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Texas Instruments DS25CP152TSQX/NOPB

Part No.:
DS25CP152TSQX/NOPB
Manufacturer:
Texas Instruments
Category:
Signal Switches, Multiplexers, Decoders
Package:
16-WFQFN Exposed Pad
Datasheet:
AetrixDS25CP152TSQX/NOPB.pdf
Description:
IC CROSSPOINT SW 1 X 2:2 16WQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,497

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Product details

Overview

DS25CP152TSQX/NOPB from Texas Instruments is a 3.125 Gbps 2×2 LVDS crosspoint switch with integrated 100 Ω input/output terminations, adaptive equalization for SD/HD/3G HD-SDI backplane routing, and <40 ps channel-to-channel skew. It operates from 3.0–3.6 V at −40°C to +85°C and supports LVDS/CML/LVPECL input compatibility in broadcast or point-to-point configurations for video infrastructure systems.

For engineers reviewing the DS25CP152TSQX/NOPB datasheet, DS25CP152TSQX/NOPB pinout, DS25CP152TSQX/NOPB application, or DS25CP152TSQX/NOPB equivalent, this page delivers verified electrical parameters, functional truth tables, thermal resistance (θJA = 41.8°C/W), jitter performance (tTJ2 ≤ 0.09 UIP-P @ 3.125 Gbps), and WQFN-16 package layout guidance - all directly extracted from TI SNLS274D Rev D.

Technical Context

The DS25CP152TSQX/NOPB implements a fully differential, non-blocking 2×2 switching matrix with independent LVCMOS control of SEL0/SEL1 (switch configuration) and EN0/EN1 (output enable). Its internal 100 Ω differential terminations eliminate external resistors and reduce return loss on FR-4 backplanes up to 2 inches at 3.125 Gbps.

It features adaptive equalization optimized for SD/HD/3G HD-SDI signal integrity over lossy media, with deterministic jitter ≤19 ps peak-to-peak and random jitter ≤1 ps RMS at 3.125 Gbps. The device uses a flow-through pinout in a 4 mm × 4 mm WQFN-16 package with exposed thermal pad (DAP) for enhanced thermal dissipation (θJC = 6.9°C/W).

Key Specifications

Parameter Value and Actual Design Meaning
Data Rate DC to 3.125 Gbps - supports full 3G HD-SDI (2.97 Gbps) with margin for clock recovery and jitter tolerance.
Propagation Delay 340–500 ps - tightly bounded low-latency path critical for synchronous video routing and reclocking.
Channel Skew ≤40 ps - ensures timing alignment between OUT0 and OUT1 outputs in broadcast mode for parallel data paths.
Differential Output Voltage 250–450 mV - meets LVDS standard compliance (ANSI/TIA/EIA-644) for robust noise immunity and receiver compatibility.
Supply Current 64–77 mA active / 23–29 mA disabled - enables dynamic power management via EN0/EN1 without signal interruption.
ESD Protection ≥8 kV HBM on LVDS I/O - safeguards against electrostatic discharge during board handling and system integration.
Operating Temperature −40°C to +85°C - qualified for industrial-grade video equipment deployed in broadcast vans, OB trucks, and studio routers.

Pinout & Package

DS25CP152TSQX/NOPB is housed in a 4 mm × 4 mm WQFN-16 package (TI RGH0016A) with wettable flanks and an exposed thermal pad (DAP) requiring solder connection to PCB ground for optimal thermal performance (θJC = 6.9°C/W). Pin 1 is located in Quadrant Q1 per tape-and-reel orientation.

Pin/Terminal Circuit Role Design Meaning
IN0+, IN0− Differential LVDS Input Accepts LVDS/CML/LVPECL signals; internally terminated with 100 Ω; wide common-mode range (0.05 V to VCC−0.05 V).
IN1+, IN1− Differential LVDS Input Second independent high-speed input pair with identical termination and interface flexibility as IN0.
OUT0+, OUT0− Differential LVDS Output LVDS-compliant output (250–450 mV swing); enabled/disabled independently via EN0; 100 Ω internal termination.
OUT1+, OUT1− Differential LVDS Output Second LVDS output with matched skew and jitter performance to OUT0; supports simultaneous or isolated routing.
SEL0, SEL1 LVCMOS Configuration Set crosspoint routing (IN0/IN1 → OUT0/OUT1) per truth table; 20 kΩ pulldown ensures default state on power-up.
EN0, EN1 LVCMOS Output Enable Individually disable OUT0 or OUT1 to reduce power or isolate downstream receivers without affecting signal path integrity.
VCC, GND, DAP Power & Ground Single 3.3 V supply (3.0–3.6 V); DAP must be soldered to PCB ground plane for thermal and EMI performance.
NC (Pins 6, 15) No Connect Unbonded pins; must remain unconnected per TI design - no routing or grounding permitted.

