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Analog Devices Inc./Maxim Integrated DS3150TNC1+
- Part No.:
- DS3150TNC1+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Telecom
- Package:
- 48-TQFP
- Datasheet:
-
DS3150TNC1+.pdf
- Description:
- IC TELECOM INTERFACE 48TQFP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
DS3150TNC1+ from Maxim Integrated is a 48-pin TQFP line interface unit (LIU) for DS3 (44.736 Mbps), E3 (34.368 Mbps), and STS-1 (51.840 Mbps) physical-layer interfacing. It integrates receiver clock/data recovery, transmitter waveshaping, and configurable jitter attenuation in a single 3.3V device with 110mA max supply current. It supports B3ZS/HDB3 encoding/decoding, 0–15dB adaptive equalization, and direct 75Ω coaxial cable drive up to 440m (E3).
For engineers reviewing the DS3150TNC1+ datasheet, DS3150TNC1+ pinout, DS3150TNC1+ application, or DS3150TNC1+ equivalent, key selection criteria include jitter attenuation path mapping (Rx/Tx/disabled), LOS detection compliance with ANSI T1.231 and ITU G.775, transformer-coupled 75Ω interface design, bipolar/NRZ framer interface flexibility, and built-in PRBS generator/detector for loopback validation.
Technical Context
The DS3150TNC1+ implements independent analog receive and digital transmit paths with a shared jitter attenuator that can be routed into either path or disabled. Its receiver includes an AGC/equalizer block supporting 0–15dB cable loss compensation, dual analog/digital LOS detection per ANSI/ITU standards, and selectable B3ZS/HDB3 decoding with RLCV violation flagging.
The transmitter features programmable line build-out (LBO), tri-state line driver control via TTS, integrated DS3 AIS and unframed all-ones pattern generation, and transmit driver monitor (DM) output-available only in TQFP packages. Clock inversion via ICE pin enables glueless interfacing with diverse framers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supported Rates | DS3: 44.736 Mbps ±20ppm; E3: 34.368 Mbps ±20ppm; STS-1: 51.840 Mbps ±20ppm - defines exact line-rate operation windows per telecom standard. |
| Line Interface | 75Ω coaxial, transformer-coupled (1:2 step-up Rx / 2:1 step-down Tx) - determines external passive component selection and PCB layout constraints. |
| Equalization Range | 0 dB to 15 dB - compensates for signal degradation across up to 440m E3 cable (AT&T 734A equivalent), eliminating need for external equalizers. |
| Jitter Attenuator | Configurable in Rx path, Tx path, or disabled - enables system-level jitter cleanup without external PLLs or clock cleaners. |
| LOS Detection | Analog + digital dual-stage per ANSI T1.231 & ITU G.775 - ensures compliant alarm assertion/clearance timing and avoids false triggers during marginal signal conditions. |
| PRBS Support | 2¹⁵−1 and 2²³−1 patterns per ITU O.151 - enables full physical-layer bit-error testing without external test equipment. |
| Supply & Power | 3.3V operation, 5V-tolerant I/O, max 110mA - simplifies power design and allows interoperability with legacy 5V logic interfaces. |
Pinout & Package
DS3150TNC1+ is housed in a 48-pin Thin Quad Flat Package (TQFP) with 0.5mm pitch, thermally enhanced for industrial temperature operation (−40°C to +85°C). Pin functions are validated per Maxim's official DS3150 datasheet (Rev 071305), pages 17–20.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RX+, RX− | Differential analog receive inputs | Accept transformer-coupled B3ZS/HDB3 AMI signals from 75Ω coax; require external AC coupling and termination per Figure 1-2. |
| TX+, TX− | Differential analog transmit outputs | Drive 75Ω coax via 2:1 step-down transformer; support tri-state via TTS pin for protection switching. |
| RCLK, TCLK | Receive/transmit clock outputs/inputs | RCLK is recovered clock; TCLK clocks input data - both support polarity inversion via ICE for framer compatibility. |
| RPOS/RNEG, TPOS/TNEG | Bipolar-format data I/O | Enable direct bipolar framer interfacing without external level-shifting; ZCSE pin selects bipolar vs NRZ mode. |
| LOS | Digital loss-of-signal indicator | Open-drain output asserted during DLOS per ANSI/ITU standards; used for system fault reporting and automatic failover. |
| DM | Transmit driver monitor | Active-low fault indicator (TQFP only); asserts when TX output sees <25Ω load - detects shorted cable or failed driver. |
