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Analog Devices Inc./Maxim Integrated DS3153
- Part No.:
- DS3153
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Telecom
- Package:
- 144-BGA, CSPBGA
- Datasheet:
-
DS3153.pdf
- Description:
- IC TELECOM INTERFACE 144CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:394
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Product details
Overview
DS3153 from Maxim Integrated (now part of Analog Devices) is a triple-channel line interface unit (LIU) for physical-layer interfacing to DS3 (44.736 Mbps), E3 (34.368 Mbps), or STS-1 (51.840 Mbps) coaxial transmission lines. It integrates three independent receive/transmit paths, each with clock/data recovery, transmit waveshaping, and configurable jitter attenuation. Used in SONET/SDH multiplexers and digital cross-connects requiring multi-port TDM line termination.
For engineers reviewing the DS3153 datasheet, DS3153 pinout, DS3153 application, or DS3153 equivalent, this page delivers verified technical context on triple-port DS3/E3/STS-1 LIU operation, hardware/CPU bus configuration modes, jitter attenuator routing, transformer-coupled 75Ω interface compliance, and industrial-temperature (-40°C to +70°C) operation in a 144-pin thermally enhanced CSBGA package.
Technical Context
The DS3153 implements three identical, independently configurable LIU channels-each with adaptive AGC/equalizer (0–15 dB loss compensation), B3ZS/HDB3 decoding (receiver) and encoding (transmitter), and dual-path jitter attenuator placement (receive or transmit path only). Each channel supports binary or bipolar framer interfaces and includes PRBS generator/detector (215−1 and 223−1).
It operates in two mutually exclusive configuration modes: hardware mode (pin-strapped control, status output pins) and CPU bus mode (8-bit microprocessor interface with register access, interrupt support, and glueless Motorola/Intel timing). Jitter attenuation is implemented via a PLL-based architecture meeting ITU-T G.823/G.824 and Telcordia GR-253-CORE requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Number of LIUs | 3 independent DS3/E3/STS-1 line interface channels |
| Data Rates | DS3: 44.736 Mbps ±20 ppm; E3: 34.368 Mbps ±20 ppm; STS-1: 51.840 Mbps ±20 ppm |
| Input/Output Interface | 75Ω coaxial differential AMI signaling via 1:2 (RX) and 2:1 (TX) transformers; supports up to 380m (DS3), 440m (E3), 360m (STS-1) |
| Jitter Attenuation | Configurable per channel into receive or transmit data path; meets G.823/G.824 mask requirements |
| Operating Temperature | 0°C to +70°C (commercial grade); full functionality across range without derating |
| Supply Voltage | 3.3V core supply with 5V-tolerant I/O pins-enables direct interfacing to legacy 5V logic without level shifters |
| Package | 144-pin thermally enhanced CSBGA (13mm × 13mm); θJA = 29.5°C/W (natural convection) |
Pinout & Package
DS3153 uses a 144-pin thermally enhanced chip-scale ball grid array (TE-CSBGA) package measuring 13mm × 13mm with 0.8mm pitch. The package features exposed thermal pad for enhanced heat dissipation and is RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RXP1–RXP3 / RXN1–RXN3 | Differential analog receiver inputs | Accept AMI-encoded signals from 75Ω coax; require external 1:2 step-up transformer per channel |
| TXP1–TXP3 / TXN1–TXN3 | Differential analog transmitter outputs | Drive 75Ω coax via external 2:1 step-down transformer; tri-stateable per channel via TTSn |
| TCLK1–TCLK3 / RCLK1–RCLK3 | Transmit/receive clock I/O | TCLK: accepts master clock (DS3/E3/STS-1 rate); RCLK: outputs recovered clock with programmable edge alignment |
| TPOS1–TPOS3 / TDAT1–TDAT3 | Transmit data input (bipolar/binary) | Sampled on rising/falling TCLK edge; TBIN bit selects interface mode-no external framing logic required |
| RPOS1–RPOS3 / RDAT1–RDAT3 | Receive data output (bipolar/binary) | Outputs recovered AMI pulses or decoded binary data; synchronized to RCLK edge per RCINV setting |
| HIZ, RST, HW | Global control inputs | HIZ enables high-impedance state for all I/O; RST resets internal logic; HW selects hardware (high) or CPU bus (low) mode |
Key Features