Key Features

Feature Design Value
Fully differential non-blocking architecture Enables any input to connect to any output (or both) simultaneously - essential for flexible SDI router card designs with redundant paths.
On-chip 100 Ω differential terminations Eliminates 8 external resistors per device, reduces PCB area by ≥12 mm², and improves impedance matching on dense backplanes.
Adaptive equalization for SD/HD/3G HD Compensates for frequency-dependent loss in FR-4 striplines up to 2″ length at 3.125 Gbps - validated in TI Figure 12–13 eye diagrams.
Low-jitter reclocking + cable driving Delivers tTJ2 ≤ 0.09 UIP-P at 3.125 Gbps - meets SMPTE 424M jitter budget for 3G HD-SDI transmission over coaxial or balanced cables.
Flow-through pinout in WQFN-16 Minimizes trace crossovers and stubs; simplifies high-speed layout with straight-in/straight-out routing for IN/OUT pairs.

Applications

SD/HD/3G HD SDI Routers OC-48 / STM-16 SONET Line Cards

Use Scenario: Signal routing between multiple camera inputs and monitor outputs in broadcast production switchers.

IC Role / Device Role / Timing Role: 2×2 crosspoint switch providing low-skew, jitter-cleaned paths for dual-link 3G HD-SDI video streams.

Use Value: Enables seamless source selection without frame drops or timing artifacts, leveraging <40 ps channel skew and adaptive equalization for 2″ FR-4 traces.

Use Scenario: Clock/data multiplexing and signal conditioning in telecom line interface modules.

IC Role / Device Role / Timing Role: Reclocker and cable driver for OC-48 (2.488 Gbps) serial data lanes with LVDS-level output compliance.

Use Value: Maintains BER <10⁻¹² over long backplane runs using deterministic jitter ≤19 ps and 3.125 Gbps headroom.

High-Speed Channel Select Systems Clock and Data Buffering/Muxing

Use Scenario: Dynamic reconfiguration of test instrument signal paths in automated video analyzer platforms.

IC Role / Device Role / Timing Role: Pin-configurable crosspoint enabling software-defined routing of multi-gigabit test stimuli.

Use Value: SEL0/SEL1 control allows real-time path changes without FPGA logic overhead or external mux ICs.

Use Scenario: Fanout and level translation of reference clocks across FPGA, ADC, and serializer ICs in embedded vision systems.

IC Role / Device Role / Timing Role: Low-jitter LVDS buffer with independent output enables (EN0/EN1) for power-gated clock domains.

Use Value: Reduces clock distribution skew to <35 ps while cutting component count via integrated 100 Ω terminations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2×2 LVDS crosspoint switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX9152ESE+ 2.5 Gbps max data rate; no adaptive equalization; SOIC-16 package (larger footprint, higher inductance). Limited to HD-SDI (1.485 Gbps); unsuitable for 3G HD-SDI backplane compensation or >2″ FR-4 traces. Select only if operating below 2.5 Gbps and board space permits SOIC; verify jitter budget separately.
SN65LVDS250PW 2×2 LVDS repeater (not crosspoint); fixed IN0→OUT0/IN1→OUT1 mapping; no SEL/EN control logic. Cannot route IN0→OUT1 or support broadcast mode; lacks configuration flexibility required for router cards. Use only for simple duplication or signal regeneration where switching logic is handled upstream.

Compared with MAX9152ESE+ and SN65LVDS250PW, DS25CP152TSQX/NOPB uniquely combines 3.125 Gbps operation, adaptive equalization, pin-configurable routing, and ultra-low skew in a space-saving WQFN package - making it the only option qualified for 3G HD-SDI router backplanes per SMPTE 424M.