| MCLK | Master clock input | Selects primary timing source: if toggling, overrides TCLK; if low, enables internal oscillator - critical for jitter attenuator reference. |
| LBO | Line build-out control | High = preattenuation for short cables (<225 ft); low = full drive for long cables - ensures waveform template compliance at cross-connect. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated jitter attenuator routing | Configurable in receive or transmit path - eliminates need for discrete jitter cleaners while maintaining standards-compliant jitter transfer. |
| Built-in DS3 AIS and E3 unframed all-ones generators | On-chip pattern generation via TDS0/TDS1 pins - enables rapid line provisioning and remote diagnostics without external signal sources. |
| Adaptive equalizer with 0–15dB range | Automatically compensates for varying coax lengths (0–440m E3) - removes manual gain tuning and improves field deployment robustness. |
| Tri-state line driver with TTS control | Enables low-power standby and seamless protection switching in redundant systems - reduces power consumption and supports hitless switchover. |
| Direct DSX monitor interface with RMON preamp | 20dB flat-gain preamplifier activated by RMON high - allows monitoring of live line signals without external amplifiers or resistive taps. |
Applications
| SONET/SDH Multiplexers | Digital Cross-Connect Systems (DCS) |
|---|---|
Use Scenario: Aggregating multiple DS3/E3 tributaries into OC-3/OC-12 SONET payloads at central office edge nodes. IC Role / Device Role / Timing Role: Physical-layer line interface unit handling clock recovery, waveform shaping, and jitter attenuation for synchronous transport. Use Value: Meets GR-253-CORE jitter transfer requirements and supports seamless integration with SONET framers via RCLK/TCLK inversion and NRZ/bipolar mode selection. | Use Scenario: Reconfiguring DS3/E3 connectivity between service providers and enterprise customers in metro DCS platforms. IC Role / Device Role / Timing Role: Bidirectional LIU providing independent Rx/Tx paths with local/remote loopback for provisioning verification. Use Value: Built-in 2¹⁵−1/2²³−1 PRBS generator/detector enables automated bit-error testing without external test gear, accelerating commissioning cycles. |
| DSLAM Line Cards | ATM/Frame Relay Edge Routers |
Use Scenario: Backhauling aggregated xDSL traffic over legacy DS3 infrastructure in broadband access networks. IC Role / Device Role / Timing Role: DS3 line interface bridging ATM cell streams to TDM transport, with AIS generation for alarm signaling. Use Value: Complete DS3 AIS generator (ANSI T1.107) and automatic data squelching during LOS ensure standards-compliant alarm propagation to upstream network elements. | Use Scenario: Providing DS3/E3 WAN interfaces on modular router line cards for enterprise and carrier-grade deployments. IC Role / Device Role / Timing Role: Physical-layer transceiver enabling framer-agnostic connectivity via programmable ZCSE-controlled NRZ/bipolar I/O. Use Value: 5V-tolerant I/O and 3.3V core simplify mixed-voltage board design; LBO control ensures waveform compliance across variable cable plant lengths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar line interface unit applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS3150TN+ | Same silicon, identical electrical specs, but rated for −40°C to +85°C industrial temp range - no functional difference from DS3150TNC1+. | No application difference; both target telecom infrastructure requiring extended temperature operation. | Select DS3150TN+ when full industrial temp qualification documentation is required; DS3150TNC1+ is functionally identical with same packaging and reliability screening. |
| MAX3150TNC1+ | Same device - DS3150TNC1+ is the Maxim part number; MAX3150TNC1+ is not a valid alternate and appears to be a mislabeling of the same product. | No application difference - this is not a true alternative but a duplicate identifier. | DS3150TNC1+ is the correct and only valid ordering part number; avoid confusion with non-existent MAX3150 variants. |
Compared with DS3150TNC1+, DS3150TN+ offers identical functionality and pinout with formally documented industrial temperature validation, while no verified third-party alternative exists - designers should rely on DS3150TNC1+ or its direct temperature-grade variant for DS3/E3/STS-1 LIU requirements.
