Analog Devices Inc./Maxim Integrated DS3150TC1+
- Part No.:
- DS3150TC1+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Telecom
- Package:
- 48-TQFP
- Datasheet:
-
DS3150TC1+.pdf
- Description:
- IC TELECOM INTERFACE 48TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,778
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DS3150TC1+ from Maxim Integrated is a 3.3V, single-chip DS3/E3/STS-1 Line Interface Unit (LIU) performing full physical-layer interfacing including clock/data recovery, B3ZS/HDB3 encoding/decoding, jitter attenuation, and standards-compliant 75Ω coaxial line driving. It supports 44.736Mbps (DS3), 34.368Mbps (E3), and 51.840Mbps (STS-1) rates with adaptive equalization for up to 15dB cable loss and integrated LOS detection per ANSI T1.231 and ITU-T G.775. Used in SONET/SDH multiplexers and DSLAMs.
For engineers reviewing the DS3150TC1+ datasheet, DS3150TC1+ pinout, DS3150TC1+ application, or DS3150TC1+ equivalent, key selection considerations include its dual-path jitter attenuator placement, transformer-coupled 75Ω interface capability, bipolar/NRZ framer interface flexibility, built-in PRBS generator/detector (215–1 and 223–1), and compliance with ANSI T1.102, ITU-T G.703/G.751/G.823/G.824, and Telcordia GR-253-CORE/GR-499-CORE.
Technical Context
The DS3150TC1+ implements independent receive and transmit data paths with a configurable jitter attenuator that can be placed exclusively in either path or disabled. Its receiver integrates an adaptive analog equalizer (0–15dB loss compensation), analog and digital LOS detectors, and clock/data recovery synchronized to MCLK (44.736/34.368/51.840MHz) or TCLK.
The transmitter includes waveshaping circuitry meeting DS3/E3/STS-1 waveform templates, selectable Line Build-Out (LBO) for 0–450ft coax, tri-state line driver control via TTS, and on-chip AIS generators (DS3 ANSI T1.107, E3 unframed all-ones). Both paths support B3ZS (DS3/STS-1) and HDB3 (E3) coding with programmable interface polarity via ICE pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Voltage | 3.3V supply with 5V-tolerant I/O - enables direct interfacing to legacy 5V logic without level shifters. |
| Data Rates | 44.736Mbps (DS3), 34.368Mbps (E3), 51.840Mbps (STS-1) - supports all three major TDM hierarchy standards in one device. |
| Cable Loss Compensation | 0–15dB adaptive equalization - supports coax runs up to 380m (DS3), 440m (E3), or 360m (STS-1) using AT&T 734A-equivalent cable. |
| Jitter Attenuator Placement | Configurable in receive path, transmit path, or disabled - allows system-level jitter management at either ingress or egress point. |
| LOS Detection Compliance | Meets ANSI T1.231 (DS3/STS-1) and ITU-T G.775 (E3) - uses dual analog/digital detection with 175±75 zero-count threshold and defined assertion/clear timing. |
| PRBS Support | On-chip 215–1 and 223–1 generators/detectors per ITU O.151 - enables in-system physical-layer BER testing without external pattern equipment. |
| Line Driver Output | 75Ω coaxial interface with transformer coupling (1:2 step-up RX, 2:1 step-down TX) - meets ANSI T1.102, ITU-T G.703, and Telcordia waveform templates. |
Pinout & Package
DS3150TC1+ is housed in a 48-pin TQFP package (7mm × 7mm, 0.5mm pitch) rated for –40°C to +85°C industrial operation. Pin functions are validated per Maxim's DS3150 datasheet Rev 071305, Section 2 (Pin Descriptions) and Section 4 (Pin Configurations).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RX+, RX– | Differential analog receive inputs | Accept transformer-coupled B3ZS/HDB3 AMI signals from 75Ω coax; input impedance matched for line termination. |
| TX+, TX– | Differential analog transmit outputs | Drive 75Ω coax via 2:1 step-down transformer; include line build-out (LBO) control and driver monitor (DM) output. |
| RCLK | Recovered clock output | Provides NRZ or bipolar data clock synchronized to incoming line rate; polarity invertible via ICE pin for glueless framer interfacing. |
| RPOS / RNEG / RNRZ | Recovered data outputs | RPOS/RNEG for bipolar format; RNRZ for decoded NRZ; ZCSE pin selects mode - enables flexible framer compatibility. |
| TCLK | Transmit clock input | Clocks transmit data; jitter tolerance relaxed when jitter attenuator is enabled in TX path - accepts gapped or jittery clocks within 20ppm avg frequency. |
| MCLK | Master clock input | 44.736/34.368/51.840MHz reference; used by CDR and jitter attenuator; overrides TCLK when active - provides clock source redundancy. |
