Analog Devices Inc./Maxim Integrated DS3170

Overview

The DS3170 from Maxim Integrated is a single-chip DS3/E3 framer and line interface unit (LIU) transceiver, performing receive clock/data recovery, transmit waveshaping, and on-chip M23/C-bit DS3 and G.751/G.832 E3 framing. It operates at 3.3V with 0.5W power dissipation and supports 75Ω coaxial cable up to 380m (DS3) or 440m (E3), targeting SONET/SDH ADMs and multiservice access platforms.

For engineers reviewing the DS3170 datasheet, DS3170 pinout, DS3170 application, or DS3170 equivalent, key selection considerations include its integrated jitter attenuator placement flexibility, software compatibility with DS3171–DS3174, dual-standard framing support, CLAD clock rate adaptation from multiple reference frequencies, and IEEE 1149.1 JTAG test port for production validation.

Technical Context

The DS3170 integrates a full DS3/E3 framer/formatter with an LIU in one die, enabling direct physical-layer interfacing to copper lines without external timing or framing components. Its CLAD block generates precise 44.736MHz (DS3) and 34.368MHz (E3) clocks from a single reference (19.44MHz–77.76MHz), while the HDLC controller includes a 256-byte FIFO for PMDL/Sn/NR/GC byte handling.

Jitter attenuation is configurable in either receive or transmit path, and loopback modes include line, diagnostic, framer, payload, and analog-with AIS insertion capability away from loopback direction. The device supports both framed and unframed operation across LIU, POS/NEG, and UNI line interface modes per ITU-T and ANSI standards.

Key Specifications

Pinout & Package

Package: 100-pin CSBGA (11mm × 11mm, 1mm height), RoHS-compliant (DS3170+ and DS3170N+ variants).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DS3/E3 framer-LIU applications.

Compared with DS3172, the DS3170 offers lower power and smaller footprint but lacks extended-jitter-spec compliance; versus MC145572, it reduces system-level BOM cost and design complexity but requires new layout and firmware adaptation.

Availability

DS3170 is available at Aetrix Electronics and suitable for SONET/SDH ADMs, multiservice access platforms (MSAPs), and routers and switches requiring stable component supply, long-term lifecycle support, and traceable sourcing for telecom infrastructure programs.

Supply support for DS3170 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, computing, and industrial markets.

The DS3170 belongs to Maxim's SCT (SONET/SDH/DS3/E3 Transceiver) product line, designed specifically for compact, low-power, single-chip TDM line interface solutions in carrier and enterprise edge equipment.

FAQ

What is the primary function of the DS3170?

The DS3170 is a single-chip DS3/E3 framer and line interface unit (LIU) transceiver that performs clock/data recovery, transmit waveshaping, framing (M23/C-bit DS3 and G.751/G.832 E3), and HDLC overhead processing. It enables direct physical-layer connection to 75Ω coaxial lines and replaces multiple discrete components in telecom line cards. The DS3170 integrates all core DS3/E3 physical layer functions on one die.

Does the DS3170 support both DS3 and E3 standards simultaneously?

Yes, the DS3170 supports both DS3 and E3 standards in hardware, with on-chip framers for M23/C-bit DS3 and G.751/G.832 E3. It can be configured for either standard at runtime via register settings, and its CLAD clock adapter synthesizes both 44.736MHz (DS3) and 34.368MHz (E3) from a single reference clock. The DS3170 does not require hardware changes to switch between DS3 and E3 modes.

What package options are available for the DS3170?

The DS3170 is offered in a 100-pin CSBGA package measuring 11mm × 11mm × 1mm. Standard versions include DS3170 (0°C to +70°C) and DS3170N (-40°C to +85°C), with lead(Pb)-free/RoHS-compliant variants designated DS3170+ and DS3170N+. All variants share identical pinout and mechanical footprint, enabling drop-in replacement across temperature grades. The DS3170 uses no other package types.

How does the DS3170 handle clock generation and jitter?

The DS3170 incorporates a Clock Rate Adapter (CLAD) that generates precise 44.736MHz (DS3) and 34.368MHz (E3) clocks from a single reference input (19.44MHz–77.76MHz). It also features a configurable jitter attenuator that can be placed in either the receive or transmit path to meet GR-499-CORE and ITU-T G.823 masks. The DS3170's jitter performance is validated per industry standards without external components.

Is the DS3170 pin-compatible with other devices in the DS317x family?

Yes, the DS3170 is pin-compatible with DS3171, DS3172, DS3173, and DS3174 within the same CSBGA package. They share identical pin assignments, electrical characteristics, and register maps-enabling firmware reuse and hardware scalability. Differences lie in feature sets (e.g., DS3172 adds extended jitter compliance) and temperature grade, but the DS3170 serves as the baseline member of this software-compatible family.