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Analog Devices Inc./Maxim Integrated DS3170N

Part No.:
DS3170N
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Telecom
Package:
100-LBGA, CSBGA
Datasheet:
AetrixDS3170N.pdf
Description:
IC TELECOM INTERFACE 100CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,060

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Product details

Overview

DS3170N from Maxim Integrated is a single-chip DS3/E3 framer and line interface unit (LIU) transceiver for copper-based TDM transport. It performs receive clock/data recovery, transmit waveshaping, jitter attenuation (in either path), on-chip M23/C-bit DS3 and G.751/G.832 E3 framing, and supports 75Ω coaxial cable up to 440m for E3. It targets industrial-grade access concentrators and multiservice platforms requiring -40°C to +85°C operation.

For engineers reviewing the DS3170N datasheet, DS3170N pinout, DS3170N application, or DS3170N equivalent, key selection criteria include DS3/E3 dual-standard support, integrated CLAD clock rate adapter, JTAG test port, 8-/16-bit parallel and SPI microprocessor interface, and industrial temperature qualification.

Technical Context

The DS3170N integrates a full DS3/E3 LIU with B3ZS/HDB3 encoding/decoding, a configurable framer supporting M23, C-bit, G.751, and G.832 standards, and a flexible jitter attenuator that can be placed in either the receive or transmit path. Its CLAD block generates 44.736MHz (DS3) and 34.368MHz (E3) from a single reference clock (19.44–77.76MHz).

It includes an embedded HDLC controller with 256-byte FIFO for overhead byte insertion/extraction, on-chip BERT for PRBS pattern generation/detection, and comprehensive loopback modes (line, diagnostic, framer, payload, analog) with AIS insertion capability. The device uses 3.3V core supply with 5V-tolerant I/O and consumes 0.5W typical power.

Key Specifications

Parameter Value and Actual Design Meaning
Function Single-chip DS3/E3 framer + LIU transceiver for TDM line interface
Operating Temp -40°C to +85°C - qualified for industrial environments without derating
Supply Voltage 3.3V core, 5V-tolerant I/O - simplifies mixed-voltage system integration
Power Dissipation 0.5W typical - enables compact thermal design in dense line cards
Cable Support 75Ω coaxial: up to 440m for E3, 380m for DS3 - meets ITU-T G.703 distance specs
Interface Modes DS3/E3 framed/unframed, POS/NEG, UNI - supports legacy and modern TDM architectures
Reference Clocks 19.44MHz, 34.368MHz, 44.736MHz, 51.84MHz, or 77.76MHz - enables flexible clock sourcing

Pinout & Package

DS3170N is housed in a 100-pin Chip-Scale Ball Grid Array (CSBGA) package measuring 11mm × 11mm × 1mm, optimized for high-density line card layouts and thermal performance in telecom applications.

Pin/Terminal Circuit Role Design Meaning
CLKIN Reference Clock Input Accepts 19.44–77.76MHz LVCMOS clock for CLAD-derived system clocks
TXP/TXN Differential DS3/E3 Transmit Output Drives 75Ω coax via external 1:2 transformer; supports B3ZS/HDB3 line coding
RXP/RXN Differential DS3/E3 Receive Input Receives from 75Ω coax; performs clock/data recovery and jitter cleanup
INT Interrupt Output Active-low open-drain signal indicating alarm, error, or status event to host processor
RDY Ready Signal Indicates internal readiness for next parallel bus read/write cycle
TMS/TCK/TDI/TDO JTAG Test Interface IEEE 1149.1-compliant boundary-scan and debug access

Key Features

Feature Design Value
Integrated DS3/E3 Framer Supports M23, C-bit (DS3) and G.751, G.832 (E3) - eliminates need for discrete framers
On-Chip BERT PRBS-20/23 generation and detection with real-time error counting - enables field diagnostics without external test gear
Flexible Jitter Attenuation Configurable in receive or transmit path - improves timing margin in noisy or long-haul links
HDLC Overhead Controller 256-byte FIFO + dedicated logic for PMDL, Sn, NR/GC byte handling - offloads processor overhead in management channel
CLAD Clock Rate Adapter Derives 44.736MHz and 34.368MHz from one reference - reduces clock tree complexity and component count

Applications

Access Concentrators Multiservice Access Platforms (MSAPs)

Use Scenario: Aggregating multiple T1/E1 lines onto a DS3/E3 backbone in central office edge nodes.

IC Role / Device Role / Timing Role: DS3170N serves as the line-facing framer/LIU, performing physical layer termination, clock recovery, and framing alignment.

Use Value: Enables single-chip DS3/E3 interface with built-in BERT and performance monitoring - reduces BOM cost and board space vs. multi-chip solutions.

Use Scenario: Providing unified DS3/E3 connectivity across voice, data, and video services in carrier-class MSAP chassis.

IC Role / Device Role / Timing Role: DS3170N acts as the primary TDM line interface IC, handling both DS3 and E3 standards with software-selectable framing.

Use Value: Industrial temperature rating (-40°C to +85°C) ensures reliability in uncontrolled telco cabinets without forced cooling.

Routers and Switches SONET/SDH Add-Drop Multiplexers (ADMs)

Use Scenario: Adding DS3/E3 WAN interfaces to enterprise or service-provider routers via modular line cards.

