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Analog Devices Inc./Maxim Integrated DS3252+

Part No.:
DS3252+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Telecom
Package:
144-BGA, CSPBGA
Datasheet:
AetrixDS3252+.pdf
Description:
IC TELECOM INTERFACE 144CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:480

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Product details

Overview

DS3252+ from Maxim Integrated (now Analog Devices) is a dual-channel Line Interface Unit (LIU) for DS3/E3/STS-1 physical-layer interfacing, featuring independent receive/transmit paths per channel, on-chip jitter attenuators with 16–128-bit provisionable FIFO depth, and a clock adapter synthesizing line-rate clocks (DS3: 44.736MHz, E3: 34.368MHz, STS-1: 51.84MHz) from a single input (e.g., 19.44MHz). It supports B3ZS/HDB3 encoding/decoding and operates across -40°C to +85°C in telecom infrastructure.

For engineers reviewing the DS3252+ datasheet, DS3252+ pinout, DS3252+ application, or DS3252+ equivalent, key selection considerations include its dual-port DS3/E3/STS-1 compliance, hardware/parallel/SPI control interface flexibility, jitter attenuation placement options (RX/TX path or disabled), and drop-in compatibility with legacy DS3152 LIUs in carrier-grade multiplexers and cross-connect systems.

Technical Context

The DS3252+ implements two fully independent LIU channels, each integrating AGC + adaptive equalizer for up to 15dB cable loss compensation, CDR with digital/analog LOS detection per ANSI T1.231 and ITU G.775, and programmable B3ZS/HDB3 encode/decode logic. Its jitter attenuator uses crystal-less architecture meeting Telcordia GR-253 and ITU G.823/G.824 requirements.

Each channel supports tri-state RCLK/TCLK outputs and TXP/TXN/RXP/RXN differential I/O compliant with 75Ω coaxial interface standards (ANSI T1.404, ITU G.703), with configurable framer interface polarity and gapped-clock operation up to 51.84MHz. The on-chip clock adapter eliminates external oscillators by deriving all line-rate clocks from one master source.

Key Specifications

Parameter Value and Actual Design Meaning
Number of LIU Channels Dual - enables two independent DS3/E3/STS-1 line interfaces on a single die, reducing board space vs. discrete solutions.
Data Rates Supported DS3 (44.736Mbps), E3 (34.368Mbps), STS-1 (51.84Mbps) - full compliance with ANSI, ITU, ETSI, and Telcordia physical layer standards.
Jitter Attenuator FIFO Depth 16 / 32 / 64 / 128 bits - selectable per channel to balance latency vs. jitter suppression performance in timing-critical backplane links.
Cable Reach (75Ω Coax) Up to 380m (DS3), 440m (E3), 360m (STS-1) - achieved via integrated preamp, AGC, and adaptive equalizer without external components.
Control Interfaces 8-bit parallel (Intel/Motorola modes), SPI (≤10Mbps), hardware mode - allows configuration without host CPU for boot-time initialization or fail-safe operation.
Power Supply 3.3V core with 5V-tolerant I/O - simplifies mixed-voltage system integration and supports legacy 5V control logic.
Operating Temperature -40°C to +85°C - qualified for industrial and carrier-grade environments including central office and DSLAM deployments.

Pinout & Package

DS3252+ is housed in a 144-pin, 13mm × 13mm thermally enhanced CSP-BGA (TE-CSBGA) package with exposed thermal pad, optimized for high-density telecom PCB layouts and thermal dissipation in fanless chassis.

Pin/Terminal Circuit Role Design Meaning
RXP1/RXN1, RXP2/RXN2 Differential Receive Input Accepts B3ZS/HDB3-coded DS3/E3/STS-1 signals from 75Ω coax; internal preamp and AGC enable direct connection without external amplification.
TXP1/TXN1, TXP2/TXN2 Differential Transmit Output Drives standard-compliant pulse-shaped waveforms onto 75Ω coax; LBO control and waveshaping ensure signal integrity over long traces.
RCLK1/RCLK2, TCLK1/TCLK2 Recovered/Transmit Clock Tri-stateable CMOS outputs; clock inversion support enables glueless interfacing with framers requiring inverted clock edges.
RLOS1/RLOS2 Receive Loss-of-Signal Indicator Active-low open-drain output per channel; complies with ANSI T1.231 and ITU G.775 for alarm reporting in network management systems.
TTS1/TTS2 Transmit Tri-State Control Per-channel driver disable for protection switching; logical OR of pin assertion and register bit enables robust failover control.
HW, CS, RD, WR, A[5:0], D[7:0] Interface Configuration & Bus Supports hardware mode (HW=1) or parallel CPU mode (HW=0); multiplexed/nonmultiplexed addressing simplifies FPGA/CPU integration.

