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Analog Devices Inc./Maxim Integrated DS33M33N+W
- Part No.:
- DS33M33N+W
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Specialized
- Package:
- 256-BGA
- Datasheet:
-
DS33M33N+W.pdf
- Description:
- IC INTFACE SPECIALIZED 256CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,657
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Product details
Overview
DS33M33N+W from Maxim Integrated is a dual-port Ethernet-over-SONET/SDH mapper IC supporting EoS at VC-4, EoS over three concatenated VC-3s, and EoPoS over three DS3/E3 tributaries. It integrates two 155.52Mbps SerDes ports, one 10/100/1000Mbps Ethernet MAC with configurable MII/RMII/GMII interface, GFP-F/HDLC/cHDLC/X.86 encapsulation, and full line-side DS3/E3 add/drop capability - enabling carrier-grade multiservice transport in optical edge platforms.
For engineers reviewing the DS33M33N+W datasheet, DS33M33N+W pinout, DS33M33N+W application, or DS33M33N+W equivalent, key selection criteria include its dual protected STS-3/STM-1 SerDes architecture, integrated line DS3/E3 framer support (3×), VC-4 + 3×VC-3 mapping flexibility, IEEE 802.1Q/Q-in-Q VLAN handling, and DDR SDRAM buffering up to 512Mb for traffic shaping and jitter tolerance in metro aggregation nodes.
Technical Context
The DS33M33N+W implements a hierarchical SONET/SDH mapping engine with independent STS-3/STM-1 SerDes A and B ports operating at 155.52Mbps using LVDS/LVPECL signaling. It supports loop-timed and local-timed transmit modes per port, plus three timing modes (loop, line, local) for its three line DS3/E3 interfaces - enabling seamless interworking with legacy PDH networks and protected OC-3/STM-1 rings.
Its functional architecture includes dual STS-3/STM-1 framers with full TOH/POH generation/extraction, STS-1/AU-3/TU-3 pointer processing, VC-4 and VC-3 path termination, DS3/E3 add/drop muxing, GFP-F/HDLC encapsulation, and a 125MHz DDR SDRAM controller interfacing a 16-bit wide 256Mb buffer - all synchronized via an internal clock rate adapter (CLAD) deriving DS3 (44.736MHz), E3 (34.368MHz), and STS-3 (77.76/19.44MHz) clocks from a single reference.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Ethernet Port | 1× 10/100/1000Mbps MAC with MII/RMII/GMII configuration - enables flexible PHY interfacing in GbE-to-OC-3 gateway designs. |
| SerDes Ports | 2× 155.52Mbps STS-3/STM-1 serial interfaces with LVDS/LVPECL I/O - supports protected ring topologies and glueless connection to optical transceivers. |
| PDH Support | 3× line DS3/E3 interfaces with full framer, mapper, and add/drop capability - allows direct integration into TDM-centric access nodes without external DS3 mappers. |
| Mapping Modes | EoS at VC-4, EoS over 3×VC-3, EoPoS over 3×DS3/E3 - provides multi-layer transport flexibility for service providers deploying hybrid SONET/PDH infrastructures. |
| Encapsulation | GFP-F (ITU-T G.7041), HDLC, cHDLC, X.86 (LAPS) - ensures interoperability with legacy and next-gen network elements across carrier networks. |
| SDRAM Interface | 125MHz DDR controller supporting up to 512Mb buffer via 16-bit bus - delivers deep packet buffering for QoS enforcement, traffic policing (CIR/CBS), and OAM frame insertion. |
| Power Supplies | 1.8V core, 2.5V DDR, 3.3V I/O - enables low-power operation while maintaining signal integrity across high-speed SerDes and memory interfaces. |
Pinout & Package
DS33M33N+W is housed in a 17mm × 17mm, 256-ball CSBGA package with 0.8mm ball pitch. The package supports thermal dissipation requirements for sustained 155Mbps SerDes and DDR SDRAM operation in telecom line cards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Reference Clock Input | Accepts single crystal or LVCMOS clock (typically 19.44MHz or 77.76MHz); feeds CLAD to generate all internal timing domains. |
| SERDES_A_TXP/N | Differential STS-3 Transmit Output | LVDS output pair driving OC-3/STM-1 optical transceiver; supports loop/local timing modes. |
| SERDES_B_RXP/N | Differential STS-3 Receive Input | LVDS input pair recovering clock/data from protected STM-1 line; enables hitless switchover in 1+1 protection schemes. |
| DS3_0_ADD_P/N | Differential DS3 Add Output | LVDS pair injecting DS3 tributary into STS-1 payload; used for channelized add/drop in EoPoS applications. |
| DS3_2_DROP_P/N | Differential DS3 Drop Input | LVDS pair extracting DS3 tributary from STS-1; supports line-timed recovery for synchronous PDH interworking. |
| GMII_TXD[7:0] | GMII Transmit Data Bus | 8-bit parallel data path for 1000Mbps Ethernet; configurable as MII/RMII for lower-speed PHY compatibility. |