| Feature | Design Value |
|---|---|
| Per-channel power-down control | Reduces active channel count to minimize dynamic power; maintains full functionality on remaining channels |
| Programmable clock inversion (RCINV/TCINV) | Enables glueless interface to framer ICs with inverted clock domains-eliminates external inverters |
| Tri-stateable TX/RX outputs (TTSn/RTSn) | Supports protection switching architectures by allowing wire-OR of multiple LIU outputs without external muxes |
| Integrated PRBS generator/detector (215−1, 223−1) | Enables in-system BER testing without external test equipment; supports loopback diagnostics at full line rate |
| IEEE 1149.1 JTAG boundary scan | Provides production-level interconnect test capability and facilitates board-level debug without intrusive probing |
Applications
| SONET/SDH Multiplexers | Digital Cross-Connect Systems (DCS) |
|---|---|
|
Use Scenario: Aggregating and grooming DS3/E3/STS-1 tributaries in metro optical transport nodes. IC Role / Device Role / Timing Role: Physical-layer line termination for three independent synchronous TDM streams; provides clock/data recovery and jitter cleanup before mapping into SONET SPEs. Use Value: Eliminates need for discrete equalizers, clock cleaners, and line drivers-reducing BOM count and board area by >40% per port. |
Use Scenario: Reconfigurable time-slot switching between DS3/E3 feeds in central office DCS shelves. IC Role / Device Role / Timing Role: Triple-port LIU providing independent receive/transmit paths with per-channel loopback and AIS generation for maintenance signaling. Use Value: Enables non-disruptive service provisioning via local/remote loopbacks and real-time LOS/AIS monitoring per port. |
| DSLAM Line Cards | ATM Edge Routers |
|
Use Scenario: Backhaul interface from DSLAM aggregation cards to upstream ATM or IP backbone. IC Role / Device Role / Timing Role: DS3/E3 line interface converting copper-based DSLAM traffic to synchronous TDM for transport over SONET rings. Use Value: Supports both B3ZS (North America) and HDB3 (Europe) line coding-enabling single SKU deployment across global markets. |
Use Scenario: Interfacing ATM switch fabric to legacy DS3/E3 WAN links in enterprise edge routers. IC Role / Device Role / Timing Role: Physical-layer termination with jitter attenuation and PRBS-based link integrity verification prior to cell segmentation. Use Value: Meets GR-253-CORE jitter transfer requirements-ensuring stable cell delay variation (CDV) under network stress conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar line interface unit applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS3153N | Same triple-LIU functionality but rated for -40°C to +85°C industrial temperature range; identical pinout and register map | Required for outdoor cabinet or uncontrolled environment deployments where ambient exceeds +70°C | Select DS3153N when extended temperature operation is mandatory; otherwise DS3153 suffices for commercial indoor systems. |
| DS3152 | Dual-channel variant (2 LIUs); shares same architecture, features, and package-but lacks third channel | Suitable for cost-sensitive 2-port applications where third port is unused; reduces channel density by 33% | Choose DS3152 only if system design strictly requires exactly two DS3/E3 ports-avoid over-provisioning with DS3153. |
Compared with DS3153, DS3153N offers identical electrical and functional performance with extended thermal tolerance, while DS3152 provides a lower-density alternative that trades channel count for reduced cost and power-neither is pin-compatible with DS3153 in terms of port count, but both share identical interface timing, register structure, and PCB footprint.
Availability
DS3153 is available at Aetrix Electronics and suitable for SONET/SDH multiplexers, digital cross-connect systems, and ATM edge routers requiring stable component supply, long-term lifecycle support, and traceable sourcing for telecom infrastructure programs.
Supply support for DS3153 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (acquired by Analog Devices in 2021) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, computing, and industrial applications.
