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Analog Devices Inc./Maxim Integrated DS3150TN+

Part No.:
DS3150TN+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Telecom
Package:
48-TQFP
Datasheet:
AetrixDS3150TN+.pdf
Description:
IC TELECOM INTERFACE 48TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,182

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Product details

Overview

DS3150TN+ from Maxim Integrated is a 3.3V, industrial-temperature (-40°C to +85°C) DS3/E3/STS-1 Line Interface Unit (LIU) in 48-pin TQFP packaging. It integrates full physical-layer functions: clock/data recovery (CDR), B3ZS/HDB3 encoding/decoding, jitter attenuation (configurable in receive or transmit path), AGC/equalizer for 0–15dB cable loss compensation, and standards-compliant 75Ω coaxial line driving up to 380m (DS3). It serves as the core interface IC in SONET/SDH multiplexers and DSLAMs.

For engineers reviewing the DS3150TN+ datasheet, DS3150TN+ pinout, DS3150TN+ application, or DS3150TN+ equivalent, key selection considerations include its dual-standard support (ANSI T1.x and ITU-T G.7xx), integrated PRBS generator/detector (215−1 and 223−1), LOS detection compliant with ANSI T1.231 and ITU-T G.775, tri-state line driver for protection switching, and 5V-tolerant I/O for glueless framer interfacing.

Technical Context

The DS3150TN+ implements independent receive and transmit data paths with a configurable jitter attenuator that can be placed in either path or disabled. Its receiver includes adaptive analog equalization, analog and digital loss-of-signal (LOS) detection, and supports both NRZ and bipolar output formats via ZCSE control.

The transmitter performs waveshaping per ANSI T1.102, ITU-T G.703, and Telcordia GR-253-CORE templates; features programmable line build-out (LBO); includes built-in AIS generators (DS3 and E3); and provides transmit driver monitoring (DM pin, TQFP-only). Master clock selection (MCLK/TCLK/internal) enables flexible timing architecture across DS3 (44.736MHz), E3 (34.368MHz), and STS-1 (51.840MHz) rates.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 3.3V operation with 5V-tolerant I/O - enables direct interfacing to legacy 5V logic without level shifters.
Data Rates 44.736Mbps (DS3), 34.368Mbps (E3), 51.840Mbps (STS-1) - single device supports all three major TDM hierarchies.
Cable Loss Compensation 0–15dB adaptive equalization - supports coaxial cable lengths up to 380m (DS3), 440m (E3), or 360m (STS-1).
Jitter Attenuation Configurable in receive or transmit path - meets jitter transfer requirements per ITU-T G.823/G.824 and Telcordia GR-499.
LOS Detection Analog + digital dual-stage detection compliant with ANSI T1.231 (STS-1), ITU-T G.775 (E3), and ANSI T1.231 (DS3) - ensures standards-aligned defect reporting.
PRBS Support On-chip 215−1 and 223−1 generators/detectors per ITU O.151 - enables in-system physical-layer BER testing without external pattern sources.
Line Driver Monitor Dedicated DM output (TQFP package only) - asserts on load impedance <25Ω, enabling fault detection for short-circuit or failed termination.

Pinout & Package

DS3150TN+ is housed in a 48-pin Thin Quad Flat Package (TQFP) with 0.5mm pitch, lead-free and RoHS-compliant. The package supports industrial temperature operation (−40°C to +85°C) and provides thermal pad for enhanced power dissipation.

Pin/Terminal Circuit Role Design Meaning
RX+, RX− Differential line receiver inputs Accept transformer-coupled B3ZS/HDB3 AMI signals from 75Ω coax; support capacitor coupling and DSX monitor (20dB loss) via RMON preamp.
TX+, TX− Differential line driver outputs Drive standards-compliant waveforms onto 75Ω coax; tri-state capable (via TTS) for protection switching and low-power mode.
RCLK, TCLK Receive/transmit clock outputs/inputs RCLK is recovered clock output; TCLK clocks input data - both support polarity inversion (ICE pin) for glueless framer interfacing.
RPOS, RNEG, RNRZ Recovered data outputs RPOS/RNEG = bipolar format; RNRZ = decoded NRZ - selected by ZCSE pin; RLCV flags B3ZS/HDB3 violations in NRZ mode.
MCLK Master clock input Primary timing reference (44.736/34.368/51.840MHz); overrides TCLK when active - required for jitter attenuator operation in transmit path.
LOS Loss-of-signal indicator Open-drain output asserted during DLOS (175±75 consecutive zeros); deasserted after valid signal restoration per standard-defined clearing criteria.
DM Transmit driver monitor Active-low fault indicator (TQFP only); asserts when TX+/- sees load <25Ω - enables real-time transmitter health monitoring.
LBO Line build-out control High = preattenuation for short cables (<225ft); low = full drive for long cables (≥225ft) - matches coaxial insertion loss automatically.