Key Features

Feature Design Value
Pin-compatible family (DS3251/52/53/54) Enables scalable design reuse across 1–4 port systems without layout changes or firmware rework.
Per-channel power-down control Reduces active power by >70% per idle LIU channel, critical for dynamic bandwidth allocation in modular line cards.
On-chip PRBS generator/detector (2¹⁵−1, 2²³−1) Enables in-system BER testing without external test equipment-supports loopback diagnostics at full line rate.
JTAG boundary scan (IEEE 1149.1) Facilitates production test and field debug of high-density BGA interconnects without physical probe access.
Local/remote loopback modes Validates end-to-end signal path integrity during commissioning and maintenance-supports both analog and digital loopback types.

Applications

Digital Cross-Connect System (DCS) SONET/SDH Add-Drop Multiplexer (ADM)

Use Scenario: Aggregating and switching multiple DS3/E3 tributaries between OC-3/OC-12 optical ports in central office switches.

IC Role / Device Role / Timing Role: Physical-layer line interface for electrical termination and jitter cleanup of incoming/outgoing DS3/E3 signals prior to mapping into SONET frames.

Use Value: Dual-channel integration reduces component count per line card; built-in jitter attenuators meet GR-253 output jitter limits without external PLLs.

Use Scenario: Providing electrical DS3/E3 interfaces on ADM line cards that groom traffic between optical rings and legacy copper distribution networks.

IC Role / Device Role / Timing Role: DS3/E3/STS-1 transceiver with embedded clock adaptation, enabling synchronization to OC-3/OC-12 reference clocks while maintaining DS3 frame alignment.

Use Value: Single 19.44MHz input clock eliminates need for separate DS3/E3 oscillators-reducing BOM cost and improving frequency stability across temperature.

DSL Access Multiplexer (DSLAM) Carrier-Grade Router WAN Interface Card

Use Scenario: Backhauling aggregated xDSL subscriber traffic over DS3/E3 leased lines to aggregation routers in metro POPs.

IC Role / Device Role / Timing Role: Line interface handling B3ZS-encoded DS3 signals from telco handoff points, with LOS monitoring and AIS generation per ANSI T1.107.

Use Value: Digital/analog LOS detectors provide redundant alarm signaling; HDB3 decoding ensures interoperability with European E3 infrastructure.

Use Scenario: Adding DS3/E3 WAN ports to enterprise-class routers deployed in service provider edge locations.

IC Role / Device Role / Timing Role: Dual-port LIU providing physical layer connectivity and jitter attenuation for synchronous data transport over legacy TDM circuits.

Use Value: Hardware mode operation allows autonomous startup without host processor involvement-critical for router boot reliability and failover recovery.

Equivalent & Alternatives

The following parts are listed as comparable options for similar line interface unit applications.

Alternative Part Technical Difference Application Difference Selection Advice
DS3152+ Legacy dual LIU; lacks on-chip clock adapter and jitter attenuator; requires external 44.736MHz oscillator and external jitter cleaner. Used in older DCS designs where clock tree is already established; not suitable for new designs targeting reduced component count. Select DS3252+ when consolidating clock generation and jitter cleanup functions onto one IC to simplify timing architecture.
MAX3675 Single-channel DS3/E3 LIU; no STS-1 support; no JTAG; smaller 100-pin TQFP package; lower max cable reach (300m DS3). Targeted at cost-sensitive, space-constrained edge devices with single-port requirements-not appropriate for dual-port or STS-1 applications. Choose DS3252+ for dual-port, STS-1-capable, and JTAG-enabled carrier infrastructure where feature completeness and standards compliance are mandatory.

