Analog Devices Inc./Maxim Integrated DS33W11DK+
- Part No.:
- DS33W11DK+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Specialized
- Package:
- 256-LBGA, CSBGA
- Datasheet:
-
DS33W11DK+.pdf
- Description:
- IC INTFACE SPECIALIZED 256CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,577
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Product details
Overview
DS33W11DK+ from Maxim Integrated is a single-port Ethernet-over-PDH mapping device with integrated voice interface, supporting 10/100/1000Mbps MAC (GMII/MII/RMII), GFP-F/HDLC/X.86 encapsulation, and synchronous TDM serial interconnect up to 52Mbps over T1/E1/J1 or E3/T3. It features VCAT/LCAS link aggregation, QoS with VLAN/Q-in-Q/802.1p/DSCP, and external DDR SDRAM buffering - deployed in carrier-grade eLINE and bonded transparent LAN service gateways.
For engineers reviewing the DS33W11DK+ datasheet, DS33W11DK+ pinout, DS33W11DK+ application, or DS33W11DK+ equivalent, this page delivers verified technical context on Ethernet-to-TDM bridging, voice port integration, GFP-F encapsulation latency, differential delay tolerance (≤200ms), and SPI/parallel microprocessor interface timing - critical for telecom access equipment design and migration from legacy DS3/E3 infrastructure.
Technical Context
The DS33W11DK+ implements a store-and-forward Ethernet bridging architecture with wire-speed classification, priority queuing, and CIR/CBS policing. Its dual-domain clocking supports independent Ethernet MAC (125MHz GMII/25MHz MII) and TDM serial interface (up to 52MHz) domains, synchronized via internal PLLs and configurable clock dividers.
It integrates a dedicated voice port compliant with ITU-T G.703/G.704 framing, enabling direct connection to external codecs for simultaneous voice and data transport over PDH. The device uses an external 256Mb, 125MHz DDR SDRAM for frame buffering and supports both parallel (8-bit multiplexed) and SPI microprocessor interfaces for configuration and OAM frame handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Ethernet Ports | 1 × 10/100/1000Mbps IEEE 802.3 MAC with GMII/MII/RMII support and autonegotiation |
| TDM Serial Ports | 1 × synchronous serial interface supporting T1/E1/J1, T3/E3, or V.35 at ≤52Mbps aggregate rate |
| Voice Interface | 1 × G.703/G.704-compliant voice port for external codec interfacing in integrated voice/data services |
| Encapsulation Protocols | GFP-F, HDLC, cHDLC, and X.86 (LAPS) for standards-compliant Ethernet-over-PDH transport |
| QoS & VLAN Support | IEEE 802.1q VLAN, Q-in-Q stacking, 802.1p priority tagging, DSCP-based classification, and per-queue traffic shaping |
| Memory Interface | External 256Mb, 125MHz DDR SDRAM controller for frame buffering and store-and-forward operation |
| Microprocessor Interface | Parallel 8-bit multiplexed bus + SPI™ slave interface for register access, OAM extraction/insertion, and firmware control |
Pinout & Package
DS33W11DK+ is housed in a 256-ball, 17mm × 17mm CSBGA package (package code: 56-G6017-001), RoHS-compliant and rated for -40°C to +85°C industrial operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GMII_TXD[7:0] | Ethernet transmit data bus | 8-bit parallel output carrying GMII-encoded Ethernet frames to PHY; requires 125MHz clock alignment |
| WAN_TXCLK | TDM serial transmit clock input | Provides synchronous timing reference for WAN-side frame transmission; supports programmable phase alignment |
| VIO_1 | Voice interface data I/O | Bidirectional 8-bit time-division multiplexed voice data path compliant with G.703 2.048Mbps E1 framing |
| MICRO_SPI_MOSI | SPI serial data input | Configurable as SPI master-out/slave-in for register writes and command loading; operates up to 25MHz |
| DDR_DQ[15:0] | DDR SDRAM data bus | 16-bit bidirectional interface to external 256Mb DDR SDRAM; supports burst reads/writes at 125MHz |
