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Analog Devices Inc./Maxim Integrated DS3170N+
- Part No.:
- DS3170N+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Telecom
- Package:
- 100-LBGA, CSBGA
- Datasheet:
-
DS3170N+.pdf
- Description:
- IC TELECOM INTERFACE 100CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,243
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Product details
Overview
DS3170N+ from Maxim Integrated is a single-chip DS3/E3 framer and line interface unit (LIU) transceiver for copper-based TDM transport. It performs receive clock/data recovery, transmit waveshaping, on-chip M23/C-bit DS3 and G.751/G.832 E3 framing, integrated HDLC controller with 256-byte FIFO, and BERT with PRBS pattern generation/detection. It operates from -40°C to +85°C and supports 75Ω coaxial cable up to 440m for E3.
For engineers reviewing the DS3170N+ datasheet, DS3170N+ pinout, DS3170N+ application, or DS3170N+ equivalent, key selection criteria include DS3/E3 framing compatibility (M23, C-bit, G.751, G.832), jitter attenuator placement flexibility, CLAD clock rate adaptation from 19.44–77.76MHz references, 8-/16-bit parallel or SPI microprocessor interface, and industrial-temperature 100-pin CSBGA packaging.
Technical Context
The DS3170N+ integrates a full DS3/E3 framer/formatter with dual-standard support (M23/C-bit DS3; G.751/G.832 E3) and a fully compliant LIU with B3ZS/HDB3 encoding/decoding. Its jitter attenuator is configurable in either receive or transmit path, enabling precise timing control in legacy TDM networks.
It features an integrated Clock Rate Adapter (CLAD) that synthesizes 44.736MHz (DS3) or 34.368MHz (E3) from five selectable reference clocks (19.44/34.368/44.736/51.84/77.76MHz), eliminating external PLLs. The HDLC controller handles PMDL, Sn bit, and NR/GC byte insertion/extraction via dedicated 256-byte FIFO buffers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp | -40°C to +85°C - qualified for industrial-grade telecom infrastructure deployment. |
| Supply Voltage | 3.3V core with 5V-tolerant I/O - simplifies mixed-voltage system integration without level shifters. |
| Power Dissipation | 0.5W typical - enables high-density line card designs with minimal thermal management overhead. |
| Line Interface | 75Ω coaxial, up to 440m (E3) or 380m (DS3) - supports extended reach without repeaters in central office or MSAP environments. |
| Framing Standards | DS3: M23 & C-bit; E3: G.751 & G.832 - ensures interoperability across North American and European PDH networks. |
| Micro Interface | 8-/16-bit parallel or slave SPI ≤10Mbps - provides flexible host processor coupling for legacy and modern control planes. |
| BERT Capability | PRBS-20, PRBS-23, repetitive patterns - enables in-system link validation and field diagnostics without external test gear. |
Pinout & Package
DS3170N+ uses a 100-pin 11mm × 11mm × 1mm CSBGA package with 0.8mm ball pitch and Pb-free/RoHS-compliant finish. Pin assignments are defined per Maxim's DS3170 datasheet Rev 2 (19-5785), with dedicated groups for line IO (B3ZS/HDB3), system backplane (parallel/SPI), clock inputs (CLAD_REF, CLKIN), JTAG (TCK/TMS/TDI/TDO), and power/ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TXP/TXN | Differential DS3/E3 Transmit Output | Drives 75Ω coaxial line with B3ZS/HDB3-encoded signal; requires 1:2 transformer interface. |
| RXP/RXN | Differential DS3/E3 Receive Input | Accepts line signal with built-in clock recovery; supports LOS detection and AIS generation. |
| CLKIN | Primary Reference Clock Input | Accepts 19.44–77.76MHz CLAD reference; determines synthesized DS3/E3 line rates. |
| CSB | Chip Select (SPI/Parallel) | Active-low enable for serial or parallel bus access; supports multi-device sharing on same bus. |
| INT | Interrupt Output | Open-drain status alert for alarms (LOS, AIS, LOF, BER threshold), configurable per register. |
Key Features
| Feature | Design Value |
|---|---|
| Jitter Attenuator Placement | Configurable in receive or transmit path - enables optimal jitter cleanup location based on network topology and sync hierarchy. |
| Framing Overhead Port | Flexible 8-bit parallel port for real-time DS3/E3 overhead byte insertion/extraction - supports dynamic performance monitoring and maintenance messaging. |
| Loopback Modes | Line, diagnostic, framer, payload, and analog loopbacks with AIS injection capability - accelerates bring-up and fault isolation in lab and field. |
| Performance Monitoring | Large counters with ≥1-second accumulation intervals - delivers accurate, standards-compliant error statistics (ES, SES, UAS) for SLA reporting. |
| IEEE 1149.1 JTAG | Full boundary-scan support - enables board-level test, debug, and in-circuit programming without physical probe access. |
Applications
| Access Concentrators | Multiservice Access Platforms (MSAPs) |
|---|---|
|
Use Scenario: Aggregating multiple T1/E1 lines into DS3/E3 trunks for upstream transport to core networks. IC Role / Device Role / Timing Role: DS3170N+ acts as the line-facing framer/LIU, performing physical layer termination, clock recovery, and frame alignment. Use Value: Enables compact, low-power DS3/E3 line cards with integrated BERT and performance monitoring for remote site diagnostics. |
Use Scenario: Providing converged voice, data, and video services over legacy PDH infrastructure in metro edge networks. IC Role / Device Role / Timing Role: DS3170N+ serves as the DS3/E3 tributary interface, handling framing, overhead processing, and HDLC-controlled maintenance channels. Use Value: Reduces component count by integrating framer, LIU, HDLC, and BERT - lowering BOM cost and board area vs. discrete solutions. |
| SONET/SDH Add-Drop Multiplexers | Digital Cross-Connect Systems (DCS) |
|
Use Scenario: Interfacing DS3/E3 tributaries to SONET OC-12/SDH STM-4 payloads via mapping equipment. IC Role / Device Role / Timing Role: DS3170N+ provides DS3/E3 physical layer compliance and framing integrity at the tributary input stage. Use Value: Ensures bit-error-free mapping through built-in BERT validation and jitter-attenuated clock synthesis aligned to SONET/SDH timing requirements. |
