Analog Devices Inc./Maxim Integrated DS3173

Overview

DS3173 from Maxim Integrated is a triple-port DS3/E3 single-chip transceiver integrating three independent LIUs and framers for simultaneous DS3 (44.736 Mbps) and E3 (34.368 Mbps) line interface operation, supporting M23/C-bit DS3 and G.751/G.832 E3 framing standards, with on-chip BERT, jitter attenuator, and HDLC controllers - deployed in multiservice access platforms and SONET/SDH add-drop multiplexers.

For engineers reviewing the DS3173 datasheet, DS3173 pinout, DS3173 application, or DS3173 equivalent, this page delivers verified technical context, exact pin-level design meaning, real-world deployment constraints, and validated alternative options for DS3/E3 physical layer migration and density scaling.

Technical Context

The DS3173 implements three fully independent DS3/E3 channels, each with dedicated receive clock/data recovery, transmit waveshaping, and configurable jitter attenuation placement (Rx or Tx path). Each channel supports B3ZS/HDB3 encoding/decoding and direct 75Ω coaxial drive up to 380 m (DS3) or 440 m (E3).

It integrates a clock rate adapter generating 44.736 MHz (DS3) and 34.368 MHz (E3) from a single reference (DS3/E3/STS-1), plus 8-/16-bit microprocessor interface with RDY handshake, JTAG test port, and per-port HDLC controllers with 256-byte FIFOs for overhead byte insertion/extraction.

Key Specifications

Pinout & Package

DS3173 uses a 400-ball thermally enhanced plastic ball grid array (TE-PBGA) with 1.27 mm pitch, 27 mm × 27 mm footprint, and integrated thermal pad for conduction cooling in telecom line cards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DS3/E3 transceiver applications.

Compared with DS3174 and DS3183, the DS3173 offers optimal balance of port count, pin compatibility with existing DS317x designs, and proven field reliability in commercial-temperature access equipment - making it ideal for cost-sensitive, volume-deployed DS3/E3 line cards.

Availability

DS3173 is available at Aetrix Electronics and suitable for multiservice access platforms, SONET/SDH add-drop multiplexers, and digital cross-connect systems requiring stable component supply across long product lifecycles.

Supply support for DS3173 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and RF ICs for communications, computing, and industrial markets.

The DS3173 belongs to the DS317x family of DS3/E3 single-chip transceivers designed specifically for carrier-grade copper line interface applications in access networks and transport equipment.

FAQ

What is the primary function of the DS3173 in a telecommunications system?

The DS3173 serves as a triple-port DS3/E3 physical layer transceiver, integrating line interface units (LIUs), framers, clock recovery, jitter attenuation, and HDLC overhead processing. It enables three independent DS3 or E3 connections on a single chip - used in access concentrators, MSAPs, and SONET/SDH muxes to terminate copper-based T3/E3 circuits while maintaining full protocol compliance and performance monitoring. The DS3173 handles both M23/C-bit DS3 and G.751/G.832 E3 framing standards natively.

Does the DS3173 support both DS3 and E3 standards simultaneously across its three ports?

Yes, the DS3173 supports per-port independent configuration: each of its three ports can be individually set to DS3 (44.736 Mbps) or E3 (34.368 Mbps) mode, with framing selected as M23 DS3, C-bit DS3, G.751 E3, or G.832 E3. This allows mixed-mode operation - for example, two ports configured as DS3 and one as E3 - without hardware changes or performance trade-offs. The DS3173's clock rate adapter derives all required frequencies from a single reference source.

What package type and thermal characteristics does the DS3173 use?

The DS3173 uses a 400-ball thermally enhanced plastic BGA (TE-PBGA) package measuring 27 mm × 27 mm with 1.27 mm pitch and an exposed thermal pad. Its typical power dissipation is ~1.73 W at 3.3 V, and it operates from 0°C to +70°C. The TE-PBGA construction provides superior thermal conduction compared to standard PBGA, enabling reliable operation in dense telecom line cards without active cooling - a key requirement for the DS3173's target applications.

How does the DS3173 handle clock generation and synchronization?

The DS3173 incorporates an integrated clock rate adapter (CLAD) that generates precise 44.736 MHz (DS3) and 34.368 MHz (E3) clocks from a single external reference - selectable among DS3, E3, or STS-1 rates. This eliminates the need for multiple crystal oscillators and simplifies clock tree design. The DS3173 also provides recovered line clocks (RLCLKn/TLCLKn) and supports gapped clock modes for SONET/SDH alignment, ensuring deterministic timing for backplane interfacing and system-level synchronization.

Is the DS3173 pin-compatible with other devices in the DS317x family?

Yes, the DS3173 is fully pin-compatible with the DS3171 (single-port), DS3172 (dual-port), and DS3174 (quad-port) - all share identical 400-ball TE-PBGA footprints, pin assignments, and power sequencing. This enables seamless port density migration on the same PCB layout: upgrading from DS3172 to DS3173 requires only firmware reconfiguration and no hardware revision. The DS3173 also maintains pin compatibility with the DS316x and DS318x families for backward- and forward-compatible platform design.