Availability
DS3150TNC1+ is available at Aetrix Electronics and suitable for SONET multiplexers, digital cross-connects, DSLAM line cards, and ATM edge routers requiring stable component supply, long-term lifecycle support, and traceable sourcing for telecom infrastructure programs.
Supply support for DS3150TNC1+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF ICs for industrial, communications, and computing applications.
The DS3150 product line delivers fully integrated line interface units for DS3/E3/STS-1 physical layer interfacing, designed to replace discrete solutions and reduce bill-of-materials in telecom access and transport equipment.
FAQ
What standards does the DS3150TNC1+ comply with for DS3, E3, and STS-1 interfaces?
The DS3150TNC1+ complies with ANSI T1.102, T1.107, T1.231, and T1.404; ITU-T G.703, G.751, G.775, G.823, and G.824; ETSI ETS 300 686/687/689; and Telcordia GR-253-CORE and GR-499-CORE. These cover waveform templates, jitter tolerance/transfer, LOS detection, and AIS generation for all three rates. DS3150TNC1+ meets each standard's specific test limits as defined in Tables 1-C through 1-G and Figures 1-3/1-4/1-8 of its datasheet.
Does the DS3150TNC1+ support both B3ZS and HDB3 coding schemes?
Yes, the DS3150TNC1+ supports both B3ZS for DS3 and STS-1 modes and HDB3 for E3 mode. The coding scheme is automatically selected based on the configured data rate - no external configuration is needed. B3ZS/HDB3 encoding and decoding are performed in hardware, with violation flags reported on the RLCV pin in NRZ mode. DS3150TNC1+ also supports bypass of encoding/decoding for bipolar-mode operation when ZCSE is high.
How is jitter attenuation configured in the DS3150TNC1+?
Jitter attenuation in the DS3150TNC1+ is configured via register settings or pin strapping (per datasheet Section 1.4) to operate in the receive path, transmit path, or be disabled. When enabled in the receive path, it cleans incoming jitter before clock/data recovery; when enabled in the transmit path, it generates a clean transmit clock from MCLK. DS3150TNC1+ uses the same master clock (MCLK or TCLK) for jitter attenuation regardless of path selection.
What is the purpose of the DM pin on the DS3150TNC1+?
DM (Driver Monitor) is an active-low open-drain output available only on TQFP-packaged devices like DS3150TNC1+. It asserts when the transmit driver detects a load impedance below ~25Ω - indicating a shorted output or faulty cable. DM deasserts when the load returns to normal. This enables real-time hardware-level fault detection without software polling, improving system reliability in mission-critical telecom links using DS3150TNC1+.
Can the DS3150TNC1+ interface directly to a DSX monitor point?
Yes, the DS3150TNC1+ supports direct DSX monitoring via the RMON pin. When RMON is driven high, the internal preamplifier provides 20dB flat gain to compensate for typical 20dB resistive loss in DSX monitoring taps. This allows the DS3150TNC1+ to recover and process live line signals without external amplification - a key capability for in-service diagnostics and performance monitoring in deployed telecom infrastructure using DS3150TNC1+.
DS3150TNC1+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 48-TQFP
- Packaging:
- Tube
- Product Status:
- Obsolete
- Function:
- Line Interface Unit (LIU)
- Interface:
- LIU
- Number of Circuits:
- 1
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- -
- Power (Watts):
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TQFP (7x7)
DS3150TNC1+ FAQ
1.How can I place an order for DS3150TNC1+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS3150TNC1+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS3150TNC1+ reliable?
The price and inventory of DS3150TNC1+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3150TNC1+ is usually 5 days.
3.What payment methods are accepted for DS3150TNC1+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3150TNC1+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS3150TNC1+?
DS3150TNC1+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS3150TNC1+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS3150TNC1+?
For technical support, including DS3150TNC1+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3150TNC1+ requirements.
6.How does Aetrix verify that DS3150TNC1+ is sourced from the original manufacturer or authorized distributors?
All DS3150TNC1+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3150TNC1+ meets industry standards.
7.What is the process for return or replacement of DS3150TNC1+?
All DS3150TNC1+ units undergo pre-shipment inspection (PSI). If there is an issue with DS3150TNC1+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS3150TNC1+ part is unused and in its original packaging.
Return procedure for DS3150TNC1+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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