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Analog Devices Inc./Maxim Integrated DS33M33N+
- Part No.:
- DS33M33N+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Specialized
- Package:
- 256-BGA
- Datasheet:
-
DS33M33N+.pdf
- Description:
- IC INTFACE SPECIALIZED 256CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,756
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Product details
Overview
DS33M33N+ from Maxim Integrated is a dual-port Ethernet-over-SONET/SDH mapper IC supporting EoS at VC-4, 3×VC-3, and EoPoS with three line DS3/E3 tributaries. It integrates two 155.52Mbps SerDes ports, one configurable 10/100/1000Mbps Ethernet MAC (GMII/MII/RMII), GFP-F/HDLC/cHDLC/X.86 encapsulation, and full SONET/SDH path/section/line layer termination - enabling carrier-grade GbE transport in multiservice provisioning platforms.
For engineers reviewing the DS33M33N+ datasheet, DS33M33N+ pinout, DS33M33N+ application, or DS33M33N+ equivalent, key selection criteria include its dual protected STS-3/STM-1 interface, integrated line-rate DS3/E3 framer with add/drop capability, VC-4 + 3×VC-3 + 3×DS3/E3 mapping flexibility, 125MHz DDR SDRAM controller, and support for IEEE 802.1Q/Q-in-Q VLANs in metro aggregation nodes.
Technical Context
The DS33M33N+ implements a full SONET/SDH hierarchy with independent STS-3/STM-1 SerDes A and B ports operating at 155.52Mbps using LVDS/LVPECL signaling. Each port includes complete section/line/path overhead generation and extraction per GR-253 and ITU-T G.707, with pointer processing for STS-3c/AU-4 and STS-1/AU-3/TU-3.
It embeds a dedicated line DS3/E3 framer supporting M23 DS3, C-bit DS3, G.751 E3, and G.832 E3 standards, with full B3ZS/HDB3 line coding, defect monitoring (LOS, LOF, AIS-L, RDI-L), and performance counters compliant with Telcordia and ITU requirements. The device uses a single reference clock with internal CLAD to synthesize 44.736MHz (DS3), 34.368MHz (E3), and 77.76/19.44MHz (STS-3/STM-1) timing domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Function | Ethernet-over-SONET/SDH mapper with integrated line DS3/E3 framer and add/drop capability |
| SONET/SDH Ports | Two independent 155.52Mbps STS-3/STM-1 SerDes (LVDS/LVPECL), supporting protected PHY-layer configuration |
| Line Interfaces | Three DS3/E3 tributaries with full M23/C-bit DS3 and G.751/G.832 E3 framing, B3ZS/HDB3 line coding, and loopback |
| Ethernet Interface | Single 10/100/1000Mbps MAC with configurable GMII/MII/RMII, IEEE 802.1Q and Q-in-Q VLAN support |
| Encapsulation | GFP-F (ITU-T G.7041), HDLC, cHDLC, and X.86 (LAPS) for Ethernet frame transport over SONET/SDH/PDH |
| Memory Interface | 125MHz DDR SDRAM controller supporting up to 512Mb (256Mb ×32-bit via 16-bit bus) for packet buffering |
| Power Supplies | 1.8V core, 2.5V DDR SDRAM, and 3.3V I/O - enabling low-power operation in carrier-class line cards |
Pinout & Package
DS33M33N+ is housed in a 17mm × 17mm, 256-ball CSBGA package with 0.8mm ball pitch. Pin assignment follows Maxim's standardized ball map for the DS33M3x family, optimized for high-speed SerDes routing, DDR SDRAM signal integrity, and DS3/E3 differential pair placement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SDA0–SDA15 | DDR SDRAM data bus (lower 16 bits) | Connects to 16-bit DDR SDRAM data interface; supports burst transfers for Ethernet and SONET packet buffering |
| SCLK, SCLK# | DDR SDRAM clock differential pair | Drives 125MHz DDR clock to external SDRAM; matched length critical for timing closure |
| SRAS#, SCAS#, SWE# | DDR SDRAM command control | Standard row/column address strobe and write enable signals for memory access arbitration |
| SA0–SA12 | DDR SDRAM address bus | 13-bit address bus supporting up to 8K rows × 1K columns × 16-bit width = 128MB addressing space |
| TXA+, TXA− | SerDes Port A transmit differential pair | LVDS output driving 155.52Mbps STS-3/STM-1 signal to optical transceiver; requires 100Ω differential PCB trace |
| RXA+, RXA− | SerDes Port A receive differential pair | LVDS input recovering 155.52Mbps STS-3/STM-1 clock and data; includes on-chip clock recovery circuitry |
| TXB+, TXB− | SerDes Port B transmit differential pair | Second 155.52Mbps LVDS output enabling protected 1+1 SONET/SDH link architecture |
| RXB+, RXB− | SerDes Port B receive differential pair | Redundant receive path for hitless protection switching in carrier-grade systems |
| D0–D23 | DS3/E3 line data interface (3× tributaries) | Three sets of 8-bit parallel DS3/E3 data paths supporting simultaneous add/drop of all three tributaries |
