Analog Devices Inc./Maxim Integrated DS3170N+T&R

Overview

DS3170N+T&R from Maxim Integrated (now part of Analog Devices) is a single-chip DS3/E3 framer and line interface unit (LIU) transceiver for copper-based TDM transport. It performs receive clock/data recovery, transmit waveshaping, jitter attenuation (configurable in Rx or Tx path), on-chip M23/C-bit DS3 and G.751/G.832 E3 framing, and supports 75Ω coaxial cable up to 380m (DS3) or 440m (E3). It serves in multiservice access platforms and SONET/SDH add-drop multiplexers.

For engineers reviewing the DS3170N+T&R datasheet, DS3170N+T&R pinout, DS3170N+T&R application, or DS3170N+T&R equivalent, key selection considerations include industrial temperature support (-40°C to +85°C), 100-pin CSBGA package, dual-standard DS3/E3 compliance, integrated HDLC controller with 256-byte FIFO, and software compatibility with DS3171–DS3174 SCT family.

Technical Context

The DS3170N+T&R integrates a full DS3/E3 framer/formatter with a physical-layer LIU in one die. Its architecture includes independent B3ZS/HDB3 line encoding/decoding, programmable jitter attenuator placement, and CLAD clock rate adapter generating 44.736MHz (DS3) or 34.368MHz (E3) from reference clocks including 19.44MHz, 51.84MHz, or 77.76MHz.

It supports multiple operational modes: framed/unframed LIU, POS/NEG, and UNI; features IEEE 1149.1 JTAG test port; and provides flexible overhead insertion/extraction via dedicated parallel port. The HDLC controller handles DS3 PMDL, G.751 Sn bit, and G.832 NR/GC byte processing with hardware-assisted FIFO management.

Key Specifications

Pinout & Package

DS3170N+T&R is housed in a 100-pin Chip-Scale Ball Grid Array (CSBGA) package measuring 11mm × 11mm × 1mm, optimized for high-speed signal integrity and thermal performance in telecom line cards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DS3/E3 framer-LIU applications.

Compared with DS3171N+T&R, DS3170N+T&R omits FEAC and extended trace but retains full DS3/E3 framing, BERT, and jitter control - making it ideal for cost-sensitive, high-volume line cards. Against MC28L34A, DS3170N+T&R delivers superior signal integrity, lower power, and simplified layout at the expense of legacy part continuity.

Availability

DS3170N+T&R is available at Aetrix Electronics and suitable for multiservice access platforms, SONET/SDH add-drop multiplexers, and telecom test equipment requiring stable component supply, industrial temperature operation, and long-term lifecycle assurance.

Supply support for DS3170N+T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated, now part of Analog Devices, is a leader in high-performance analog, mixed-signal, and RF ICs for communications, computing, and industrial systems.

The DS3170N+T&R belongs to Maxim's SCT (Single-Chip Transceiver) product line, designed specifically for carrier-class TDM line interface applications requiring integrated framing, physical layer transceivers, and comprehensive diagnostics in minimal footprint.

FAQ

What is the operating temperature range of the DS3170N+T&R?

The DS3170N+T&R is rated for industrial temperature operation from -40°C to +85°C. This specification is confirmed in the official ordering information table and validated across all electrical and timing parameters in the datasheet. The "N" suffix explicitly denotes this extended temperature grade, distinguishing it from commercial-grade variants like DS3170 and DS3170+. DS3170N+T&R maintains full functionality across this range without derating.

Does the DS3170N+T&R support both DS3 and E3 standards simultaneously?

Yes, the DS3170N+T&R natively supports both DS3 (44.736Mbps) and E3 (34.368Mbps) standards within a single device. It implements on-chip M23 and C-bit DS3 framing as well as G.751 and G.832 E3 framing. Mode selection is software-configurable via register writes, and the LIU adapts its encoding (B3ZS for DS3, HDB3 for E3) and timing accordingly. No hardware change is needed to switch between standards.

What clock frequencies can be used as input to the DS3170N+T&R's CLAD block?

The DS3170N+T&R's Clock Rate Adapter (CLAD) accepts five standard reference clock frequencies: 19.44MHz, 34.368MHz, 44.736MHz, 51.84MHz, and 77.76MHz. From any of these inputs, CLAD synthesizes the exact 44.736MHz (DS3) or 34.368MHz (E3) system clocks required for framing and line interface operation. This eliminates need for external clock generators in most telecom timing architectures.

Is the DS3170N+T&R pin-compatible with other devices in the DS317x family?

Yes, the DS3170N+T&R is pin-compatible with DS3171N+T&R, DS3172N+T&R, DS3173N+T&R, and DS3174N+T&R. All share identical 100-pin CSBGA packaging, pin assignments, power sequencing, and microprocessor interface timing. Software compatibility is also maintained across the family, enabling scalable feature selection (e.g., adding FEAC or enhanced trace) without PCB redesign.

What diagnostic capabilities does the DS3170N+T&R provide for field maintenance?

The DS3170N+T&R includes comprehensive on-chip diagnostics: a full-featured BERT supporting PRBS patterns from 2^7 to 2^23, real-time performance monitoring with ≥1-second accumulation intervals, five configurable loopback modes (line, diagnostic, framer, payload, analog), and IEEE 1149.1 JTAG boundary-scan. These features enable rapid fault isolation - from physical layer impairments to framing errors - without external test equipment during installation or troubleshooting.