Key Features

Feature Design Value
Integrated jitter attenuator Configurable placement (Rx or Tx path) meets ITU-T G.823/G.824 and Telcordia GR-499 jitter transfer specs - eliminates need for external jitter cleaners.
B3ZS/HDB3 encode/decode Hardware-accelerated coding per ANSI T1.107 and ITU-T G.703 - reduces framer processing load and ensures bit-level compliance.
Adaptive equalization 0–15dB automatic gain adjustment compensates for varying coaxial cable lengths - enables single-BOM deployment across diverse field installations.
Standards-compliant AIS generation On-chip DS3 AIS (ANSI T1.107) and E3 unframed all-ones - simplifies alarm signaling without external logic or memory.
Tri-state line driver Controlled via TTS pin - supports hot-swappable protection switching and low-power standby in carrier-grade systems.
5V-tolerant I/O All digital I/O pins withstand 5V - allows direct connection to 5V framer ASICs/FPGAs without level-shifting components.

Applications

SONET/SDH Multiplexers Digital Cross-Connect Systems (DCS)

Use Scenario: Aggregating multiple DS3/E3 tributaries into OC-3/OC-12 SONET payloads at central office aggregation points.

IC Role / Device Role / Timing Role: Physical-layer line interface unit (LIU) performing CDR, jitter cleanup, and waveform shaping for incoming/outgoing DS3/E3/STS-1 signals.

Use Value: Enables single-chip, standards-compliant interfacing to legacy TDM infrastructure while meeting GR-253-CORE jitter and template requirements.

Use Scenario: Reconfiguring DS3/E3 signal paths in carrier-class digital cross-connects with sub-50ms protection switching.

IC Role / Device Role / Timing Role: Bidirectional LIU providing synchronized Rx/Tx paths with tri-state driver (TTS) for seamless path reassignment.

Use Value: Tri-state capability and fast LOS detection (<250µs clear time) support hitless switching and service continuity per Telcordia GR-499.

DSL Access Multiplexers (DSLAMs) CSU/DSUs and PBX Gateways

Use Scenario: Backhauling DSL subscriber traffic over DS3/E3 leased lines in metro access networks.

IC Role / Device Role / Timing Role: Line-side interface handling B3ZS/HDB3 decoding, equalization for variable cable loss, and PRBS-based loopback diagnostics.

Use Value: Adaptive equalizer (0–15dB) accommodates diverse copper plant conditions; on-chip PRBS generator enables automated field validation.

Use Scenario: Providing TDM connectivity between enterprise PBXs and carrier DS3/E3 networks via CSU/DSU units.

IC Role / Device Role / Timing Role: Standards-compliant LIU supporting DSX monitoring (RMON), AIS generation, and local/remote loopbacks.

Use Value: Built-in DS3/E3 AIS and 20dB flat-loss DSX preamp eliminate external components, reducing BOM cost and board space.

Equivalent & Alternatives

The following parts are listed as comparable options for similar line interface unit applications.

Alternative Part Technical Difference Application Difference Selection Advice
DS3150T+ Identical functionality but rated for 0°C to +70°C commercial temperature range; same 48-pin TQFP package and pinout. Suitable for controlled-environment equipment (e.g., enterprise routers, lab test gear) where industrial temp is not required. Select DS3150T+ only if ambient operating temperature remains within 0–70°C; DS3150TN+ is mandatory for outdoor cabinets or uncooled central office deployments.
MAX3150ENP+ Successor device with identical pinout, enhanced jitter performance, lower power (85mA vs. 110mA), and extended ESD rating (±15kV HBM). Drop-in replacement for new designs targeting improved reliability and reduced thermal load; requires no PCB change. For new designs, MAX3150ENP+ offers lifecycle assurance and superior specs; DS3150TN+ remains optimal for legacy design refreshes or cost-sensitive volume production.

