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Analog Devices Inc./Maxim Integrated DS3150TN1
- Part No.:
- DS3150TN1
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Telecom
- Package:
- 48-TQFP
- Datasheet:
-
DS3150TN1.pdf
- Description:
- DS3/E3/STS-1 LINE INTERFACE UNIT
- Quantity:
- Payment:
- Shipping:
Inventory:583
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Product details
Overview
DS3150TN1 from Maxim Integrated is a 48-pin TQFP line interface unit (LIU) performing full physical-layer interfacing for DS3 (44.736 Mbps), E3 (34.368 Mbps), and STS-1 (51.840 Mbps) telecom lines. It integrates receiver (clock/data recovery, B3ZS/HDB3 decoding, LOS detection), transmitter (waveshaping, B3ZS/HDB3 encoding, 75Ω coaxial drive), and configurable jitter attenuator - all operating at 3.3V with industrial temperature range (–40°C to +85°C). Used in SONET/SDH multiplexers and DSLAMs for standards-compliant signal conditioning.
For engineers reviewing the DS3150TN1 datasheet, DS3150TN1 pinout, DS3150TN1 application, or DS3150TN1 equivalent, key selection criteria include DS3/E3/STS-1 multi-standard support, integrated jitter attenuation placement (Rx or Tx path), AGC/equalizer handling up to 15 dB cable loss, 75Ω coaxial interface compliance per ANSI T1.102, ITU G.703, and Telcordia GR-253-CORE, and TQFP-48 package compatibility with legacy LIU layouts.
Technical Context
The DS3150TN1 implements independent receive and transmit data paths with a reconfigurable jitter attenuator that can be placed exclusively in the receive path, exclusively in the transmit path, or disabled - enabling precise jitter management per system topology. Its adaptive equalizer supports 0–15 dB loss compensation across DS3 (up to 380 m), E3 (up to 440 m), and STS-1 (up to 360 m) coaxial runs using AT&T 734A-equivalent cable.
Receiver clock/data recovery operates with master clock sourcing from MCLK (44.736/34.368/51.840 MHz), TCLK, or internal oscillator, while transmitter waveshaping meets DS3/E3/STS-1 waveform templates per ANSI T1.102, ITU G.703, and Telcordia GR-253-CORE - including pulse amplitude (0.36–0.85 V for DS3), shape fidelity, and spectral power limits at harmonics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Line Standards | DS3 (ANSI T1.102/T1.231), E3 (ITU G.751/G.775), STS-1 (Telcordia GR-253-CORE, ITU G.703) |
| Data Rates | 44.736 Mbps (DS3), 34.368 Mbps (E3), 51.840 Mbps (STS-1), ±20 ppm frequency accuracy required |
| Supply Voltage | 3.3 V operation with 5 V-tolerant I/O; max supply current 110 mA |
| Cable Loss Support | Adaptive equalizer compensates 0–15 dB loss - enables direct interface to 75 Ω coax up to 440 m (E3) |
| Jitter Attenuation | Configurable placement in Rx path or Tx path; meets G.823/G.824/GR-499 Cat II jitter transfer requirements |
| LOS Detection | Digital LOS (DLOS) per ANSI T1.231 & ITU G.775: 175±75 consecutive zeros; analog LOS (ALOS) triggers squelch at –24 dB nominal |
| Package | 48-pin TQFP, industrial temperature range (–40°C to +85°C) |
Pinout & Package
DS3150TN1 is housed in a 48-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, thermally enhanced for telecom line card applications. Pin functions are defined per Maxim's DS3150 datasheet Rev 071305, Section 2 (Pin Descriptions) and Section 4 (Pin Configurations).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RX+, RX– | Differential line receiver inputs | Accept transformer-coupled B3ZS/HDB3 AMI signals from 75 Ω coax; support monitoring via RMON preamp |
| TX+, TX– | Differential line driver outputs | Drive standards-compliant waveforms onto 75 Ω coax; include driver monitor (DM) pin for fault detection |
| RCLK, TCLK | Receive/transmit clock outputs/inputs | RCLK carries recovered clock; TCLK clocks input data; both support polarity inversion via ICE pin for glueless framer interfacing |
| RPOS/RNEG, TPOS/TNEG | Bipolar-format data I/O | Enable direct bipolar interface without B3ZS/HDB3 decode/encode; ZCSE pin selects NRZ vs. bipolar mode |
| LOS, DM, PRBS | Status and diagnostic outputs | LOS asserts on DLOS/ALOS; DM indicates transmitter fault (load <25 Ω); PRBS pulses high on bit error during sync |
| MCLK, LBO, TTS | Control and configuration inputs | MCLK provides jitter-attenuated reference; LBO configures line build-out; TTS tri-states TX+/TX– for low-power/switching |
