Analog Devices Inc./Maxim Integrated DS3150Q
- Part No.:
- DS3150Q
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Telecom
- Package:
- 28-LCC (J-Lead)
- Datasheet:
-
DS3150Q.pdf
- Description:
- IC TELECOM INTERFACE 28PLCC
- Quantity:
- Payment:

- Shipping:

Inventory:4,725
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DS3150Q from Maxim Integrated is a 3.3V, single-chip DS3/E3/STS-1 Line Interface Unit (LIU) performing full physical-layer interfacing including clock/data recovery, B3ZS/HDB3 encoding/decoding, jitter attenuation, and 75Ω coaxial line driving. It supports 44.736Mbps (DS3), 34.368Mbps (E3), and 51.840Mbps (STS-1) rates with integrated AGC/equalizer handling up to 15dB cable loss, and operates across 0°C to +70°C in 28-pin PLCC packaging. Used in SONET/SDH multiplexers and DSLAMs for telecom infrastructure.
For engineers reviewing the DS3150Q datasheet, DS3150Q pinout, DS3150Q application, or DS3150Q equivalent, this page delivers verified technical context, real-world interface constraints, jitter tolerance compliance per GR-253-CORE/G.823/G.775, and validated alternatives for DS3/E3/STS-1 line card design.
Technical Context
The DS3150Q implements independent receive and transmit data paths with a configurable jitter attenuator that can be placed in either path or disabled. Its receiver includes analog loss-of-signal (ALOS) detection, digital LOS (DLOS) based on 175±75 consecutive zero detection, and adaptive equalization supporting 0–15dB coaxial loss compensation.
The transmitter integrates B3ZS/HDB3 encoder, line build-out (LBO) control, tri-state line driver, and built-in AIS generators (DS3 ANSI T1.107, E3 unframed all-ones). Clock inversion via ICE pin enables glueless framer interfacing, and PRBS generator/detector (215−1 and 223−1) supports O.151-compliant physical-layer diagnostics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supported Standards | ANSI T1.102/T1.107/T1.231, ITU-T G.703/G.751/G.775/G.823/G.824, ETSI ETS 300 686/687/EN 300 689, Telcordia GR-253-CORE/GR-499-CORE |
| Data Rates | 44.736Mbps (DS3), 34.368Mbps (E3), 51.840Mbps (STS-1), all ±20ppm frequency accuracy required |
| Cable Loss Compensation | 0–15dB adaptive equalization, enabling up to 380m (DS3), 440m (E3), or 360m (STS-1) AT&T 734A coaxial reach |
| Jitter Attenuation | Configurable into receive or transmit path; meets GR-253-CORE (STS-1), GR-499 Cat I/II (DS3), G.823/G.824 (E3) jitter transfer requirements |
| LOS Detection | Analog LOS (ALOS) triggers at ≤−24dB nominal; digital LOS (DLOS) asserts after 175±75 consecutive zeros - compliant with ANSI T1.231 and ITU-T G.775 |
| Power Supply | 3.3V operation with 5V-tolerant I/O; max supply current 110mA; industrial-grade thermal performance over 0°C to +70°C |
| Line Interface | Direct 75Ω coaxial drive via TX+/TX−; transformer-coupled receive via RX+/RX−; supports DSX monitor signal with 20dB flat-loss preamp (RMON high) |
Pinout & Package
DS3150Q is housed in a 28-pin Plastic Leaded Chip Carrier (PLCC) package with gull-wing leads, surface-mount compatible, and rated for 0°C to +70°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RX+, RX− | Differential receive input | Accepts transformer-coupled B3ZS/HDB3-coded AMI signal from 75Ω coaxial line; supports monitoring with 20dB loss via RMON |
| TX+, TX− | Differential transmit output | Drives standards-compliant DS3/E3/STS-1 waveform onto 75Ω coaxial cable; tri-state capable via TTS pin |
| RCLK | Recovered clock output | Provides NRZ or bipolar-mode recovered clock; polarity invertible via ICE pin for glueless framer sync |
| TCLK | Transmit clock input | Clocks incoming data; jittery input acceptable only when jitter attenuator enabled in transmit path |
| MCLK | Master clock input | 44.736MHz (DS3), 34.368MHz (E3), or 51.840MHz (STS-1); used by CDR and jitter attenuator when active |
| ZCSE | Zero-code suppression enable | High = bipolar interface mode (B3ZS/HDB3 decoder disabled); low = NRZ mode (decoder enabled) |
| LOS | Loss-of-signal indicator | Open-drain output asserted during ALOS/DLOS condition; meets ANSI T1.231 and ITU-T G.775 timing criteria |
| LBO | Line build-out control | Low = no preattenuation (≥225ft cable); high = preattenuation simulating 225ft loss (for shorter cables) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated jitter attenuator | Configurable placement in receive or transmit path - eliminates need for external jitter cleaners in SONET/SDH timing chains |
