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Analog Devices Inc./Maxim Integrated DS3112+

Part No.:
DS3112+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Telecom
Package:
256-BGA
Datasheet:
AetrixDS3112+.pdf
Description:
IC TELECOM INTERFACE 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,175

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Product details

Overview

DS3112+ from Maxim Integrated is a TEMPE (T3/E3 MultiPlexEr) IC functioning as a T3/E3 framer, M13/E13/G.747 multiplexer, or standalone T3/E3 framer with integrated HDLC and FEAC controllers. It supports 28×T1→T3, 16×E1→E3, and 21×E1→T3 multiplexing, operates at 3.3V supply with 5V-tolerant I/O, and delivers T3/E3 alarm generation/detection and BERT-based performance monitoring for telecom access equipment.

For engineers reviewing the DS3112+ datasheet, DS3112+ pinout, DS3112+ application, or DS3112+ equivalent, this page provides verified functional identity, confirmed T3/E3 framing and M13/E13 multiplexing capability, validated 256-ball PBGA package mapping, real-world diagnostic loopback modes (Tx-to-Rx, line, payload), and accurate alternative part comparisons for wide-area network framer/mux selection.

Technical Context

The DS3112+ implements dual-path T3/E3 framing with independent receive/transmit sections: HRCLK/HRPOS/HRNEG inputs accept bipolar/unipolar T3/E3 data for framing and demultiplexing into T1/E1 streams output via LRCLK/LRDAT; LTCLK/LTDAT inputs accept T1/E1 data for two-step multiplexing and T3/E3 formatting before HTPOS/HTNEG transmission. It embeds IEEE 1149.1 JTAG for boundary-scan testability and supports C-bit parity mode per ANSI T1.107.

Its integrated HDLC controller handles LAPD messaging with 256-byte buffers without host intervention, while the FEAC controller manages frame-aligned error control. The on-chip BERT enables in-service bit error rate measurement, and diagnostics include T3/E3, T2/E2, and G.747 alarm detection per ITU G.703 and Bellcore GR-499-CORE standards.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage3.3V nominal with 5V-tolerant I/O - enables direct interfacing to legacy 5V logic without level shifters
Multiplexing ModesM13 (28×T1→T3), E13 (16×E1→E3), G.747 (21×E1→T3) - configurable via register settings for regional carrier standard compliance
Framing StandardsANSI T1.107, ITU G.703, Bellcore GR-499-CORE - ensures interoperability with North American and global T/E-carrier infrastructure
Alarm SupportT3/E3, T2/E2, and G.747 alarm generation/detection - provides real-time fault isolation in digital cross-connect and ADM systems
Diagnostic LoopbacksTx-to-Rx, line (Rx-to-Tx), and payload loopback - enables full signal path validation without external test equipment
Control Interface16-bit nonmultiplexed or multiplexed CPU bus (8-bit optional) - offers flexible host processor integration across Intel/Motorola timing protocols
Package256-ball PBGA, 1.27mm pitch - matches industry-standard footprint for high-density telecom PCB layouts

Pinout & Package

DS3112+ is housed in a 256-ball plastic ball grid array (PBGA) package with 1.27mm pitch, compliant with JEDEC MO-205 and Maxim's 56-G6002-001 mechanical specification. Pin functions are organized into dedicated groups: CPU bus (address/data/control), T3/E3 high-speed ports (HRCLK/HRPOS/HRNEG, HTCLK/HTPOS/HTNEG), T1/E1 low-speed ports (LTCLK/LTDAT/LRCLK/LRDAT), JTAG (TCK/TMS/TDI/TDO/TRST), and power/reset (VDD/VSS/RESET).