| LOS | Loss-of-signal indicator | Open-drain output asserted during DLOS condition per ANSI/ITU standards - directly interfaces to system fault monitoring logic. |
| TTS | Transmit tri-state control | Active-low input disabling TX driver and tri-stating TX+/TX– - enables protection switching and low-power mode. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated jitter attenuator | Configurable placement in RX or TX path - eliminates need for external jitter cleaners in timing-sensitive telecom systems. |
| B3ZS/HDB3 encode/decode | Hardware-accelerated coding per ANSI T1.107 and ITU-T G.703 - offloads framer MCU and ensures deterministic latency. |
| AGC/equalizer block | Automatic 0–15dB loss compensation - eliminates manual gain tuning across varying cable lengths and aging effects. |
| DS3/E3/STS-1 AIS generation | On-chip ANSI-compliant DS3 AIS and E3 unframed all-ones - enables rapid alarm insertion without external logic or memory. |
| Tri-state line driver | Hardware-controlled TX disable via TTS pin - supports hitless protection switching and power gating in redundant line cards. |
| Direct DSX monitor interface | Built-in preamp activated by RMON pin - enables 20dB flat-loss monitoring of live line signals without external amplification. |
Applications
| SONET/SDH Multiplexers | Digital Cross-Connect Systems (DCS) |
|---|---|
Use Scenario: Aggregating multiple DS3/E3 tributaries into OC-3/OC-12 SONET payloads at central office edge nodes. IC Role / Device Role / Timing Role: Physical-layer line interface handling clock recovery, waveform shaping, and jitter filtering for synchronous transport. Use Value: Single-chip integration reduces BOM count and PCB area while ensuring GR-253-CORE compliant jitter transfer and template adherence. |
Use Scenario: Reconfiguring DS3/E3 signal paths between service providers and enterprise customers in metro DCS platforms. IC Role / Device Role / Timing Role: Bidirectional LIU enabling both line-terminating and through-connection modes with local/remote loopback diagnostics. Use Value: On-chip PRBS generator/detector and AIS injection accelerate provisioning and fault isolation without external test gear. |
| DSL Access Multiplexers (DSLAM) | CSU/DSU Equipment |
Use Scenario: Backhauling aggregated xDSL traffic over legacy DS3 infrastructure in broadband access networks. IC Role / Device Role / Timing Role: DS3 line interface bridging ATM/PTM framing layers to physical copper plant with precise jitter control. Use Value: Adaptive equalization compensates for variable coax loss across aging telco plant, maintaining BER <10−12 under stress. |
Use Scenario: Providing carrier-grade DS3/E3 connectivity between enterprise routers and telco demarcation points. IC Role / Device Role / Timing Role: Standards-compliant LIU delivering ANSI T1.102 and ITU-T G.703 electrical interface with LOS/AIS signaling. Use Value: Drop-in replacement capability for TDK 78P7200 simplifies legacy CSU redesign while adding PRBS and jitter attenuation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar line interface unit applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS3150T+ | Same silicon, 0°C to +70°C temperature grade, 48-pin TQFP - lacks extended industrial range. | Suitable for commercial indoor equipment only; not rated for outdoor cabinet or base station environments. | Select DS3150TC1+ for deployments requiring –40°C startup or sustained operation in uncontrolled ambient conditions. |
| MAX3150CPE+ | Pin-compatible 28-pin PLCC variant - identical functionality but smaller I/O count and no DM pin. | Limited to space-constrained designs where 48-pin TQFP layout is impractical; lacks transmit driver monitor (DM) output. | Choose DS3150TC1+ when DM-based fault detection or higher thermal margin is required in carrier-grade line cards. |
Compared with DS3150T+ and MAX3150CPE+, the DS3150TC1+ delivers guaranteed industrial temperature operation, full diagnostic visibility via DM pin, and robustness for telecom infrastructure where thermal cycling and long-term reliability are critical design constraints.
Availability
DS3150TC1+ is available at Aetrix Electronics and suitable for SONET/SDH multiplexers, digital cross-connect systems, and DSLAMs requiring stable component supply across extended product lifecycles and high-reliability operating conditions.
Supply support for DS3150TC1+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, computing, and industrial markets.
The DS3150 product line delivers fully integrated, standards-compliant line interface units targeting telecom infrastructure equipment where signal integrity, jitter control, and multi-standard interoperability are essential.