| B3ZS/HDB3 encode/decode | On-die encoder/decoder supports both DS3 (B3ZS) and E3 (HDB3) line coding without external logic or FPGA resources |
| AGC/equalizer with 0–15dB range | Automatically compensates for variable coaxial cable loss - enables single LIU design across multiple cabinet depths and field deployments |
| PRBS generator/detector | On-chip 215−1 and 223−1 sequences compliant with ITU O.151 - reduces test equipment dependency for field diagnostics |
| Tri-state line driver | Enables low-power standby and protection switching in redundant line cards without external bus switches or isolators |
| DS3/E3/STS-1 AIS generation | Complete ANSI T1.107 DS3 AIS and unframed E3 all-ones patterns generated internally - simplifies alarm signaling implementation |
Applications
| SONET/SDH Multiplexer | Digital Cross-Connect System |
|---|---|
|
Use Scenario: Aggregating DS3/E3 tributaries into OC-3/OC-12 optical payloads in central office transport nodes. IC Role / Device Role / Timing Role: Physical-layer line interface unit providing clock/data recovery, jitter cleanup, and standards-compliant waveform shaping for backplane-to-line conversion. Use Value: Eliminates discrete transceiver + jitter cleaner + equalizer combinations, reducing BOM count and board area by >40% versus multi-chip solutions. |
Use Scenario: Reconfiguring E3/DS3 circuits between legacy PDH and modern SDH networks in metro aggregation points. IC Role / Device Role / Timing Role: Bidirectional LIU enabling flexible mapping of electrical tributaries with automatic code conversion (B3ZS↔HDB3) and loss compensation. Use Value: Supports mixed-standard interworking without external protocol translators; adaptive equalizer maintains link integrity across varying cable plant conditions. |
| DSLAM Line Card | CSU/DSU Equipment |
|
Use Scenario: Providing T3/E3 uplink interfaces in broadband access concentrators connecting DSL subscribers to core IP/MPLS networks. IC Role / Device Role / Timing Role: High-reliability line interface with built-in AIS generation, LOS monitoring, and PRBS diagnostics for remote fault isolation. Use Value: Reduces mean time to repair (MTTR) via on-chip diagnostics - PRBS detector flags bit errors synchronously to RCLK without host processor intervention. |
Use Scenario: Embedding DS3/E3 termination capability in customer-premises CSU/DSU units for enterprise WAN connectivity. IC Role / Device Role / Timing Role: Self-contained LIU delivering carrier-grade signal conditioning, loopback support (local/remote), and transformer-coupled 75Ω interface. Use Value: Enables compact, fanless CSU/DSU designs - 3.3V operation and 110mA max current meet power budget constraints of small-form-factor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DS3/E3/STS-1 line interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS3150QN | Identical functionality and pinout; extended temperature range (−40°C to +85°C) vs. DS3150Q's 0°C to +70°C | Suitable for outdoor cabinets, base stations, or industrial environments requiring wider thermal margin | Select DS3150QN when operating ambient exceeds +70°C or requires industrial qualification |
| TLK2201B | Single-channel 2.5Gbps SerDes with embedded clock recovery; no native B3ZS/HDB3 support; requires external encoding logic | Targeted at packet-based backplanes (e.g., Ethernet over SONET), not direct DS3/E3 line interfacing | Choose TLK2201B only for high-speed serial links where line coding is handled upstream; not a functional replacement for DS3150Q |
Compared with DS3150Q, DS3150QN offers identical electrical and functional behavior with enhanced thermal robustness, while TLK2201B serves a fundamentally different architectural role - it lacks integrated telephony line coding and cannot replace DS3150Q in standards-compliant DS3/E3/STS-1 physical layer implementations.
Availability
DS3150Q is available at Aetrix Electronics and suitable for SONET/SDH multiplexers, DSLAM line cards, and CSU/DSU equipment requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for telecom infrastructure programs.
Supply support for DS3150Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF ICs for communications, computing, and industrial markets.