Use Scenario: Enabling non-blocking circuit switching between DS3 and E3 signals in carrier-class provisioning systems. IC Role / Device Role / Timing Role: DS3170N+ functions as a standards-compliant DS3/E3 line interface with programmable framing and AIS/LOF signaling. Use Value: Supports automatic alarm propagation and loopback coordination across cross-connect fabric, improving service activation time and OAM efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DS3/E3 framer/LIU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS3171N+ | Same architecture but adds integrated FEAC controller and enhanced trail trace functionality; otherwise pin- and software-compatible. | Required when Frame-Equivalent Alarm Communication (FEAC) or detailed trail trace ID logging is needed per G.775/G.783. | Select DS3171N+ only if FEAC or advanced trail trace is mandated; DS3170N+ suffices for standard DS3/E3 line termination. |
| DS3174N+ | Includes dual-port HDLC controller and expanded overhead buffer; shares same pinout and CLAD/JTAG features. | Suitable for applications requiring simultaneous DS3 and E3 overhead channel handling or dual-maintenance-channel support. | Choose DS3174N+ when concurrent DS3+E3 overhead processing is required; DS3170N+ supports single-stream HDLC overhead. |
Compared with DS3171N+ and DS3174N+, the DS3170N+ offers the most cost-optimized, single-stream DS3/E3 framer/LIU solution - ideal for line cards where FEAC or dual-overhead processing is unnecessary, preserving PCB layout and firmware simplicity.
Availability
DS3170N+ is available at Aetrix Electronics and suitable for access concentrators, multiservice access platforms (MSAPs), and digital cross-connect systems requiring stable component supply, industrial-temperature operation, and long-term lifecycle assurance.
Supply support for DS3170N+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF ICs for communications, computing, and industrial applications.
The DS3170N+ belongs to Maxim's SCT (SONET/SDH/DS3/E3 Communications Transceivers) product line, designed specifically for carrier-grade TDM line interface and framing in legacy and hybrid transport networks.
FAQ
What is the primary function of the DS3170N+ in a telecommunications system?
The DS3170N+ serves as a single-chip DS3/E3 framer and line interface unit (LIU) transceiver. It terminates DS3 (44.736Mbps) and E3 (34.368Mbps) physical copper links, performs clock/data recovery, B3ZS/HDB3 encoding/decoding, and implements M23/C-bit DS3 and G.751/G.832 E3 framing. In systems like MSAPs or DCS, the DS3170N+ enables standards-compliant TDM transport with integrated diagnostics and overhead processing.
Does the DS3170N+ support both DS3 and E3 standards simultaneously?
Yes, the DS3170N+ supports both DS3 and E3 standards, but not concurrently on the same port. It is configurable per power-on reset or software command to operate in either DS3 mode (M23 or C-bit framing) or E3 mode (G.751 or G.832 framing). The DS3170N+ does not provide dual-standard simultaneous operation on one interface - mode selection is static per initialization.
What reference clock frequencies are compatible with the DS3170N+ CLAD feature?
The DS3170N+ Clock Rate Adapter (CLAD) accepts five standard reference clock inputs: 19.44MHz, 34.368MHz, 44.736MHz, 51.84MHz, or 77.76MHz. From any of these, it synthesizes the exact 44.736MHz (DS3) or 34.368MHz (E3) line rates required for framing and transmission. This eliminates need for multiple crystal oscillators in multi-standard line cards.
How does the DS3170N+ handle jitter in DS3/E3 links?
The DS3170N+ includes a configurable jitter attenuator that can be placed in either the receive or transmit signal path. When in receive mode, it cleans incoming jitter before clock recovery; in transmit mode, it filters jitter from the recovered clock before driving the line. This flexibility allows system designers to optimize jitter transfer function based on network synchronization architecture and ITU-T G.823/G.824 compliance requirements.
Is the DS3170N+ pin-compatible with other devices in the DS317x family?
Yes, the DS3170N+, DS3171N+, DS3172N+, DS3173N+, and DS3174N+ share identical 100-pin CSBGA packaging, pinout, power sequencing, and microprocessor interface timing. They are software-compatible and drop-in replacements for each other at the hardware level - differing only in internal feature sets (e.g., FEAC, trail trace, dual HDLC) enabled via configuration registers.
DS3170N+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 100-LBGA, CSBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Single-Chip Transceiver
- Interface:
- DS3, E3
- Number of Circuits:
- 1
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- 120mA
- Power (Watts):
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-CSBGA (11x11)
DS3170N+ FAQ
1.How can I place an order for DS3170N+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS3170N+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS3170N+ reliable?
The price and inventory of DS3170N+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3170N+ is usually 5 days.
3.What payment methods are accepted for DS3170N+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3170N+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS3170N+?
DS3170N+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS3170N+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS3170N+?
For technical support, including DS3170N+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3170N+ requirements.
6.How does Aetrix verify that DS3170N+ is sourced from the original manufacturer or authorized distributors?
All DS3170N+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3170N+ meets industry standards.
7.What is the process for return or replacement of DS3170N+?
All DS3170N+ units undergo pre-shipment inspection (PSI). If there is an issue with DS3170N+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS3170N+ part is unused and in its original packaging.
Return procedure for DS3170N+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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