and require external 2–5 kΩpull-up resistors per SMBus specification. All high-speed differential I/Os (RX/TX) are AC-coupled and referenced to internal 2.5-V biasing - no 3.3-V signaling is applied to those lanes.