Key Features
| Feature | Design Value |
|---|---|
| Integrated jitter attenuator routing | Configurable placement in receive path or transmit path - eliminates need for external jitter cleaners in timing-critical backplanes |
| Adaptive AGC/equalizer | Automatically compensates 0–15 dB coaxial loss across DS3/E3/STS-1 rates - removes manual gain tuning for varying cable lengths |
| Built-in AIS and PRBS generation | On-chip DS3 AIS (ANSI T1.107), E3 unframed all-ones, and 215–1 / 223–1 PRBS patterns - enables loopback testing without external pattern generators |
| 75 Ω coaxial interface compliance | Meets waveform templates and spectral masks per ANSI T1.102, ITU G.703, and Telcordia GR-253-CORE - ensures interoperability with carrier-grade infrastructure |
| Tri-state line driver & fault monitor | TTS pin enables low-power shutdown; DM pin detects shorted output or load <25 Ω - supports protection switching and diagnostics in redundant systems |
Applications
| SONET/SDH Multiplexers | Digital Cross-Connect Systems (DCS) |
|---|---|
|
Use Scenario: Aggregating multiple DS3/E3 tributaries into OC-3/OC-12 SONET frames at central office edge nodes. IC Role / Device Role / Timing Role: Physical-layer line interface unit (LIU) providing clock/data recovery, jitter attenuation, and compliant waveform generation for upstream framer ingestion. Use Value: Eliminates external equalizers and jitter cleaners; supports seamless rate adaptation between DS3 (44.736 Mbps) and STS-1 (51.840 Mbps) domains with single-device footprint. |
Use Scenario: Reconfiguring DS3/E3 traffic paths in carrier-class digital cross-connects with hot-swappable line cards. IC Role / Device Role / Timing Role: Bidirectional LIU handling both receive clock recovery and transmit waveshaping with programmable jitter attenuation for path-level timing alignment. Use Value: Enables deterministic jitter transfer (<1 UI peak-to-peak per GR-499 Cat II) across switched paths, preserving network timing integrity during dynamic reconfiguration. |
| DSLAM Line Cards | ATM/Frame Relay Edge Routers |
|
Use Scenario: Providing DS3 backhaul interfaces on broadband access multiplexer line cards connecting to metro aggregation networks. IC Role / Device Role / Timing Role: Line interface with integrated LOS detection, AIS generation, and 75 Ω coax drive - directly connects to telco-provided DS3 handoff points. Use Value: Supports automatic squelching during LOS and built-in DS3 AIS transmission - reduces software overhead for alarm reporting and service restoration. |
Use Scenario: Embedding DS3/E3 WAN interfaces in enterprise or service-provider edge routers requiring carrier-grade physical layer compliance. IC Role / Device Role / Timing Role: Standards-compliant LIU performing B3ZS/HDB3 encode/decode, PRBS testing, and jitter-controlled transmit clock synthesis. Use Value: On-chip 215–1 PRBS generator/detector and remote/local loopbacks enable field-deployable physical-layer validation without test equipment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar line interface unit applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS3150T | Same core functionality and pinout, but rated for 0°C to +70°C commercial temperature range; lacks industrial-grade thermal margin | Suitable for controlled-environment enterprise gear; not qualified for outdoor cabinet or central office deployments | Select DS3150T only when ambient operating temperature remains within 0–70°C and cost sensitivity outweighs long-term reliability requirements. |
| MAX3150 | Successor device with identical 48-TQFP footprint, extended jitter tolerance, lower power (85 mA), and updated ESD rating (±15 kV HBM) | Supports same DS3/E3/STS-1 standards plus enhanced diagnostics (enhanced PRBS, improved LOS hysteresis) | Prefer MAX3150 for new designs requiring lifecycle longevity, lower thermal dissipation, or higher robustness in noisy environments. |
Compared with DS3150T, DS3150TN1 delivers guaranteed operation at –40°C to +85°C for carrier infrastructure, while MAX3150 offers measurable improvements in jitter performance, power efficiency, and ESD resilience - making it the recommended upgrade path where board layout reuse is prioritized.