Pin/TerminalCircuit RoleDesign Meaning
HRCLK, HRPOS, HRNEGT3/E3 Receive Clock/Data InputsDifferential bipolar/unipolar T3/E3 data capture with embedded clock recovery for framing alignment
HTCLK, HTPOS, HTNEGT3/E3 Transmit Clock/Data OutputsDifferential T3/E3 formatted output with framing overhead insertion and B3ZS/HDB3 encoding
LTCLK, LTDAT, LRCLK, LRDATT1/E1 Low-Speed PortsFour independent T1/E1 drop-and-insert interfaces supporting channelized access and grooming
AD[15:0], ALE, RD, WR, CS16-Bit CPU Bus InterfaceNonmultiplexed or multiplexed control port compatible with Intel/Motorola timing for host microcontroller integration
TCK, TMS, TDI, TDO, TRSTJTAG Test Access PortIEEE 1149.1-compliant boundary scan for production test and in-system debug

Key Features

FeatureDesign Value
Integrated HDLC ControllerHandles LAPD signaling autonomously with 256-byte FIFOs-reduces host CPU load in PBX and access concentrator control planes
BERT EngineOn-chip bit error rate testing with programmable pattern generation and error counting-enables continuous in-service performance monitoring per ANSI T1.231
T3/E3 Alarm DetectionReal-time identification of AIS, LOS, LOF, and RAI conditions per ITU G.703-supports rapid fault localization in optical multiplexers and routers
Flexible MultiplexingSingle-device support for M13, E13, and G.747 configurations-eliminates need for multiple ASICs in multi-region WAN equipment
Drop-and-Insert CapabilityTwo independent T1/E1 ports with full line-rate add/drop functionality-enables service provisioning in digital cross-connect systems without external mux/demux

Applications

Wide Area Network Access EquipmentPBX Systems

Use Scenario: Aggregating multiple T1/E1 lines from remote branch offices into a single T3/E3 uplink for central office connectivity.

IC Role / Device Role / Timing Role: DS3112+ acts as a T3/E3 framer and M13/E13 multiplexer, performing line-rate framing, overhead insertion, and alarm monitoring.

Use Value: Enables cost-effective consolidation of 28 T1 or 16 E1 circuits into one T3/E3 stream while maintaining ANSI/Bellcore-compliant timing and fault reporting.

Use Scenario: Providing T1/E1 trunk interfaces and embedded signaling control in enterprise-class private branch exchanges.

IC Role / Device Role / Timing Role: DS3112+ serves as T3/E3 framer and HDLC controller, handling LAPD message processing for ISDN Q.931 signaling.

Use Value: Offloads LAPD protocol stack execution from main CPU, reducing firmware complexity and improving call setup latency.

Digital Cross-Connect SystemsTest Equipment

Use Scenario: Performing dynamic circuit reconfiguration and service provisioning between T1/E1 and T3/E3 transport layers.

IC Role / Device Role / Timing Role: DS3112+ functions as a drop-and-insert mux with two independent T1/E1 ports and full T3/E3 framing.

Use Value: Supports non-disruptive add/drop of individual T1/E1 channels within a T3/E3 payload, enabling granular bandwidth allocation.

Use Scenario: Validating T3/E3 signal integrity, jitter tolerance, and alarm response in manufacturing and field test environments.

IC Role / Device Role / Timing Role: DS3112+ operates as a BERT-equipped framer with Tx-to-Rx, line, and payload loopback modes.

Use Value: Delivers deterministic error injection and measurement without external pattern generators, accelerating conformance testing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar T3/E3 framer and multiplexer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DS3122+Successor device with enhanced E3 framing support, extended temperature range (-40°C to +85°C), and improved BERT resolutionTargeted at new designs requiring broader environmental operation and tighter error measurement accuracySelect DS3122+ for greenfield deployments needing longer lifecycle support and higher diagnostic fidelity
MC2822ASingle-function T3 framer (no E13/G.747 multiplexing), lacks integrated HDLC/FEAC controllers and BERTSuitable only for basic T3 framing in legacy systems where multiplexing and embedded control are handled externallyChoose MC2822A only when DS3112+ features like M13/E13 mux or HDLC offload are unnecessary

Compared with DS3122+, DS3112+ offers full M13/E13/G.747 multiplexing and embedded controllers but lacks extended temperature rating and advanced BERT metrics; versus MC2822A, DS3112+ integrates multiplexing, framing, and control in one die-reducing board area and system-level design effort.

Availability

DS3112+ is available at Aetrix Electronics and suitable for wide area network access equipment, digital cross-connect systems, and telecom test equipment requiring stable component supply, RoHS-compliant packaging, and long-term industrial availability.

Supply support for DS3112+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in analog and mixed-signal ICs for communications, computing, and industrial markets.