| CLKIN_DS3, CLKIN_E3 | External DS3/E3 reference clock inputs | Accepts 44.736MHz (DS3) or 34.368MHz (E3) clocks for line-timed operation; optional use of internal CLAD |
| MDC, MDIO | IEEE 802.3 management interface | Provides register-level access to Ethernet MAC configuration, statistics, and VLAN tables |
| SPICLK, SPIMOSI, SPIMISO, SPISS# | SPI microprocessor interface | 4-wire serial interface for host CPU configuration of mapping functions, OAM, and traffic policing parameters |
Key Features
| Feature | Design Value |
|---|---|
| Triple-mapping capability | Simultaneous EoS at VC-4, 3×VC-3, and EoPoS at 3×DS3/E3 enables flexible service provisioning across legacy and next-gen networks |
| Integrated line DS3/E3 framer | Full M23/C-bit DS3 and G.751/G.832 E3 compliance eliminates need for external framers, reducing BOM and board area |
| Protected SerDes architecture | Dual 155.52Mbps LVDS SerDes ports allow 1+1 hardware protection with automatic failover under LOS/LOF conditions |
| GFP-F/HDLC/cHDLC/X.86 encapsulation | Multi-protocol support ensures interoperability with diverse carrier equipment including legacy LAPS-based switches |
| QoS and traffic management | Per-flow CIR/CBS policing, PCP/DSCP classification, and priority scheduling meet SLA requirements for business Ethernet services |
| VLAN stacking (Q-in-Q) | Enables service provider VLAN isolation and customer VLAN transparency in multi-tenant metro networks |
Applications
| Carrier Ethernet Aggregation | Metro MSPP Line Card |
|---|---|
Use Scenario: Aggregating multiple 100Mbps business Ethernet circuits onto a single OC-3/STM-1 fiber link for regional backhaul. IC Role / Device Role / Timing Role: DS33M33N+ performs EoPoS mapping of three DS3 tributaries carrying Ethernet frames, with GFP-F encapsulation and VC-4 payload alignment. Use Value: Eliminates external DS3 multiplexers and SONET mappers, reducing latency by 1.2µs and power consumption by 2.1W per line card. |
Use Scenario: Deploying a modular multiservice provisioning platform supporting TDM, Ethernet, and IP traffic over shared SONET infrastructure. IC Role / Device Role / Timing Role: DS33M33N+ serves as the unified mapping engine handling both EoS (VC-4) and EoPoS (3×DS3) on dual protected SerDes links. Use Value: Enables single-chip support for 98% of metro service combinations, cutting design cycle time by 11 weeks versus discrete solutions. |
| Transparent LAN Extension | SONET-Based Enterprise WAN |
Use Scenario: Extending Layer 2 LAN segments across geographically dispersed sites using existing OC-3 dark fiber. IC Role / Device Role / Timing Role: DS33M33N+ maps native Ethernet frames into VC-4 payloads with IEEE 802.1Q tagging preserved end-to-end. Use Value: Delivers sub-50µs round-trip latency and <10⁻¹² BER over 120km links, meeting financial trading network SLAs. |
Use Scenario: Upgrading legacy enterprise SONET rings to carry Gigabit Ethernet without replacing installed optical infrastructure. IC Role / Device Role / Timing Role: DS33M33N+ terminates STM-1 signals, extracts Ethernet payloads via GFP-F, and forwards them to local switches via GMII. Use Value: Achieves 99.999% uptime via dual SerDes protection and real-time performance monitoring with 1-second PM counter updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Ethernet-over-SONET/SDH mapping applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS33M31N+ | Lacks integrated line DS3/E3 framer; supports only EoS and EoPoS via internal mapping, no physical DS3/E3 line interface | Used where DS3/E3 tributaries are handled externally (e.g., by DS33X162), not suitable for direct line-side DS3/E3 termination | Select DS33M31N+ when system already includes standalone DS3/E3 framers and only SONET/SDH mapping is required. |
| PMC-Sierra PM5352 | Single 155.52Mbps SerDes port; no line DS3/E3 interface; supports only VC-4 and 3×VC-3 EoS, no EoPoS capability | Targeted at pure EoS transport nodes without PDH interworking; lacks Q-in-Q and advanced traffic policing features | Choose PM5352 for cost-sensitive EoS-only deployments where DS3/E3 integration and QoS granularity are not required. |
Compared with DS33M33N+, DS33M31N+ reduces integration by omitting line DS3/E3 framer functionality, while PM5352 offers narrower mapping scope and no EoPoS support - making DS33M33N+ the sole option for full-service metro line cards requiring VC-4, 3×VC-3, and 3×DS3/E3 convergence in one chip.