Compared with DS3152+, DS3252+ integrates clock synthesis and jitter attenuation, eliminating two external ICs and associated layout complexity; versus MAX3675, DS3252+ delivers dual-channel density, STS-1 support, and full Telcordia-compliant jitter performance required in central office deployments.

Availability

DS3252+ is available at Aetrix Electronics and suitable for digital cross-connect systems, SONET/SDH multiplexers, and DSLAM backhaul applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for carrier-grade production.

Supply support for DS3252+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (acquired by Analog Devices in 2021) is a fabless semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, computing, and industrial markets.

The DS3252+ belongs to Maxim's DS325x LIU product line, designed specifically for carrier-class TDM infrastructure requiring multi-standard (DS3/E3/STS-1) physical layer interfacing with integrated jitter management and flexible control architecture.

FAQ

What telecommunication standards does the DS3252+ comply with?

The DS3252+ complies with ANSI T1.102, T1.107, T1.231, and T1.404; ITU-T G.703, G.751, G.775, G.823, and G.824; ETSI ETS 300 686/687/EN 300 689; and Telcordia GR-253-CORE and GR-499-CORE. These cover DS3/E3/STS-1 electrical interface, framing, jitter, and alarm signaling requirements-ensuring interoperability in global carrier networks. DS3252+ meets all applicable specifications without external components.

Does the DS3252+ support both B3ZS and HDB3 line coding?

Yes, the DS3252+ supports optional B3ZS encoding/decoding for DS3 and HDB3 encoding/decoding for E3 within each channel. This is configurable per LIU port via control registers or hardware pins, enabling seamless interoperation with North American (B3ZS) and European/Asian (HDB3) TDM infrastructure. DS3252+ also provides line-code violation counters and status flags for real-time monitoring.

Can the jitter attenuator in the DS3252+ be used in both receive and transmit paths simultaneously?

No-the DS3252+ jitter attenuator is configurable per channel to reside exclusively in either the receive path, the transmit path, or be disabled; it cannot operate in both paths concurrently. This design allows precise placement where jitter cleanup is most critical-for example, attenuating incoming jitter before framing (RX path) or cleaning synthesized transmit clocks (TX path). DS3252+ provides overflow/underflow status bits for FIFO health monitoring.

What clock frequencies can the DS3252+ clock adapter accept as input?

The DS3252+ clock adapter accepts a single master clock input at DS3 (44.736MHz), E3 (34.368MHz), STS-1 (51.84MHz), or common system frequencies: 19.44MHz, 38.88MHz, or 77.76MHz. From any of these inputs, it synthesizes all required line-rate clocks internally-eliminating need for multiple oscillators. DS3252+ also optionally outputs synthesized clocks for adjacent framers or mappers, reducing system-level timing complexity.

Is the DS3252+ pin-compatible with earlier Maxim LIUs like the DS3152?

Yes, the DS3252+ is a documented drop-in replacement for the DS3152, sharing identical pinout, package (144-pin TE-CSBGA), and footprint. However, DS3252+ adds functionality-including integrated clock adapter, jitter attenuator, and enhanced diagnostics-without requiring PCB changes. Legacy DS3152 designs can be upgraded to DS3252+ to improve jitter performance and reduce bill-of-materials count.

DS3252+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
144-BGA, CSPBGA
Packaging:
Tray
Product Status:
Obsolete
Function:
Line Interface Unit (LIU)
Interface:
LIU
Number of Circuits:
2
Voltage - Supply:
3.3V
Current - Supply:
150mA
Power (Watts):
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
144-TECSBGA (13x13)

DS3252+ FAQ

1.How can I place an order for DS3252+ through Aetrix?

Please submit a Request for Quotation (RFQ) for DS3252+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS3252+ reliable?

The price and inventory of DS3252+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS3252+ is usually 5 days.

3.What payment methods are accepted for DS3252+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS3252+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS3252+?

DS3252+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS3252+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS3252+?

For technical support, including DS3252+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS3252+ requirements.

6.How does Aetrix verify that DS3252+ is sourced from the original manufacturer or authorized distributors?

All DS3252+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS3252+ meets industry standards.

7.What is the process for return or replacement of DS3252+?

All DS3252+ units undergo pre-shipment inspection (PSI). If there is an issue with DS3252+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS3252+ part is unused and in its original packaging.

Return procedure for DS3252+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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