Analog Devices Inc./Maxim Integrated DS3172

Overview

DS3172 from Maxim Integrated is a dual-port DS3/E3 single-chip transceiver integrating two independent LIUs and framers, supporting M23/C-bit DS3 and G.751/G.832 E3 formats, with on-chip HDLC controllers, BERTs, jitter attenuator, and clock rate adapter - deployed in multiservice access platforms requiring dual-line TDM interface consolidation.

For engineers reviewing the DS3172 datasheet, DS3172 pinout, DS3172 application, or DS3172 equivalent, this device serves as a high-density, thermally enhanced TE-PBGA solution for telecom line card designs needing simultaneous DS3 and E3 support, low-power 3.3V operation, and JTAG-compliant testability.

Technical Context

The DS3172 implements two fully independent DS3/E3 channels, each with dedicated receive clock/data recovery, transmit waveshaping, and configurable framing (M23, C-bit, G.751, G.832). Each port supports B3ZS/HDB3 encoding/decoding and features a programmable jitter attenuator that can be placed in either transmit or receive path.

It integrates an 8-/16-bit microprocessor interface, IEEE 1149.1 JTAG test port, and clock rate adapter generating 44.736MHz (DS3) or 34.368MHz (E3) from a single reference (DS3, E3, or STS-1 frequency), enabling simplified system clocking architecture.

Key Specifications

Pinout & Package

DS3172 uses a 400-ball TE-PBGA package (27mm × 27mm, 1.27mm pitch) with thermal enhancement for telecom line card deployment. Pin assignments follow Maxim's standardized DS317x family layout, supporting pin compatibility across DS3171–DS3174 variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DS3/E3 transceiver applications.

Compared with DS3172N and DS3182, the DS3172 offers the lowest unit cost and proven reliability in commercial-temperature telecom line cards, while retaining full functional equivalence to DS3172N and backward compatibility with DS317x-based firmware and PCB layouts.

Availability

DS3172 is available at Aetrix Electronics and suitable for multiservice access platforms, digital cross-connect systems, and integrated access devices requiring stable component supply, long-lifecycle support, and traceable sourcing for telecom infrastructure programs.

Supply support for DS3172 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-reliability ICs for communications, industrial, and computing markets.

The DS3172 belongs to Maxim's DS317x family of single-chip DS3/E3 transceivers, designed specifically for compact, low-power, multiport TDM line interface cards in access and metro network equipment.

FAQ

What is the primary function of the DS3172 in telecom systems?

The DS3172 functions as a dual-port DS3/E3 single-chip transceiver, integrating line interface units (LIUs), framers/formatters, HDLC controllers, and BERTs. It performs clock/data recovery, B3ZS/HDB3 encoding/decoding, and M23/C-bit DS3 or G.751/G.832 E3 framing. In telecom systems, the DS3172 enables compact, low-power physical layer interfacing for access concentrators and MSAPs without external framer or LIU components.

Does the DS3172 support both DS3 and E3 standards simultaneously?

Yes, the DS3172 supports both DS3 and E3 standards - but not simultaneously on the same port. Each of its two ports can be independently configured for DS3 (M23 or C-bit) or E3 (G.751 or G.832) operation. This allows mixed-mode deployment, such as one port running DS3 for North American trunking and the other running E3 for European interconnection, all within a single DS3172 device.

What package type and thermal characteristics does the DS3172 use?

The DS3172 uses a 400-ball thermally enhanced plastic BGA (TE-PBGA) package measuring 27mm × 27mm with 1.27mm ball pitch. Its thermal design supports ~1.73W power dissipation at 3.3V, with junction-to-board thermal resistance optimized for conduction-cooled telecom line cards. The package is rated for 0°C to +70°C operation and includes exposed thermal pad for PCB heat sinking.

How does the DS3172 handle clock generation and jitter requirements?

The DS3172 incorporates an integrated clock rate adapter that generates precise 44.736MHz (DS3) or 34.368MHz (E3) clocks from a single reference (13.584MHz, 15.36MHz, or 51.84MHz). It also includes a programmable jitter attenuator configurable in either transmit or receive path, meeting ITU-T G.823 jitter transfer and generation limits for DS3/E3 applications.

Is the DS3172 pin-compatible with other devices in its family or successor series?

Yes, the DS3172 is pin-compatible with DS3171 (single), DS3173 (triple), and DS3174 (quad) - enabling scalable port density on the same PCB layout. It is also pin-compatible with the DS316x and DS318x families, though register maps and some features differ. Firmware and hardware revisions must be validated per device, but mechanical and electrical interface compatibility is maintained across these families.