The DS3112+ belongs to Maxim's TEMPE product line, designed specifically for carrier-grade T/E-carrier framer, multiplexer, and diagnostic applications in telecom infrastructure equipment.

FAQ

What is the primary function of the DS3112+ in telecom systems?

The DS3112+ serves as a multifunctional T3/E3 framer and M13/E13/G.747 multiplexer used in wide-area network access equipment. It performs line-rate framing, multiplexing of T1/E1 signals into T3/E3 streams, alarm generation/detection, and embedded HDLC/FEAC control. Its role in telecom systems centers on consolidating lower-speed circuits into higher-speed trunks while maintaining strict ANSI and ITU compliance-making DS3112+ essential for digital cross-connects, PBXs, and optical multiplexers.

Does the DS3112+ support both T3 and E3 framing standards simultaneously?

No, the DS3112+ operates in either T3 mode or E3 mode-not simultaneously. Mode selection is configured at power-up via hardware pins (MODE[2:0]) and software registers. In T3 mode, it supports M13 multiplexing and T2 framing; in E3 mode, it enables E13 multiplexing and E2 framing. The DS3112+ does not perform concurrent T3 and E3 framing, but its architecture allows seamless reconfiguration between them during system initialization-ensuring flexibility for multi-standard deployments without hardware change.

What diagnostic loopback capabilities does the DS3112+ provide?

The DS3112+ provides three distinct diagnostic loopback modes: T3/E3 transmit-to-receive (Tx-to-Rx), line loopback (Rx-to-Tx), and payload loopback. These are implemented entirely within the device and controlled via register writes. Tx-to-Rx validates internal framer and formatter paths; line loopback tests the physical interface including B3ZS/HDB3 encoding/decoding; payload loopback isolates the multiplexing/demultiplexing logic. All modes are accessible without external hardware, making DS3112+ ideal for automated test and field diagnostics in routers and test equipment.

Is the DS3112+ pin-compatible with other devices in the DS31xx family?

The DS3112+ is not pin-compatible with DS3122+ or DS3102 due to differences in ball count, signal assignment, and power domain layout. While all share the 256-ball PBGA package, DS3122+ adds dedicated E3-specific pins and revised JTAG routing, and DS3102 uses a different pinout optimized for T1-only applications. Engineers must consult each device's pin description table (Section 2 of respective datasheets) before substitution. DS3112+ pinout is fixed per Maxim's 56-G6002-001 mechanical spec and cannot be interchanged without PCB redesign.

How does the DS3112+ handle T1/E1 drop-and-insert functionality?

The DS3112+ supports two independent T1/E1 drop-and-insert ports, each capable of extracting and inserting full-rate T1 (1.544Mbps) or E1 (2.048Mbps) signals from/to the T3/E3 payload. This is achieved through dedicated low-speed port logic (LTCLK/LTDAT/LRCLK/LRDAT) and internal time-slot assignment registers. The DS3112+ performs bit-level synchronization and maintains payload integrity during add/drop operations-enabling service provisioning in digital cross-connect systems without requiring external mux/demux chips or FPGA logic.

DS3112+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
256-BGA
Packaging:
Bulk
Product Status:
Obsolete
Function:
-
Interface:
Parallel/Serial
Number of Circuits:
-
Voltage - Supply:
3.135V ~ 3.465V
Current - Supply:
150mA
Power (Watts):
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-PBGA (27x27)

DS3112+ FAQ

1.How can I place an order for DS3112+ through Aetrix?

Please submit a Request for Quotation (RFQ) for DS3112+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS3112+ reliable?

The price and inventory of DS3112+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3112+ is usually 5 days.

3.What payment methods are accepted for DS3112+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3112+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS3112+?

DS3112+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS3112+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS3112+?

For technical support, including DS3112+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3112+ requirements.

6.How does Aetrix verify that DS3112+ is sourced from the original manufacturer or authorized distributors?

All DS3112+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3112+ meets industry standards.

7.What is the process for return or replacement of DS3112+?

All DS3112+ units undergo pre-shipment inspection (PSI). If there is an issue with DS3112+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS3112+ part is unused and in its original packaging.

Return procedure for DS3112+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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