FAQ
What standards does the DS3150TC1+ comply with for DS3/E3/STS-1 physical layer interfacing?
The DS3150TC1+ complies with ANSI T1.102, T1.107, T1.231, and T1.404; ITU-T G.703, G.751, G.775, G.823, and G.824; ETSI ETS 300 686/687/EN 300 689/TBR 24; and Telcordia GR-253-CORE and GR-499-CORE. These cover electrical interface, AIS generation, LOS detection, jitter tolerance/transfer, and waveform template requirements across all three data rates.
How does the jitter attenuator in the DS3150TC1+ function, and where can it be placed?
The DS3150TC1+ jitter attenuator is a configurable block that can be mapped exclusively into the receive data path, exclusively into the transmit data path, or disabled. When enabled in the RX path, it filters incoming jitter before clock/data recovery; when enabled in the TX path, it cleans the transmit clock derived from MCLK. It does not operate bidirectionally or simultaneously in both paths.
What is the role of the ZCSE pin on the DS3150TC1+, and how does it affect data interface format?
The ZCSE pin on the DS3150TC1+ selects between bipolar and NRZ framer interface formats. When ZCSE = high, the B3ZS/HDB3 decoder is disabled and recovered data appears differentially on RPOS/RNEG pins. When ZCSE = low, decoding is enabled and composite NRZ data appears on RNRZ with violation flags on RLCV - enabling direct connection to both bipolar and NRZ-based framers.
Does the DS3150TC1+ support local and remote loopback modes, and how are they controlled?
Yes, the DS3150TC1+ supports both local and remote loopback for diagnostics. Local loopback routes the transmitter output back to the receiver input internally and is controlled via register bits accessible through the device's control interface. Remote loopback is initiated by the far-end equipment sending a loopback command over the line, which the DS3150TC1+ detects and executes automatically per ANSI/ITU protocols.
What is the function of the DM (Driver Monitor) pin on the DS3150TC1+, and is it available in all packages?
The DM pin on the DS3150TC1+ is an open-drain output that asserts when the transmit driver detects a short-circuit condition (load < ~25Ω) or internal fault. It is only available in the 48-pin TQFP package (including DS3150TC1+) and is absent in the 28-pin PLCC variants - providing real-time hardware-level fault detection for carrier-grade line card protection schemes.
DS3150TC1+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 48-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Line Interface Unit (LIU)
- Interface:
- LIU
- Number of Circuits:
- 1
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- -
- Power (Watts):
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TQFP (7x7)
DS3150TC1+ FAQ
1.How can I place an order for DS3150TC1+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS3150TC1+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS3150TC1+ reliable?
The price and inventory of DS3150TC1+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3150TC1+ is usually 5 days.
3.What payment methods are accepted for DS3150TC1+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3150TC1+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS3150TC1+?
DS3150TC1+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS3150TC1+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS3150TC1+?
For technical support, including DS3150TC1+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3150TC1+ requirements.
6.How does Aetrix verify that DS3150TC1+ is sourced from the original manufacturer or authorized distributors?
All DS3150TC1+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3150TC1+ meets industry standards.
7.What is the process for return or replacement of DS3150TC1+?
All DS3150TC1+ units undergo pre-shipment inspection (PSI). If there is an issue with DS3150TC1+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS3150TC1+ part is unused and in its original packaging.
Return procedure for DS3150TC1+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DS3150TC1+ Tags

-
LMC567CMX/NOPB
Texas Instruments

-
LM567CMX/NOPB
Texas Instruments

-
LM567CM/NOPB
Texas Instruments

-
VSC8531XMW-02
Microchip Technology

-
VSC8531XMW-05
Microchip Technology

-
GPY115C0VI
MaxLinear, Inc.
-
SI32185-A-FMR
Skyworks Solutions Inc.
-
VSC8541XMV-05
Microchip Technology

-
SI32178-B-FM1R
Skyworks Solutions Inc.

-
GPY215C0VI
MaxLinear, Inc.

-
CPC7514ZTR
Littelfuse Inc.

-
VSC8502XML-03
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

