Texas Instruments DS250DF410ABMR

Overview

DS250DF410ABMR from Texas Instruments is a quad-channel 25 Gbps multi-rate retimer IC with integrated CDR, adaptive CTLE/DFE equalization, and 2×2 crosspoint switching. It operates from a single 2.5 V supply, supports data rates from 5.0688 to 25.8 Gbps (full/half/quarter rates), delivers <500 ps typical latency at 25.78125 Gbps, and targets high-speed serial link reach extension in optical front-ports and backplanes.

For engineers reviewing the DS250DF410ABMR datasheet, DS250DF410ABMR pinout, DS250DF410ABMR application, or DS250DF410ABMR equivalent, key selection considerations include its 101-pin FC/CSP ABM package, 25.78125-Gbps jitter cleaning performance per channel, SMBus/JTAG programmability, on-chip PRBS generator/checker, and support for IEEE 802.3bj 100GbE, InfiniBand EDR, and OIF-CEI-25G-LR/MR/SR/VSR interfaces.

Technical Context

The DS250DF410ABMR implements independent per-channel CDRs with PLL bandwidths of 5.3–5.5 MHz across supported data rates, enabling robust lock acquisition over wide frequency ranges. Each channel integrates an adaptive continuous-time linear equalizer (CTLE) and 5-tap decision feedback equalizer (DFE), with configurable 3-tap FIR transmit filtering supporting up to 35+ dB channel loss compensation at 12.9 GHz.

It features dual-mode system management via SMBus (slave/master) using 4-level address straps (ADDR0/ADDR1) and EN_SMB control, plus JTAG boundary scan capability. The device supports EEPROM-based configuration loading, on-chip eye opening monitor (EOM), and open-drain interrupt signaling (INT_N) for real-time link health reporting.

Key Specifications

Pinout & Package

The DS250DF410ABMR uses a 6.0 mm × 6.0 mm, 101-pin flip-chip chip-scale package (FC/CSP) with ABM designation. This fine-pitch BGA supports high-speed differential routing, thermal dissipation via bottom-side solder balls, and compact integration into space-constrained optical modules and switch line cards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar retimer applications.

Compared with DS250DF210ABMR and DS125DF410ABMR, the DS250DF410ABMR uniquely delivers full 25.8 Gbps operation across four independent lanes with 35+ dB equalization and integrated crosspoint-making it the only option qualified for IEEE 802.3bj 100GbE KR4/KP4 and OIF-CEI-25G-LR/MR/SR/VSR compliance in single-package form.

Availability

DS250DF410ABMR is available at Aetrix Electronics and suitable for high-speed optical interconnects, active cable assemblies, backplane reach extension, and 100GbE/InfiniBand EDR infrastructure requiring stable component supply and long-term lifecycle support.

Supply support for DS250DF410ABMR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-speed interface solutions for communications, computing, and industrial markets.

The DS250DF410ABMR belongs to TI's high-speed retimer product line, engineered specifically for 25+ Gbps serial link integrity in optical modules, active cables, and next-generation data center interconnects.

FAQ

What data rates does the DS250DF410ABMR support?

The DS250DF410ABMR supports a continuous range from 5.0688 Gbps (quarter-rate) to 25.8 Gbps (full-rate), including industry-standard sub-rates such as 10.3125 Gbps and 12.5 Gbps. This enables compliance with IEEE 802.3bj 100GbE KR4/KP4, InfiniBand EDR, and OIF-CEI-25G-LR/MR/SR/VSR specifications. All four channels lock independently, allowing mixed-rate operation across lanes.

Does the DS250DF410ABMR require an external reference clock?

No, the DS250DF410ABMR does not require a low-jitter reference clock. It uses an internal VCO calibrated by a 25 MHz ±100 ppm single-ended CMOS clock (CAL_CLK_IN), which has relaxed phase noise requirements. This eliminates dependency on expensive ultra-low-jitter oscillators and simplifies board-level timing architecture for the DS250DF410ABMR.

How is the DS250DF410ABMR configured during system startup?

The DS250DF410ABMR can be configured via SMBus (slave or master mode) or through an external EEPROM. In SMBus slave mode, configuration registers are accessed using 4-level address straps (ADDR0/ADDR1) and EN_SMB. In master mode, it loads settings from a shared EEPROM-supporting up to 16 devices on one bus using Common Channel format. Configuration occurs automatically after power-on reset.

What diagnostic capabilities does the DS250DF410ABMR provide?

The DS250DF410ABMR includes an on-chip eye opening monitor (EOM), PRBS generator/checker (PRBS7/9/11/15/31), and programmable interrupt output (INT_N). These allow real-time link health assessment, BER testing, and fault reporting without external test equipment-enabling in-system validation and field diagnostics directly within the DS250DF410ABMR.

What is the thermal performance of the DS250DF410ABMR in a standard PCB layout?

In a 4-layer JEDEC board configuration, the DS250DF410ABMR exhibits a junction-to-ambient thermal resistance (RθJA) of 34.2°C/W and junction-to-board (RθJB) of 13.7°C/W. With proper decoupling and thermal vias under the package, it maintains operation within the –40°C to 110°C junction temperature range. For sustained 25.78125 Gbps operation, TI recommends airflow or heat spreading to manage power dissipation up to 665 mA total supply current.