Analog Devices Inc./Maxim Integrated DS3252NA3

Overview

DS3252NA3 from Maxim Integrated (now Analog Devices) is a dual-channel line interface unit (LIU) for DS3/E3/STS-1 physical-layer interfacing, featuring independent receive/transmit paths per channel, on-chip jitter attenuators with 16–128-bit configurable FIFO depth, and a clock adapter synthesizing all line-rate clocks from a single input (e.g., 19.44MHz, 38.88MHz, or 77.76MHz). It supports B3ZS/HDB3 encoding/decoding and operates at 3.3V with 5V-tolerant I/O in telecom multiplexers and digital cross-connects.

For engineers reviewing the DS3252NA3 datasheet, DS3252NA3 pinout, DS3252NA3 application, or DS3252NA3 equivalent, key selection considerations include its dual-port DS3/E3/STS-1 compliance, hardware/parallel/SPI control interface flexibility, jitter attenuation placement options (RX/TX/disabled), industrial temperature range (–40°C to +85°C), and thermally enhanced 144-pin CSBGA package.

Technical Context

The DS3252NA3 implements two fully independent LIU channels, each integrating AGC + adaptive equalizer for up to 15dB cable loss compensation, clock and data recovery (CDR) with digital/analog LOS detection per ANSI T1.231 and ITU G.775, and programmable B3ZS/HDB3 encode/decode logic. Its jitter attenuator uses crystal-less architecture meeting Telcordia GR-253 and ITU G.823/G.824 requirements.

The on-chip clock adapter accepts master clocks at DS3 (44.736MHz), E3 (34.368MHz), STS-1 (51.84MHz), or standard frequencies (19.44/38.88/77.76MHz), then generates all required line-rate clocks - eliminating external oscillators. Control is supported via 8-bit parallel (Intel/Motorola modes), SPI (up to 10Mbit/s), or hardware mode with dedicated configuration pins.

Key Specifications

Pinout & Package

DS3252NA3 is housed in a 144-pin thermally enhanced chip-scale ball grid array (TE-CSBGA), 13mm × 13mm, with exposed thermal pad for efficient heat dissipation in high-density telecom line cards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port DS3/E3/STS-1 line interface applications.

Compared with DS3152N and MAX3675, DS3252NA3 delivers integrated jitter attenuation, single-clock clock adaptation, and full STS-1 support - reducing total solution size by ~35% and enabling tighter jitter budgets in next-generation SONET/SDH systems.

Availability

DS3252NA3 is available at Aetrix Electronics and suitable for SONET/SDH multiplexers, digital cross-connect systems, and DSLAM line cards requiring stable component supply, long-term lifecycle assurance, and carrier-grade reliability.

Supply support for DS3252NA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated, now part of Analog Devices, designs high-performance analog and mixed-signal ICs for communications, computing, and industrial applications.

The DS325x family was developed specifically for carrier-class DS3/E3/STS-1 line interface functions in telecom infrastructure - emphasizing jitter control, standards compliance, and multi-interface flexibility.

FAQ

What line standards does the DS3252NA3 support?

The DS3252NA3 supports DS3 (44.736Mbps), E3 (34.368Mbps), and STS-1 (51.84Mbps) line standards with full compliance to ANSI T1.102/T1.107, ITU G.703/G.751/G.775, and Telcordia GR-253. Each of its two LIU channels independently handles B3ZS or HDB3 encoding/decoding, and the DS3252NA3 meets jitter transfer and output jitter requirements per applicable standards.

Does DS3252NA3 include an integrated jitter attenuator?

Yes, DS3252NA3 includes an on-chip crystal-less jitter attenuator per channel that can be placed in the receive path, transmit path, or disabled. It offers selectable FIFO depths of 16, 32, 64, or 128 bits and meets Telcordia GR-253 and ITU G.823/G.824 jitter specifications - eliminating the need for external jitter cleaners in most telecom applications.

What control interfaces does DS3252NA3 support?

DS3252NA3 supports three control interfaces: hardware mode (pin-strapped configuration), 8-bit parallel CPU interface (with Intel/Motorola timing options and multiplexed/non-multiplexed modes), and SPI interface (up to 10Mbit/s with programmable polarity/phase). The DS3252NA3 allows seamless migration between modes using the HW pin and bus control signals.

What is the operating temperature range of DS3252NA3?

The DS3252NA3 is rated for industrial temperature operation from –40°C to +85°C, making it suitable for deployment in carrier-grade network equipment such as central office line cards, DSLAMs, and digital cross-connect systems where ambient conditions exceed commercial limits.

What package type is used for DS3252NA3?

DS3252NA3 uses a 144-pin thermally enhanced chip-scale ball grid array (TE-CSBGA) package measuring 13mm × 13mm with an exposed thermal pad. This package provides superior thermal performance for high-density telecom line cards and is compatible with standard SMT assembly processes.