IC Role / Device Role / Timing Role: DS3170N provides physical layer interfacing, including jitter attenuation and AIS generation for network fault signaling.

Use Value: Loopback modes (line, diagnostic, framer) simplify bring-up and field troubleshooting without external loop plugs or test sets.

Use Scenario: Interfacing SONET/SDH networks with legacy PDH infrastructure using DS3/E3 tributaries.

IC Role / Device Role / Timing Role: DS3170N functions as a PDH mapper/demapper, converting between SONET STS-1 and DS3/E3 payloads with precise timing alignment.

Use Value: On-chip performance-monitoring counters with ≥1-second accumulation intervals support GR-474 compliance reporting.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DS3/E3 transceiver applications.

Alternative Part Technical Difference Application Difference Selection Advice
DS3171N Same pinout and register map; adds extended jitter tolerance per GR-1244-CORE and enhanced FEC support Preferred for new deployments requiring stricter jitter compliance in metro/regional networks Select DS3171N when GR-1244-CORE jitter mask compliance is mandatory; otherwise DS3170N suffices for standard access applications
ICS8430M-01LFT Standalone DS3 framer only (no LIU); requires external line driver/receiver and clock recovery IC Suitable for designs where LIU functionality is implemented discretely or via FPGA Choose ICS8430M-01LFT only if existing architecture separates framer and LIU functions; DS3170N offers higher integration and lower system power

Compared with DS3171N and ICS8430M-01LFT, DS3170N delivers optimal balance of integration, industrial temperature range, and proven field reliability for access-layer equipment - avoiding over-specification while eliminating external framer/LIU components.

Availability

DS3170N is available at Aetrix Electronics and suitable for access concentrators, multiservice access platforms (MSAPs), and SONET/SDH ADMs requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.

Supply support for DS3170N includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and digital ICs for communications, computing, and industrial systems.

The DS3170N belongs to Maxim's SCT (Serial Communications Transceivers) product family, designed specifically for carrier-grade TDM line interface applications requiring high integration, low power, and robust timing performance.

FAQ

What is the operating temperature range of the DS3170N?

The DS3170N is rated for industrial operation from -40°C to +85°C. This specification is confirmed in the official Maxim ordering information table and applies to all DS3170N variants. The extended range enables deployment in uncontrolled environments such as outdoor cabinets or remote DSLAM sites without additional thermal management. DS3170N maintains full electrical performance across this range without derating.

Does the DS3170N support both DS3 and E3 standards simultaneously?

Yes, the DS3170N supports both DS3 and E3 standards in hardware, but not concurrently on the same port. It operates in either DS3 mode (44.736Mbps) or E3 mode (34.368Mbps), selected via configuration registers. Framing is software-configurable for M23/C-bit (DS3) or G.751/G.832 (E3). The CLAD clock adapter automatically adjusts internal timing based on the selected standard.

What clock frequencies does the DS3170N accept on its CLKIN pin?

The DS3170N accepts five standard reference clock frequencies on CLKIN: 19.44MHz, 34.368MHz, 44.736MHz, 51.84MHz, or 77.76MHz. These are explicitly listed in the Functional Diagram section and supported by the CLAD block to derive required system clocks. Using any other frequency may result in incorrect internal clock generation and loss of synchronization.

Is the DS3170N pin-compatible with other devices in the DS317x family?

Yes, the DS3170N is pin-compatible with DS3171N, DS3172N, DS3173N, and DS3174N within the same CSBGA package. All share identical pin assignments, power sequencing, and register maps. Software written for DS3170N runs unchanged on these variants, enabling seamless migration to higher-performance members of the SCT family.

What type of transformers are required for the DS3170N's line interface?

The DS3170N requires 1:2 impedance-ratio transformers on both transmit and receive paths, as specified in the Functional Diagram and Features sections. These match the device's differential 100Ω internal termination to standard 75Ω coaxial cable. Use of non-1:2 transformers will cause impedance mismatch, degrading return loss and increasing bit error rates beyond specification.

DS3170N Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
100-LBGA, CSBGA
Packaging:
Tray
Product Status:
Obsolete
Function:
Single-Chip Transceiver
Interface:
DS3, E3
Number of Circuits:
1
Voltage - Supply:
3.135V ~ 3.465V
Current - Supply:
120mA
Power (Watts):
-
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-CSBGA (11x11)

DS3170N FAQ

1.How can I place an order for DS3170N through Aetrix?

Please submit a Request for Quotation (RFQ) for DS3170N on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS3170N reliable?

The price and inventory of DS3170N are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3170N is usually 5 days.

3.What payment methods are accepted for DS3170N?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3170N transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS3170N?

DS3170N orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS3170N order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS3170N?

For technical support, including DS3170N datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3170N requirements.

6.How does Aetrix verify that DS3170N is sourced from the original manufacturer or authorized distributors?

All DS3170N products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3170N meets industry standards.

7.What is the process for return or replacement of DS3170N?

All DS3170N units undergo pre-shipment inspection (PSI). If there is an issue with DS3170N, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS3170N part is unused and in its original packaging.

Return procedure for DS3170N:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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