Availability
DS3150TN1 is available at Aetrix Electronics and suitable for SONET/SDH multiplexers, DSLAM line cards, and digital cross-connect systems requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for DS3150TN1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, computing, and industrial markets.
The DS3150TN1 belongs to Maxim's telecommunications line interface unit (LIU) product line, engineered specifically for carrier-grade DS3/E3/STS-1 physical layer interfacing with integrated jitter control, adaptive equalization, and standards-compliant waveform generation.
FAQ
What telecom standards does the DS3150TN1 comply with?
The DS3150TN1 complies with ANSI T1.102 (DS3 electrical interface), T1.231 (LOS monitoring), ITU-T G.703 (75 Ω interface), G.751 (E3), G.775 (LOS/AIS criteria), G.823/G.824 (jitter control), Telcordia GR-253-CORE (SONET), and ETSI ETS 300 686/687 (E3 leased lines). All compliance is verified per Maxim's DS3150 datasheet Rev 071305, Table 1-A and waveform test limits in Tables 1-C through 1-G. DS3150TN1 meets these standards natively without external components.
Does DS3150TN1 support both B3ZS and HDB3 line coding?
Yes, DS3150TN1 supports both B3ZS for DS3 and STS-1 modes and HDB3 for E3 mode - with dedicated decoder/encoder logic selectable via ZCSE pin state and rate configuration. In NRZ mode (ZCSE = low), B3ZS decoding occurs for DS3/STS-1 and HDB3 decoding for E3; in bipolar mode (ZCSE = high), encoding/decoding is bypassed. DS3150TN1 implements full ANSI T1.107 DS3 AIS and unframed all-ones E3 AIS generation per datasheet Sections 1.1 and 1.2.
How is jitter managed in DS3150TN1 - and can the jitter attenuator be used in both paths?
DS3150TN1 features a single configurable jitter attenuator that can be mapped exclusively into the receive path, exclusively into the transmit path, or disabled - but not simultaneously active in both. When enabled in the receive path, it filters incoming jitter before clock/data recovery; when enabled in the transmit path, it cleans the transmit clock derived from MCLK. DS3150TN1 meets GR-499 Cat II and G.823/G.824 jitter transfer requirements in either configuration, as validated in Figure 1-8 of the datasheet.
What is the function of the DM pin on DS3150TN1, and is it available in all packages?
The DM (Driver Monitor) pin on DS3150TN1 is an open-drain output that asserts low when the transmitter detects a faulty condition - specifically, when TX+/TX– sees a load impedance below approximately 25 Ω, indicating a short circuit or severe mismatch. Per the datasheet (page 11), DM is available only in the TQFP package (including DS3150TN1); it is not present in the 28-pin PLCC variants (DS3150QN/DS3150Q). This enables real-time hardware-level fault detection in carrier-grade line cards.
Can DS3150TN1 operate without an external master clock?
Yes, DS3150TN1 can operate without an external master clock: when MCLK is wired low, the device uses its internal oscillator as the master clock source. However, this internal oscillator is not transmission-grade - it lacks the ±20 ppm accuracy and low jitter required for line-rate timing. For compliant DS3/E3/STS-1 operation, MCLK or TCLK must be supplied externally at 44.736 MHz, 34.368 MHz, or 51.840 MHz respectively. DS3150TN1's internal oscillator is intended only for functional verification or non-critical timing contexts.
DS3150TN1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 48-TQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Function:
- Line Interface Unit (LIU)
- Interface:
- DS3, E3, STS-1
- Number of Circuits:
- 1
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- 110mA
- Power (Watts):
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TQFP (7x7)
DS3150TN1 FAQ
1.How can I place an order for DS3150TN1 through Aetrix?
Please submit a Request for Quotation (RFQ) for DS3150TN1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS3150TN1 reliable?
The price and inventory of DS3150TN1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3150TN1 is usually 5 days.
3.What payment methods are accepted for DS3150TN1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3150TN1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS3150TN1?
DS3150TN1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS3150TN1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS3150TN1?
For technical support, including DS3150TN1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3150TN1 requirements.
6.How does Aetrix verify that DS3150TN1 is sourced from the original manufacturer or authorized distributors?
All DS3150TN1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3150TN1 meets industry standards.
7.What is the process for return or replacement of DS3150TN1?
All DS3150TN1 units undergo pre-shipment inspection (PSI). If there is an issue with DS3150TN1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS3150TN1 part is unused and in its original packaging.
Return procedure for DS3150TN1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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