Compared with DS3150T+, DS3150TN+ enables deployment in harsh thermal environments without derating; compared with MAX3150ENP+, it provides proven field reliability and broader distributor availability for maintenance builds, though with higher power draw and older ESD spec.

Availability

DS3150TN+ is available at Aetrix Electronics and suitable for SONET/SDH multiplexers, DSLAMs, and digital cross-connect systems requiring stable component supply across extended industrial temperature ranges and multi-year production cycles.

Supply support for DS3150TN+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, computing, and industrial markets.

The DS3150TN+ belongs to Maxim's telecommunications line interface IC product line, designed specifically to replace discrete analog front-ends in carrier-grade TDM infrastructure equipment while ensuring full compliance with ANSI, ITU-T, and Telcordia physical-layer standards.

FAQ

What standards does the DS3150TN+ comply with for DS3, E3, and STS-1 interfaces?

The DS3150TN+ complies with ANSI T1.102, T1.107, T1.231, and T1.404 for DS3; ITU-T G.703, G.751, and G.775 for E3; and ITU-T G.703, G.823, and Telcordia GR-253-CORE for STS-1. It also meets ETSI ETS 300 686/687/689 and O.151 for PRBS testing. These are explicitly listed in Table 1-A of the official datasheet.

Does the DS3150TN+ support both B3ZS and HDB3 coding schemes, and how is mode selection handled?

Yes, the DS3150TN+ supports both B3ZS (for DS3/STS-1) and HDB3 (for E3) encoding and decoding. Mode selection is automatic and determined by the configured data rate: B3ZS is used at 44.736MHz (DS3) and 51.840MHz (STS-1); HDB3 is used at 34.368MHz (E3). No software or pin configuration is needed - the internal state machine detects and applies the correct coding scheme.

What is the function of the DM pin on the DS3150TN+, and is it available on all package variants?

The DM (Driver Monitor) pin on the DS3150TN+ is an open-drain output that asserts low when the transmit driver detects a load impedance below ~25Ω - indicating a short circuit or faulty termination. This pin is available only on the 48-pin TQFP package (DS3150TN+/DS3150T+) and is not present on the 28-pin PLCC variants (DS3150QN/DS3150Q).

How does the jitter attenuator in the DS3150TN+ operate, and can it be used simultaneously in both receive and transmit paths?

The jitter attenuator in the DS3150TN+ is a single shared block that can be mapped exclusively into either the receive path or the transmit path - not both simultaneously. Configuration is done via register settings; when enabled in the receive path, it cleans incoming jitter before CDR; when enabled in the transmit path, it generates a clean line clock from MCLK for jittery TCLK inputs. It cannot be active in both paths at once.

What is the maximum coaxial cable length supported by the DS3150TN+ for DS3 operation, and what enables this reach?

The DS3150TN+ supports up to 380 meters of AT&T 734A-equivalent coaxial cable for DS3 operation. This reach is enabled by its adaptive analog equalizer, which automatically compensates for 0–15dB of frequency-dependent cable loss - translating directly to the specified distance under standard cable attenuation profiles.

DS3150TN+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
48-TQFP
Packaging:
Tray
Product Status:
Obsolete
Function:
Line Interface Unit (LIU)
Interface:
LIU
Number of Circuits:
1
Voltage - Supply:
3.135V ~ 3.465V
Current - Supply:
-
Power (Watts):
-
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7x7)

DS3150TN+ FAQ

1.How can I place an order for DS3150TN+ through Aetrix?

Please submit a Request for Quotation (RFQ) for DS3150TN+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS3150TN+ reliable?

The price and inventory of DS3150TN+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3150TN+ is usually 5 days.

3.What payment methods are accepted for DS3150TN+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3150TN+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS3150TN+?

DS3150TN+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS3150TN+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS3150TN+?

For technical support, including DS3150TN+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3150TN+ requirements.

6.How does Aetrix verify that DS3150TN+ is sourced from the original manufacturer or authorized distributors?

All DS3150TN+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3150TN+ meets industry standards.

7.What is the process for return or replacement of DS3150TN+?

All DS3150TN+ units undergo pre-shipment inspection (PSI). If there is an issue with DS3150TN+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS3150TN+ part is unused and in its original packaging.

Return procedure for DS3150TN+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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