Availability
DS33M33N+ is available at Aetrix Electronics and suitable for carrier Ethernet aggregation, metro MSPP line cards, transparent LAN extension, and SONET-based enterprise WAN applications requiring stable component supply and long-term lifecycle assurance.
Supply support for DS33M33N+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and RF ICs for communications, industrial, and automotive markets.
The DS33M33N+ belongs to Maxim's carrier-grade networking product line, designed specifically for SONET/SDH-based metro aggregation and multiservice provisioning platforms requiring seamless Ethernet transport over legacy TDM infrastructure.
FAQ
What is the primary function of the DS33M33N+ in a carrier network?
The DS33M33N+ serves as a full-featured Ethernet-over-SONET/SDH mapper with integrated line DS3/E3 framer. It enables transport of Gigabit Ethernet traffic over OC-3/STM-1 optical networks using VC-4, 3×VC-3, or EoPoS (3×DS3/E3) mapping. Its dual SerDes ports support protected 1+1 configurations, and it handles GFP-F/HDLC encapsulation, VLAN stacking, and QoS enforcement - making DS33M33N+ essential for metro aggregation and multiservice provisioning platforms.
Does the DS33M33N+ support both SONET and SDH standards?
Yes, the DS33M33N+ fully supports both SONET and SDH standards. It complies with Telcordia GR-253 for SONET and ITU-T G.707/G.783 for SDH, providing STS-3/STM-1 SerDes operation at 155.52Mbps, AU-4/VC-4 and AU-3/VC-3 pointer processing, and full section/line/path overhead generation and monitoring for both hierarchies. DS33M33N+ also supports SDH-specific features like S1 synchronization status messaging and VC-4 concatenation indicator (H4).
How does the DS33M33N+ handle DS3/E3 line interfacing?
The DS33M33N+ integrates a full line DS3/E3 framer supporting M23 DS3, C-bit DS3, G.751 E3, and G.832 E3 standards. It provides three parallel DS3/E3 tributary interfaces (D0–D23), B3ZS/HDB3 line coding, and loop timing, line timing, or local timing modes. Unlike DS33M31N+, DS33M33N+ terminates physical DS3/E3 lines directly - eliminating external framers and enabling true add/drop functionality within the same IC.
What memory interface does the DS33M33N+ support, and what is its capacity?
The DS33M33N+ includes a 125MHz DDR SDRAM controller supporting up to 512Mb total memory (via 256Mb ×32-bit DDR chips accessed through a 16-bit data bus). It uses SA0–SA12 for addressing, SDA0–SDA15 for data, and SCLK/SCLK# for differential clocking. This buffer memory is used for packet storage during Ethernet-to-SONET/SDH mapping, jitter attenuation, and performance monitoring - critical for maintaining sub-50µs latency in carrier Ethernet applications.
Can the DS33M33N+ operate with a single reference clock?
Yes, the DS33M33N+ incorporates an internal clock rate adapter (CLAD) that synthesizes all required timing domains - 44.736MHz for DS3, 34.368MHz for E3, and 77.76/19.44MHz for STS-3/STM-1 - from a single reference clock input. This eliminates the need for multiple crystal oscillators, simplifies board layout, and ensures phase coherence across Ethernet, SONET/SDH, and PDH domains - a key requirement for jitter-sensitive carrier applications.
DS33M33N+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Data Transport
- Interface:
- SPI Serial
- Voltage - Supply:
- 1.8V, 2.5V, 3.3V
- Supplier Device Package:
- 256-CSBGA (17x17)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
DS33M33N+ FAQ
1.How can I place an order for DS33M33N+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS33M33N+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS33M33N+ reliable?
The price and inventory of DS33M33N+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS33M33N+ is usually 5 days.
3.What payment methods are accepted for DS33M33N+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS33M33N+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS33M33N+?
DS33M33N+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS33M33N+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS33M33N+?
For technical support, including DS33M33N+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS33M33N+ requirements.
6.How does Aetrix verify that DS33M33N+ is sourced from the original manufacturer or authorized distributors?
All DS33M33N+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS33M33N+ meets industry standards.
7.What is the process for return or replacement of DS33M33N+?
All DS33M33N+ units undergo pre-shipment inspection (PSI). If there is an issue with DS33M33N+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS33M33N+ part is unused and in its original packaging.
Return procedure for DS33M33N+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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