Analog Devices Inc./Maxim Integrated DS3151NB1
- Part No.:
- DS3151NB1
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Telecom
- Package:
- 144-BGA, CSPBGA
- Datasheet:
-
DS3151NB1.pdf
- Description:
- IC TELECOM INTERFACE 144CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:522
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Product details
Overview
DS3151NB1 from Maxim Integrated (now Analog Devices) is a single-channel Line Interface Unit (LIU) for DS3 (44.736 Mbps), E3 (34.368 Mbps), and STS-1 (51.840 Mbps) physical-layer interfacing. It integrates independent receive/transmit paths, on-chip jitter attenuation, B3ZS/HDB3 encoding/decoding, and supports 75Ω coaxial cable up to 380m (DS3). Used in SONET/SDH multiplexers and digital cross-connect systems.
For engineers reviewing the DS3151NB1 datasheet, DS3151NB1 pinout, DS3151NB1 application, or DS3151NB1 equivalent, key selection considerations include its 144-pin thermally enhanced CSBGA package, -40°C to +85°C industrial temperature rating, hardware/CPU bus configuration modes, and compliance with ANSI T1.102, ITU G.703, and GR-253-CORE standards.
Technical Context
The DS3151NB1 implements full DS3/E3/STS-1 physical layer functionality with separate AGC/equalizer-based receiver and pulse-shaping transmitter. Its receiver performs clock/data recovery from AMI signals, includes dual LOS detection (analog and digital per ANSI T1.231/ITU G.775), and supports optional B3ZS/HDB3 decoding with line-code violation monitoring.
The transmitter accepts binary or bipolar framer input, provides gapped-clock operation up to 51.84 MHz, features programmable line build-out (LBO), and generates compliant DS3 AIS (ANSI T1.107) and E3 unframed all-ones patterns. Jitter attenuation can be placed exclusively in either receive or transmit path - not both - with priority given to transmitter-side enable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rates | DS3: 44.736 Mbps ±20 ppm; E3: 34.368 Mbps ±20 ppm; STS-1: 51.840 Mbps ±20 ppm - defines master clock input requirements and framer interface timing. |
| Input Impedance | 75Ω differential via RXP/RXN - requires 1:2 step-up transformer coupling for direct coaxial line interface. |
| Output Drive | Differential AMI output on TXP/TXN - mandates 2:1 step-down transformer to match 75Ω coaxial line impedance. |
| Jitter Attenuation | Configurable placement in receive or transmit path only - enables deterministic jitter cleanup without cascaded filtering artifacts. |
| LOS Detection | Dual analog/digital LOS per ANSI T1.231 and ITU G.775 - ensures robust signal loss reporting across telecom network layers. |
| Power Supply | 3.3V core with 5V-tolerant I/O - simplifies mixed-voltage system integration and eliminates level-shifter requirements. |
| Temperature Range | -40°C to +85°C - qualified for industrial-grade carrier equipment deployment without derating. |
Pinout & Package
DS3151NB1 uses a 144-pin, 13mm × 13mm thermally enhanced chip-scale ball grid array (TE-CSBGA) with 0.8mm pitch. The package supports high-density PCB layouts and efficient thermal dissipation in telecom line cards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RXPn / RXNn | Differential analog receiver inputs | Accepts AMI-encoded signal from 75Ω coax; requires external 1:2 step-up transformer per channel. |
| TXPn / TXNn | Differential analog transmitter outputs | Drives 75Ω coax via external 2:1 step-down transformer; supports tri-state for protection switching. |
| TCLKn / RCLKn | Transmit/receive clock I/O | TCLK: accepts DS3/E3/STS-1 master clock; RCLK: outputs recovered clock with configurable edge alignment. |
| TPOSn/TDATn / RPOSn/RDATn | Bipolar/binary data interface | Selectable via TBIN/RBIN pins; enables glueless connection to framer ICs supporting either AMI or NRZ formats. |
| TTSn / RTSn | Transmit/receive tri-state control | Active-low enables wire-OR redundancy without external muxes - critical for hitless protection switching. |
| HIZ / RST / HW | Global control terminals | HIZ enables high-impedance mode; RST resets internal logic; HW selects hardware vs. CPU bus configuration mode. |
Key Features
| Feature | Design Value |
|---|---|
| Per-port power-down control | Reduces active channel count to minimize dynamic power in multi-LIU systems without disabling entire device. |
| On-chip PRBS generator/detector (2¹⁵−1, 2²³−1) | Enables in-system BER testing without external test equipment - supports loopback diagnostics at full line rate. |
| Programmable clock inversion (RCINV/TCINV) | Eliminates need for external inverters when interfacing with framer ICs having opposite clock-edge sampling requirements. |
| JTAG IEEE 1149.1 boundary scan | Supports production-level board-level test and debug of high-speed serial interconnects in dense line-card assemblies. |
| Local/remote loopback support | Facilitates isolation of physical layer faults (cable, transformer, LIU) during field commissioning and maintenance. |
Applications
| SONET/SDH Multiplexers | Digital Cross-Connect Systems (DCS) |
|---|---|
|
Use Scenario: Aggregating multiple DS3/E3 tributaries into OC-3/OC-12 SONET payloads within central office transport shelves. IC Role / Device Role / Timing Role: Physical layer interface converting framer-generated parallel data to AMI-coded serial line signals compliant with GR-253-CORE. Use Value: Enables single-chip DS3/E3/STS-1 support with jitter attenuation meeting G.823/G.824 wander limits for synchronous network operation. |
Use Scenario: Providing non-blocking switching fabric between legacy TDM networks and packet-optical transport layers. IC Role / Device Role / Timing Role: Line termination unit performing clock recovery, AIS generation, and signal regeneration on each DS3/E3 port. Use Value: Supports hitless protection switching via tri-state outputs and maintains timing integrity across redundant paths using integrated jitter attenuator. |
| DSLAM Line Cards | ATM/Frame Relay Edge Routers |
|
Use Scenario: Backhauling aggregated xDSL subscriber traffic over DS3/E3 leased lines to broadband remote access servers. IC Role / Device Role / Timing Role: Physical interface bridging DSLAM's internal backplane to carrier-provided DS3/E3 infrastructure. Use Value: Dual LOS detection and line-code violation monitoring ensure rapid fault isolation in metro access networks with variable cable lengths. |