Key Features
| Feature | Design Value |
|---|---|
| GFP-F/LAPS/HDLC encapsulation engine | Hardware-accelerated frame encapsulation with zero software overhead, enabling deterministic <10μs latency for 64-byte frames |
| VCAT/LCAS link aggregation | Supports dynamic bandwidth reallocation across up to 16 TDM links with hitless capacity adjustment per ITU-T G.7042 |
| Differential delay tolerance | Handles up to 200ms skew between aggregated TDM paths without packet loss or reordering artifacts |
| OAM frame trapping & insertion | Offloads OAM processing from host CPU by extracting/inserting IEEE 802.3ah, Y.1731, or SNMP frames via μP interface |
| Multi-voltage I/O support | Independent 1.8V core, 2.5V DDR, and 3.3V I/O rails enable seamless integration with mixed-voltage system designs |
Applications
| Bonded Transparent LAN Service | eLINE Metro Ethernet Access |
|---|---|
Use Scenario: Carrier provides point-to-point Layer 2 Ethernet connectivity across multiple T1/E1 circuits bonded via VCAT/LCAS. IC Role / Device Role / Timing Role: DS33W11DK+ performs GFP-F encapsulation, differential delay compensation, and per-circuit bandwidth policing at wire speed. Use Value: Enables 100% utilization of aggregated TDM bandwidth while maintaining sub-50ms failover and strict SLA compliance for business-class Ethernet. | Use Scenario: Enterprise connects remote branch offices to central data center using EoPDH over existing E3 infrastructure. IC Role / Device Role / Timing Role: DS33W11DK+ bridges native Ethernet frames into HDLC-framed PDH payloads with VLAN-aware forwarding and OAM visibility. Use Value: Delivers carrier-grade eLINE service with full 802.1ag/Y.1731 OAM, Q-in-Q transparency, and hardware-based traffic shaping. |
| Voice + Data Integration Gateway | DSLAM T1/E1 Trunk Card |
Use Scenario: Remote IP DSLAM aggregates subscriber VoIP and broadband data onto a single T1/E1 backhaul link. IC Role / Device Role / Timing Role: DS33W11DK+ terminates voice PCM streams via G.703 interface and encapsulates Ethernet data into GFP-F frames for co-transmission. Use Value: Eliminates separate voice and data TDM interfaces, reducing BOM cost and board space by 40% versus discrete solutions. | Use Scenario: Central office DSLAM uses T1/E1 trunks to deliver triple-play services to residential gateways. IC Role / Device Role / Timing Role: DS33W11DK+ acts as line-card mapper, converting aggregated Ethernet traffic into TDM-aligned GFP-F payloads with precise jitter management. Use Value: Achieves <1.5μs RMS jitter on T1/E1 outputs, meeting GR-499-CORE and Telcordia SR-332 requirements for DSLAM backhaul. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Ethernet-over-PDH mapping applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS33X11+ | No voice port; single Ethernet port only; identical TDM and encapsulation capabilities | Suitable for pure data-only eLINE deployments without voice integration | Select DS33X11+ when voice functionality is unnecessary and cost optimization is prioritized |
| DS33W41+ | 4× TDM ports vs. 1×; same voice port count (1); higher pin count (256-ball CSBGA shared) | Required for multi-link bonding or multi-service aggregation where >1 TDM circuit is terminated | Choose DS33W41+ when scaling beyond single-T1/E1 backhaul or requiring redundant WAN paths |
Compared with DS33X11+, DS33W11DK+ adds voice port capability without sacrificing Ethernet or TDM performance; compared with DS33W41+, it reduces pin count and power consumption while retaining full voice/data feature parity for single-link deployments.
Availability
DS33W11DK+ is available at Aetrix Electronics and suitable for bonded transparent LAN service gateways, eLINE metro access nodes, voice+data integration gateways, and DSLAM T1/E1 trunk cards requiring stable component supply across extended product lifecycles.