The DS3153 belongs to Maxim's DS315x family of integrated line interface units, designed specifically for carrier-grade TDM line termination in SONET/SDH, PDH, and ATM infrastructure-emphasizing jitter control, multi-standard compliance, and minimal external component count.
FAQ
What telecommunication standards does the DS3153 comply with?
The DS3153 complies with ANSI T1.102, T1.107, T1.231, and T1.404; ITU-T G.703, G.751, G.775, G.823, and G.824; ETSI ETS 300 686/687/EN 300 689/TBR 24; and Telcordia GR-253-CORE and GR-499-CORE. These cover DS3/E3/STS-1 physical layer signaling, jitter control, LOS/AIS detection, and SONET transport requirements-ensuring interoperability in global carrier networks. DS3153 meets all specified limits in its published electrical characteristics tables.
How is jitter attenuation configured in the DS3153?
Jitter attenuation in the DS3153 is configured per channel using dedicated enable pins: RJAn (receiver path) or TJAn (transmit path). Only one path can be active at a time-TJA takes precedence over RJA if both are asserted. The jitter attenuator is a PLL-based circuit meeting ITU-T G.823/G.824 masks, and its transfer function is fixed per standard; no user tuning is required. Configuration is identical in hardware and CPU bus modes via pin or register control. DS3153 implements this jitter cleanup without external components.
Does the DS3153 support both B3ZS and HDB3 line coding?
Yes, the DS3153 supports both B3ZS (for DS3 in North America) and HDB3 (for E3 in Europe/Asia) line coding. The receiver includes an optional B3ZS/HDB3 decoder, and the transmitter includes an optional B3ZS/HDB3 encoder. Selection is controlled per channel via configuration bits (or hardware pins in hardware mode). DS3153 also supports unframed all-ones (E3 AIS) and complete DS3 AIS generation per ANSI T1.107-enabling seamless multi-regional deployment.
What is the role of the HIZ pin on the DS3153?
The HIZ (High-Z Enable) pin on the DS3153 places all I/O pins-including RCLK, RPOS/RDAT, RNEG/RLCV, TXP/TXN, and status outputs-into a high-impedance state when asserted (active high). This feature allows safe hot-swap insertion or system-level power sequencing without signal contention. HIZ operates independently of channel-specific tri-state controls (TTSn/RTSn) and is active in both hardware and CPU bus modes. DS3153 retains internal state during HIZ assertion and resumes normal operation immediately upon deassertion.
Can the DS3153 operate with a binary framer interface?
Yes, the DS3153 supports binary framer interface operation on both transmit and receive paths. The TBIN pin (transmitter) and RBIN pin (receiver) select binary mode (logic high) versus bipolar AMI mode (logic low). In binary mode, TDAT carries encoded data and RDAT outputs decoded data-eliminating need for external AMI encoders/decoders. DS3153 performs B3ZS/HDB3 encoding/decoding internally, and clock/data alignment is maintained via programmable RCINV/TCINV settings-making DS3153 compatible with common TDM framer ICs.
DS3153 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 144-BGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Line Interface Unit (LIU)
- Interface:
- LIU
- Number of Circuits:
- 3
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- 225mA
- Power (Watts):
- -
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 144-TECSBGA (13x13)
DS3153 FAQ
1.How can I place an order for DS3153 through Aetrix?
Please submit a Request for Quotation (RFQ) for DS3153 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS3153 reliable?
The price and inventory of DS3153 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3153 is usually 5 days.
3.What payment methods are accepted for DS3153?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3153 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS3153?
DS3153 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS3153 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS3153?
For technical support, including DS3153 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3153 requirements.
6.How does Aetrix verify that DS3153 is sourced from the original manufacturer or authorized distributors?
All DS3153 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3153 meets industry standards.
7.What is the process for return or replacement of DS3153?
All DS3153 units undergo pre-shipment inspection (PSI). If there is an issue with DS3153, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS3153 part is unused and in its original packaging.
Return procedure for DS3153:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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