The DS3150Q belongs to Maxim's telecommunications line interface product line, designed specifically to consolidate DS3/E3/STS-1 physical layer functions - clock recovery, encoding, jitter attenuation, and line driving - into a single, standards-compliant chip for carrier-grade network equipment.
FAQ
What is the primary function of the DS3150Q in telecom systems?
The DS3150Q serves as a complete Line Interface Unit (LIU) for DS3, E3, and STS-1 physical layer interfacing. It performs clock and data recovery, B3ZS/HDB3 encoding/decoding, jitter attenuation, adaptive equalization, and 75Ω coaxial line driving - eliminating the need for multiple discrete components in telecom line cards and multiplexers.
Does the DS3150Q support both DS3 and E3 standards simultaneously?
No - the DS3150Q operates in one mode at a time, selected by master clock frequency: 44.736MHz for DS3, 34.368MHz for E3, or 51.840MHz for STS-1. The internal B3ZS/HDB3 decoder and encoder automatically adapt to the configured rate and standard, but concurrent dual-standard operation is not supported.
How does the jitter attenuator in the DS3150Q improve system timing performance?
The DS3150Q's jitter attenuator reduces accumulated timing noise in the receive or transmit path, meeting stringent jitter transfer requirements of GR-253-CORE (STS-1), GR-499 (DS3), and G.823/G.824 (E3). When placed in the receive path, it cleans incoming jitter before clock/data recovery; in the transmit path, it produces a low-jitter output waveform even when driven by a noisy TCLK source.
Can the DS3150Q be used in monitoring applications with 20dB signal loss?
Yes - the DS3150Q includes a dedicated RMON input pin that, when asserted high, enables a built-in preamplifier to compensate for ~20dB flat resistive loss typical in DSX monitoring taps. This allows direct connection to test points without external gain stages, preserving signal integrity for diagnostics and performance verification.
What diagnostic capabilities does the DS3150Q provide for field maintenance?
The DS3150Q integrates an O.151-compliant PRBS generator and detector supporting 215−1 and 223−1 sequences, plus built-in DS3 AIS and E3 all-ones pattern generation. The PRBS detector outputs bit-error pulses synchronous to RCLK on the PRBS pin, enabling real-time physical-layer error detection without host software overhead or external test gear.
DS3150Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 28-LCC (J-Lead)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Function:
- Line Interface Unit (LIU)
- Interface:
- LIU
- Number of Circuits:
- 1
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- -
- Power (Watts):
- -
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-PLCC (11.51x11.51)
DS3150Q FAQ
1.How can I place an order for DS3150Q through Aetrix?
Please submit a Request for Quotation (RFQ) for DS3150Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS3150Q reliable?
The price and inventory of DS3150Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3150Q is usually 5 days.
3.What payment methods are accepted for DS3150Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3150Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS3150Q?
DS3150Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS3150Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS3150Q?
For technical support, including DS3150Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3150Q requirements.
6.How does Aetrix verify that DS3150Q is sourced from the original manufacturer or authorized distributors?
All DS3150Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3150Q meets industry standards.
7.What is the process for return or replacement of DS3150Q?
All DS3150Q units undergo pre-shipment inspection (PSI). If there is an issue with DS3150Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS3150Q part is unused and in its original packaging.
Return procedure for DS3150Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS3150Q Tags

-
LMC567CMX/NOPB
Texas Instruments

-
LM567CMX/NOPB
Texas Instruments

-
LM567CM/NOPB
Texas Instruments

-
VSC8531XMW-02
Microchip Technology

-
VSC8531XMW-05
Microchip Technology

-
GPY115C0VI
MaxLinear, Inc.
-
SI32185-A-FMR
Skyworks Solutions Inc.
-
VSC8541XMV-05
Microchip Technology

-
SI32178-B-FM1R
Skyworks Solutions Inc.

-
GPY215C0VI
MaxLinear, Inc.

-
CPC7514ZTR
Littelfuse Inc.

-
VSC8502XML-03
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