Use Scenario: Connecting enterprise WAN routers to carrier DS3/E3 handoff points in service provider POPs. IC Role / Device Role / Timing Role: Line interface providing framer-compatible binary/bipolar data exchange and AIS signaling for link management. Use Value: Hardware-mode configuration allows standalone operation without host processor - reducing BOM cost and firmware complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar line interface unit applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS3151N | Same silicon die and pinout; differs only in temperature grade (-40°C to +85°C vs. DS3151NB1's -40°C to +85°C - identical spec) | No functional difference; DS3151N is standard ordering code for industrial temp grade - DS3151NB1 is same part with tape-and-reel packaging variant | Select DS3151N for standard reel delivery; DS3151NB1 indicates bulk or special packaging - electrical and thermal specs are identical. |
| DS3152N | Dual-channel LIU in same 144-pin TE-CSBGA package - doubles port density but shares power and thermal budget | Suitable where two DS3/E3 ports are required per card slot; increases per-device throughput but requires careful thermal layout | Choose DS3152N to reduce component count in dual-port designs; verify thermal margin and supply current headroom before substitution. |
Compared with DS3151NB1, DS3151N offers identical performance and compatibility with no design changes needed, while DS3152N provides higher port density at the cost of increased power dissipation and shared package thermal resistance - requiring layout review for thermal compliance.
Availability
DS3151NB1 is available at Aetrix Electronics and suitable for SONET multiplexers, digital cross-connect systems, and DSLAM line cards requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for DS3151NB1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices (via acquisition of Maxim Integrated) is a global leader in high-performance analog, mixed-signal, and RF technologies for communications infrastructure and industrial applications.
The DS3151NB1 belongs to Maxim's legacy telecommunications line interface portfolio, designed specifically for carrier-grade DS3/E3/STS-1 physical layer termination in space-constrained, thermally demanding line cards.
FAQ
What is the operating temperature range specified for the DS3151NB1?
The DS3151NB1 is rated for industrial operation from -40°C to +85°C ambient temperature. This specification is validated per Maxim's qualification standards and aligns with ETSI and Telcordia requirements for carrier equipment deployed in uncontrolled environments such as outside plant cabinets and central office shelves. DS3151NB1 maintains full electrical performance across this range without derating.
Does the DS3151NB1 support both hardware-mode and CPU bus-mode configuration?
Yes, the DS3151NB1 supports both hardware-mode and CPU bus-mode configuration via the HW pin. When HW = 1, configuration is set by pull-up/pull-down resistors on dedicated pins; when HW = 0, the same pins become an 8-bit address/data bus with control signals (CS, WR, RD, ALE). DS3151NB1 retains key global pins like RST and HIZ in both modes to support protection switching and system reset functions.
What transformer ratios are required for DS3151NB1 interface to 75Ω coaxial cable?
The DS3151NB1 requires a 1:2 step-up transformer on the receiver side (RXP/RXN) and a 2:1 step-down transformer on the transmitter side (TXP/TXN) to match 75Ω coaxial line impedance. These ratios are specified in Maxim's application guidance and validated in Figure 1-1 of the DS3151NB1 datasheet. Recommended parts include Pulse Engineering H1102 and Coilcraft YA1287-BL.
Can the jitter attenuator in the DS3151NB1 be used simultaneously in both receive and transmit paths?
No. The DS3151NB1's jitter attenuator can be placed exclusively in either the receive path (via RJAn) or the transmit path (via TJAn), but not both concurrently. When both RJAn and TJAn are asserted, the transmitter-path setting takes precedence per the DS3151NB1 register map and functional description. This architecture prevents phase ambiguity and ensures deterministic jitter transfer function.
Is the DS3151NB1 pin-compatible with other devices in the DS315x family?
Yes, the DS3151NB1 shares identical pinout, package dimensions, and footprint with DS3152N, DS3153N, and DS3154N - all use the 144-pin 13mm × 13mm TE-CSBGA. However, channel count differs: DS3151NB1 is single-port, DS3152N is dual-port, etc. PCB layout can be reused across the family, but software initialization and power delivery must scale with active LIU count.
DS3151NB1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 144-BGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Line Interface Unit (LIU)
- Interface:
- LIU
- Number of Circuits:
- 1
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- 75mA
- Power (Watts):
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 144-TECSBGA (13x13)
DS3151NB1 FAQ
1.How can I place an order for DS3151NB1 through Aetrix?
Please submit a Request for Quotation (RFQ) for DS3151NB1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS3151NB1 reliable?
The price and inventory of DS3151NB1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3151NB1 is usually 5 days.
3.What payment methods are accepted for DS3151NB1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3151NB1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS3151NB1?
DS3151NB1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS3151NB1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS3151NB1?
For technical support, including DS3151NB1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3151NB1 requirements.
6.How does Aetrix verify that DS3151NB1 is sourced from the original manufacturer or authorized distributors?
All DS3151NB1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3151NB1 meets industry standards.
7.What is the process for return or replacement of DS3151NB1?
All DS3151NB1 units undergo pre-shipment inspection (PSI). If there is an issue with DS3151NB1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS3151NB1 part is unused and in its original packaging.
Return procedure for DS3151NB1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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