Analog Devices Inc./Maxim Integrated DS3172N+

Overview

DS3172N+ from Maxim Integrated is a dual-port DS3/E3 single-chip transceiver integrating two independent LIUs and framers, supporting M23/C-bit DS3 and G.751/G.832 E3 formats with on-chip BERTs, HDLC controllers, and jitter attenuation. It operates from -40°C to +85°C, consumes ~1.73W at 3.3V, and interfaces to 75Ω coaxial cable up to 380m (DS3) or 440m (E3). Used in multiservice access platforms and SONET/SDH add-drop multiplexers.

For engineers reviewing the DS3172N+ datasheet, DS3172N+ pinout, DS3172N+ application, or DS3172N+ equivalent, this page delivers verified technical context, pin-level design meaning, real-world application mappings, and validated alternative options for telecom line card and protocol platform design.

Technical Context

The DS3172N+ implements two fully independent DS3/E3 channels, each with dedicated receive clock/data recovery, transmit waveshaping, and configurable framing (M23, C-bit, G.751, G.832). Each port supports B3ZS/HDB3 encoding/decoding and includes an integrated jitter attenuator placeable in either transmit or receive path.

It integrates HDLC controllers with 256-byte FIFOs for overhead byte insertion/extraction, on-chip PRBS BERTs for loopback testing, and a flexible clock rate adapter generating 44.736MHz (DS3) or 34.368MHz (E3) from a single STS-1/DS3/E3 reference clock. The 8-/16-bit microprocessor interface supports byte-swap and ready-signal handshaking.

Key Specifications

Pinout & Package

DS3172N+ uses a 400-pin TE-PBGA package (27mm × 27mm, 1.27mm pitch) with thermally enhanced plastic construction and lead-free (+) finish. Pin assignments follow Maxim's standardized DS317x family layout, supporting drop-in compatibility across DS3171–DS3174 variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DS3/E3 transceiver applications.

Compared with DS3172+, the DS3172N+ adds industrial temperature operation and identical feature set, while DS3182N+ improves power and jitter but mandates layout changes - making DS3172N+ optimal for cost-sensitive, field-deployed DS3/E3 line cards requiring proven reliability.

Availability

DS3172N+ is available at Aetrix Electronics and suitable for multiservice access platforms, SONET/SDH add-drop multiplexers, and digital cross-connect systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for DS3172N+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-speed communication ICs for industrial, telecom, and computing markets.

The DS317x family was designed specifically for carrier-class PDH line interface applications, delivering integrated DS3/E3 framing, line driving, and diagnostics in a single TE-PBGA package to reduce system complexity and time-to-market.

FAQ

What is the primary function of the DS3172N+ in a telecommunications system?

The DS3172N+ serves as a dual-port DS3/E3 single-chip transceiver, combining line interface units (LIUs), framers, and format converters to handle physical-layer transmission and reception of DS3 (44.736Mbps) and E3 (34.368Mbps) signals. It performs clock/data recovery, B3ZS/HDB3 encoding/decoding, jitter attenuation, and HDLC overhead processing - all within one device. This makes DS3172N+ ideal for compact, high-density line cards in access concentrators and MSAPs.

Does the DS3172N+ support both DS3 and E3 standards simultaneously?

Yes, the DS3172N+ supports both DS3 and E3 standards - but not simultaneously on the same port. Each of its two ports can be independently configured for DS3 (M23 or C-bit) or E3 (G.751 or G.832) framing and line coding. This allows mixed-service configurations, such as one port handling a DS3 trunk to a central office while the other terminates an E3 link to a European exchange - all under unified register control in DS3172N+.

What packaging and environmental specifications apply to the DS3172N+?

The DS3172N+ uses a 400-pin TE-PBGA package (27mm × 27mm, 1.27mm pitch) with lead-free finish indicated by the "+" suffix. It is rated for industrial temperature operation from -40°C to +85°C, making it suitable for uncontrolled environments like roadside cabinets and remote DSLAM sites. Thermal resistance (θ_JA) is specified per Maxim's Package Thermal Information section, supporting conduction-cooled board layouts.

How does the DS3172N+ handle clock generation and synchronization?

The DS3172N+ integrates a clock rate adapter that generates precise 44.736MHz (DS3) and 34.368MHz (E3) clocks from a single input reference - selectable among STS-1 (51.84MHz), DS3, or E3 frequencies. It also derives an 8kHz frame reference and one-second timing pulses internally. These capabilities eliminate external clock synthesizers and simplify synchronization in hierarchical TDM networks where DS3172N+ must align with primary reference clocks (PRCs) or building-integrated timing supply (BITS).

Can the DS3172N+ perform built-in diagnostics without external test equipment?

Yes, the DS3172N+ includes comprehensive on-chip diagnostics: per-port PRBS-based BERTs for error detection/generation, multiple loopback modes (line, diagnostic, framer, payload, analog), large performance-monitoring counters (e.g., ES, SES, UAS), and IEEE 1149.1 JTAG for boundary-scan testing. These features allow full link validation, fault isolation, and real-time health monitoring directly through the microprocessor interface - no external BERT or oscilloscope required during DS3172N+ system bring-up or field maintenance.