| DDR_DQ[15:0] | DDR SDRAM Data Bus | 16-bit bidirectional interface to 256Mb DDR SDRAM; enables large packet buffering for traffic shaping and latency compensation. |
| CSBGA_BALLS | Package Terminal Array | 256-ball grid supports full I/O count including SerDes, DS3, GMII, DDR, SPI, JTAG, and power/ground balls - optimized for high-density telecom PCB layout. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Protected SerDes Architecture | Enables 1+1 hardware protection switching at STS-3/STM-1 layer without external multiplexers - critical for carrier-grade SLA compliance. |
| Integrated Line DS3/E3 Framer | Eliminates need for discrete DS3 mappers; supports M23 DS3, C-bit DS3, G.751/G.832 E3 standards with full overhead monitoring and defect reporting. |
| VCAT/LCAS Support | Allows dynamic bandwidth allocation across up to 3 virtual concatenation groups (VCGs) - essential for elastic bandwidth provisioning in multiservice platforms. |
| IEEE 802.1Q & Q-in-Q Processing | Permits hierarchical VLAN tagging for multi-tenant service isolation and transparent LAN extension across SONET/SDH infrastructure. |
| CLAD-Based Clock Synthesis | Derives precise DS3 (44.736MHz), E3 (34.368MHz), and STS-3 (77.76/19.44MHz) clocks from one reference - reduces BOM cost and board space vs. multiple oscillators. |
Applications
| Ethernet Service Delivery Over SONET/SDH | Multiservice Provisioning Platform (MSPP) |
|---|---|
Use Scenario: Transporting Gigabit Ethernet client traffic across legacy OC-3/STM-1 optical rings while preserving VLAN tags and QoS policies. IC Role / Device Role / Timing Role: DS33M33N+W acts as the EoS mapper, performing GFP-F encapsulation, VC-4 mapping, and STS-3 SerDes transmission - with CLAD-synchronized timing ensuring phase alignment across SONET layers. Use Value: Enables service providers to extend Ethernet services over installed SONET infrastructure without requiring fiber upgrades or new DWDM layers. | Use Scenario: Aggregating Ethernet, T1/E1, and DS3/E3 services onto a unified OC-3/STM-1 backplane in central office edge routers. IC Role / Device Role / Timing Role: DS33M33N+W serves as the TDM/Ethernet convergence engine - mapping Ethernet to VC-4 and DS3/E3 to VC-3 simultaneously, with independent timing domains per tributary. Use Value: Reduces component count by integrating DS3 add/drop, SONET framing, and Ethernet MAC in one die - lowering power, footprint, and design complexity. |
| Transparent LAN Service (TLS) | LAN Extension Across Metro Networks |
Use Scenario: Providing point-to-point Layer 2 Ethernet connectivity between enterprise sites over carrier-managed SONET/SDH networks. IC Role / Device Role / Timing Role: DS33M33N+W operates in EoS mode with IEEE 802.1Q/Q-in-Q forwarding - preserving customer VLAN IDs while adding provider VLAN tags for multiplexing. Use Value: Delivers carrier-class TLS with sub-50ms failover via protected SerDes ports and deterministic latency through DDR-buffered packet flow. | Use Scenario: Extending campus LANs across metropolitan distances using existing OC-3 dark fiber or leased lines. IC Role / Device Role / Timing Role: DS33M33N+W functions as a GbE-to-OC-3 bridge - performing GFP-F encapsulation, VC-4 SPE mapping, and STS-3c pointer generation with J1 trace insertion. Use Value: Achieves <100µs end-to-end latency and <1ppm frequency accuracy via CLAD-derived clocks - meeting strict timing requirements for real-time industrial protocols. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Ethernet-over-SONET/SDH mapping applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS33M31N+ | Lacks line-side DS3/E3 framer and add/drop capability; supports only EoS and EoPoS via internal mapping - no physical DS3/E3 I/O pins. | Targeted at pure EoS/EoPoS gateways without legacy PDH interface requirements; unsuitable for MSPPs needing tributary-level DS3 termination. | Select DS33M31N+ when DS3/E3 line interface is unnecessary and cost-sensitive design favors smaller feature set. |
| PMC-Sierra PM5352 | Single-port STS-3/STM-1 SerDes; no native DS3/E3 line framer; requires external PDH mappers for EoPoS; supports only GFP-F and HDLC. | Designed for simpler EoS-only applications; lacks VCAT/LCAS, Q-in-Q, and triple DS3/E3 support - limited to basic carrier Ethernet handoff. | Choose PM5352 for entry-level EoS bridges where triple DS3/E3 add/drop, protected SerDes, and advanced encapsulation are not required. |
Compared with DS33M31N+, DS33M33N+W adds full line DS3/E3 framer functionality and physical I/O for tributary-level add/drop - making it uniquely suited for MSPPs. Against PM5352, DS33M33N+W delivers superior integration, dual SerDes protection, and broader encapsulation/standards support - reducing system-level complexity and validation effort.