Availability

DS25CP152TSQX/NOPB is available at Aetrix Electronics and suitable for SD/HD/3G HD SDI routers, OC-48 line cards, and high-speed channel select systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for DS25CP152TSQX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-speed interface solutions, with decades of heritage in broadcast video and telecom infrastructure ICs.

The DS25CP152TSQX/NOPB belongs to TI's high-speed interconnect product line, engineered specifically for lossy backplane and cable-based video routing in professional broadcast and optical networking equipment.

FAQ

What is the maximum supported data rate for DS25CP152TSQX/NOPB?

The DS25CP152TSQX/NOPB is specified for DC to 3.125 Gbps operation, with guaranteed AC performance including jitter and skew metrics at that rate. It is fully compliant with SMPTE 424M for 3G HD-SDI (2.97 Gbps) applications and provides margin for system-level timing budgets. Operation beyond 3.125 Gbps is not characterized or supported.

Does DS25CP152TSQX/NOPB require external termination resistors?

No. DS25CP152TSQX/NOPB integrates 100 Ω differential terminations on all four LVDS I/O pairs (IN0±, IN1±, OUT0±, OUT1±), eliminating the need for eight discrete 100 Ω resistors. This reduces PCB area, component count, and potential impedance mismatches - confirmed in TI SNLS274D Section "On-Chip 100Ω Input and Output Terminations".

Can DS25CP152TSQX/NOPB accept LVPECL or CML inputs?

Yes. DS25CP152TSQX/NOPB supports LVPECL and CML input levels due to its wide input common-mode voltage range (0.05 V to VCC−0.05 V) and internal 100 Ω termination. TI Application Figures 9 and 10 explicitly show DC-coupled interfaces to both LVPECL and CML drivers, confirming interoperability without level-shifting circuitry.

How is thermal management handled for DS25CP152TSQX/NOPB?

DS25CP152TSQX/NOPB uses a WQFN-16 package with an exposed thermal pad (DAP, Pin 5). TI requires this pad to be soldered to a PCB ground plane to achieve θJC = 6.9°C/W and maintain junction temperature within limits. The datasheet specifies 2.99 W max power dissipation at 25°C with 23.9 mW/°C derating above that temperature.

What is the function of SEL0 and SEL1 pins on DS25CP152TSQX/NOPB?

SEL0 and SEL1 are LVCMOS control inputs that configure the crosspoint routing matrix per Table 1 in the DS25CP152TSQX/NOPB datasheet. They determine which input (IN0 or IN1) connects to OUT0 and OUT1 - supporting four modes: IN0→both outputs, IN0→OUT0/IN1→OUT1, IN1→OUT0/IN0→OUT1, or IN1→both outputs. Each pin has an internal 20 kΩ pulldown resistor.

DS25CP152TSQX/NOPB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
16-WFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Crosspoint Switch
Circuit:
1 x 2:2
Independent Circuits:
1
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-WQFN (4x4)

DS25CP152TSQX/NOPB FAQ

1.How can I place an order for DS25CP152TSQX/NOPB through Aetrix?

Please submit a Request for Quotation (RFQ) for DS25CP152TSQX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS25CP152TSQX/NOPB reliable?

The price and inventory of DS25CP152TSQX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS25CP152TSQX/NOPB is usually 5 days.

3.What payment methods are accepted for DS25CP152TSQX/NOPB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS25CP152TSQX/NOPB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS25CP152TSQX/NOPB?

DS25CP152TSQX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS25CP152TSQX/NOPB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS25CP152TSQX/NOPB?

For technical support, including DS25CP152TSQX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS25CP152TSQX/NOPB requirements.

6.How does Aetrix verify that DS25CP152TSQX/NOPB is sourced from the original manufacturer or authorized distributors?

All DS25CP152TSQX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS25CP152TSQX/NOPB meets industry standards.

7.What is the process for return or replacement of DS25CP152TSQX/NOPB?

All DS25CP152TSQX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with DS25CP152TSQX/NOPB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS25CP152TSQX/NOPB part is unused and in its original packaging.

Return procedure for DS25CP152TSQX/NOPB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DS25CP152TSQX/NOPB Tags

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