Supply support for DS33W11DK+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and digital ICs for communications, computing, and industrial systems.
The DS33W11DK+ belongs to Maxim's Ethernet-over-PDH mapping product line, designed specifically for carrier-class transport of Ethernet services over legacy TDM infrastructure with integrated voice support.
FAQ
What is the primary function of the DS33W11DK+ in telecom infrastructure?
The DS33W11DK+ functions as an Ethernet-over-PDH mapping device that encapsulates IEEE 802.3 frames into GFP-F, HDLC, or X.86 payloads for transport over T1/E1/J1 or T3/E3 circuits. It enables carrier-grade eLINE and bonded transparent LAN services while integrating a G.703-compliant voice port for combined voice/data backhaul - a key capability distinguishing DS33W11DK+ from non-voice variants like DS33X11+.
Does the DS33W11DK+ support JTAG boundary scan and what is its purpose?
Yes, the DS33W11DK+ includes IEEE 1149.1 JTAG support for boundary scan testing and in-system programming. This allows automated PCB test coverage of solder joints and interconnects during manufacturing, and facilitates debug access to internal registers and state machines without requiring additional probe points - critical for high-reliability telecom equipment where field serviceability and test repeatability are mandatory.
What memory interface does the DS33W11DK+ require and why is it essential?
The DS33W11DK+ requires an external 256Mb, 125MHz DDR SDRAM for frame buffering and store-and-forward operation. This external memory is essential because the device processes variable-length Ethernet frames at wire speed while compensating for TDM path skew (up to 200ms), performing QoS scheduling, and supporting GFP-F encapsulation - tasks demanding significantly more buffer depth than on-chip SRAM can provide. The DDR interface ensures deterministic latency and throughput for full-duplex 1Gbps Ethernet over PDH.
How does the DS33W11DK+ handle Quality of Service for mixed voice and data traffic?
The DS33W11DK+ implements hardware-based QoS using VLAN ID (802.1q), priority tagging (802.1p), DSCP classification, and CIR/CBS policing. Voice traffic from the G.703 port is mapped to highest-priority queues with strict shaper parameters, while Ethernet data is classified by VID or DSCP and assigned to weighted fair queues. This ensures low-latency, jitter-controlled voice transport alongside guaranteed bandwidth for data - all enforced in silicon without CPU intervention.
Is the DS33W11DK+ pin-compatible with other devices in the DS33X/W series?
No, the DS33W11DK+ is not pin-compatible with DS33X11+ or DS33W41+, despite sharing the same 256-ball CSBGA package footprint. Pin assignments differ significantly - especially for voice port signals (VIO_1, VCLK, VFRM), WAN interface lanes, and DDR bus routing. The DS33W11DK+ uses the DS33W41/DS33W11-specific pinout (Figure 7-2), requiring unique PCB layout; migration from DS33X11+ or DS33W41+ necessitates board redesign.
DS33W11DK+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 256-LBGA, CSBGA
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Data Transport
- Interface:
- Parallel/Serial
- Voltage - Supply:
- 1.8V, 2.5V, 3.3V
- Supplier Device Package:
- 256-CSBGA (17x17)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
DS33W11DK+ FAQ
1.How can I place an order for DS33W11DK+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS33W11DK+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS33W11DK+ reliable?
The price and inventory of DS33W11DK+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS33W11DK+ is usually 5 days.
3.What payment methods are accepted for DS33W11DK+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS33W11DK+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS33W11DK+?
DS33W11DK+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS33W11DK+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS33W11DK+?
For technical support, including DS33W11DK+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS33W11DK+ requirements.
6.How does Aetrix verify that DS33W11DK+ is sourced from the original manufacturer or authorized distributors?
All DS33W11DK+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS33W11DK+ meets industry standards.
7.What is the process for return or replacement of DS33W11DK+?
All DS33W11DK+ units undergo pre-shipment inspection (PSI). If there is an issue with DS33W11DK+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS33W11DK+ part is unused and in its original packaging.
Return procedure for DS33W11DK+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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