Availability
DS33M33N+W is available at Aetrix Electronics and suitable for Ethernet service delivery over SONET/SDH, multiservice provisioning platforms (MSPPs), and transparent LAN service deployments requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for DS33M33N+W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and digital ICs for communications, computing, and industrial applications.
The DS33M33N+W belongs to Maxim's Ethernet-over-SONET/SDH mapper product line, designed specifically for carrier-grade metro edge and access equipment requiring converged TDM/Ethernet transport with full standards compliance and hardware-based protection.
FAQ
What is the primary function of the DS33M33N+W in a telecommunications system?
The DS33M33N+W serves as a high-integration Ethernet-over-SONET/SDH mapper IC that transports Gigabit Ethernet traffic across OC-3/STM-1 optical networks. It performs GFP-F/HDLC encapsulation, VC-4 and 3×VC-3 mapping, EoPoS over three DS3/E3 tributaries, and includes dual protected SerDes ports and a line-side DS3/E3 framer - enabling DS33M33N+W to act as the core transport engine in multiservice provisioning platforms and carrier Ethernet gateways.
Does the DS33M33N+W support both SONET and SDH standards simultaneously?
Yes, the DS33M33N+W natively supports both SONET (STS-3/STS-1) and SDH (STM-1/AU-4/AU-3) standards within a single device. Its framer and mapper blocks comply with GR-253 (SONET) and ITU-T G.707/G.783 (SDH), enabling interoperable deployment in North American SONET and global SDH networks - confirmed by its support for STS-3c/VC-4, AU-4/VC-4, STS-1/VC-3, and AU-3/VC-3 mapping paths as documented in the DS33M33N+W datasheet.
How many DS3/E3 tributaries can the DS33M33N+W handle, and what is their role?
The DS33M33N+W supports exactly three DS3/E3 tributaries on its line interface, each with full add/drop capability. These tributaries enable EoPoS transport by mapping Ethernet frames into DS3/E3 payloads, then into STS-1/VC-3 containers - allowing DS33M33N+W to interwork with legacy PDH networks while delivering Ethernet services over SONET/SDH infrastructure. This 3×DS3/E3 support is exclusive to DS33M33N+W within the DS33M30/M31/M33 family.
What type of memory interface does the DS33M33N+W provide, and why is it important?
The DS33M33N+W integrates a 125MHz DDR SDRAM controller supporting up to 512Mb of external DDR memory via a 16-bit data bus. This interface is critical for buffering variable-length Ethernet packets during rate adaptation between 1Gbps Ethernet and 155Mbps SONET/SDH links, enabling traffic policing (CIR/CBS), QoS scheduling, OAM frame insertion, and jitter tolerance - all essential for carrier-grade service level agreements when using DS33M33N+W in production networks.
Is the DS33M33N+W pin-compatible with other devices in the DS33M30/M31/M33 family?
No, the DS33M33N+W is not pin-compatible with DS33M30N+ or DS33M31N+. While all three share the same 256-ball CSBGA package footprint, DS33M33N+W exposes dedicated DS3/E3 differential I/O pins (e.g., DS3_0_ADD_P/N, DS3_2_DROP_P/N) absent in DS33M31N+, and its pin assignments for SerDes, DDR, and control signals differ per the device-specific ball maps. Therefore, DS33M33N+W requires unique PCB layout and cannot serve as a drop-in replacement for DS33M30N+ or DS33M31N+ without hardware redesign.
DS33M33N+W Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Data Transport
- Interface:
- SPI Serial
- Voltage - Supply:
- 1.8V, 2.5V, 3.3V
- Supplier Device Package:
- 256-CSBGA (17x17)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
DS33M33N+W FAQ
1.How can I place an order for DS33M33N+W through Aetrix?
Please submit a Request for Quotation (RFQ) for DS33M33N+W on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS33M33N+W reliable?
The price and inventory of DS33M33N+W are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS33M33N+W is usually 5 days.
3.What payment methods are accepted for DS33M33N+W?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS33M33N+W transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS33M33N+W?
DS33M33N+W orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS33M33N+W order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS33M33N+W?
For technical support, including DS33M33N+W datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS33M33N+W requirements.
6.How does Aetrix verify that DS33M33N+W is sourced from the original manufacturer or authorized distributors?
All DS33M33N+W products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS33M33N+W meets industry standards.
7.What is the process for return or replacement of DS33M33N+W?
All DS33M33N+W units undergo pre-shipment inspection (PSI). If there is an issue with DS33M33N+W, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS33M33N+W part is unused and in its original packaging.
Return procedure for DS33M33N+W:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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