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Analog Devices Inc./Maxim Integrated DS33X11+
- Part No.:
- DS33X11+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Specialized
- Package:
- 144-LFBGA, CSPBGA
- Datasheet:
-
DS33X11+.pdf
- Description:
- IC INTFACE SPECIALIZED 144CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,612
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Product details
Overview
DS33X11+ from Maxim Integrated is a single-port Ethernet-over-PDH mapping device that encapsulates IEEE 802.3 MAC frames in GFP-F, HDLC, cHDLC, or X.86 for transmission over T1/E1/J1, T3/E3, or xDSL TDM streams. It supports eLAN/eLINE/VLAN services, provides wire-speed store-and-forward bridging, and operates across -40°C to +85°C. Used in carrier-grade LAN extension over legacy telecom infrastructure.
For engineers reviewing the DS33X11+ datasheet, DS33X11+ pinout, DS33X11+ application, or DS33X11+ equivalent, this page delivers verified technical context on Ethernet-to-TDM encapsulation, VCAT/LCAS link aggregation readiness, QoS policy enforcement, DDR SDRAM buffer interface, and SPI/parallel microprocessor control - all specific to the 1×1 TDM/Ethernet port configuration.
Technical Context
The DS33X11+ implements a full Ethernet MAC (MII/GMII/RMII) with autonegotiation and flow control, coupled to a programmable packet processor supporting GFP-F, HDLC, cHDLC, and X.86 encapsulation/decapsulation. It performs per-frame classification, priority queuing, VLAN/Q-in-Q tagging, and CIR/CBS policing at line rate.
Its serial WAN interface supports synchronous bidirectional interconnect up to 52Mbps over T1/E1/J1, T3/E3, or optical links. The device integrates a DDR SDRAM controller for external 256Mb, 125MHz DDR memory and offers both parallel and SPI microprocessor interfaces with IEEE 1149.1 JTAG test support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Ethernet Ports | 1 × 10/100/1000Mbps IEEE 802.3 MAC with MII/RMII/GMII support and autonegotiation |
| TDM Ports | 1 × synchronous serial interface supporting T1/E1/J1, T3/E3, xDSL, V.35, or optical physical layers up to 52Mbps |
| Encapsulation Protocols | GFP-F, HDLC, cHDLC, and X.86 (LAPS) - selectable per frame for standards-compliant EoPDH service delivery |
| Memory Interface | External 256Mb, 125MHz DDR SDRAM controller for frame buffering and traffic shaping |
| Microprocessor Interface | Parallel 8-/16-bit bus with read/write strobes and interrupt signaling, plus SPI™ slave interface for configuration and OAM |
| QoS & Bridging | VLAN, Q-in-Q, 802.1p, DSCP, and CIR/CBS policing - enables differentiated service SLAs in carrier networks |
| Operating Temperature | -40°C to +85°C industrial range - qualified for deployment in uncontrolled telecom central office and remote terminal environments |
Pinout & Package
DS33X11+ is housed in a 144-ball, 10mm × 10mm CSP (CSBGA) package (Maxim part number 56-G6008-003), optimized for high-density telecom line card layouts with controlled impedance routing and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ENET_RXD[3:0] | Ethernet Receive Data | MII-mode 4-bit nibble input carrying decoded MAC frame payload from PHY; timing-critical path requiring matched trace length |
| WAN_TXCLK | WAN Transmit Clock | Input clock sourced from external framer or LIU; defines bit rate and phase alignment for TDM serial output |
| DDR_CLK | DDR SDRAM Clock | Differential 125MHz clock driving external DDR memory; requires strict skew control relative to DDR_DQ and DDR_DM |
| MPU_CS | Microprocessor Chip Select | Active-low enable for parallel MPU interface; allows shared bus operation with other peripherals in multi-chip systems |
| SPI_MOSI | SPI Serial Data Input | Master-out/slave-in data line for register configuration and OAM frame insertion; supports 10MHz max clock rate |
| JTAG_TCK | JTAG Test Clock | IEEE 1149.1 boundary-scan clock input; used for production testing, debug, and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| GFP-F/LAPS/HDLC/cHDLC Encapsulation | Enables interoperability with global EoPDH networks by supporting all major ITU-T Y.1303/Y.1304 and IETF RFC 3572 standards |
| VCAT/LCAS Link Aggregation Readiness | Hardware support for inverse multiplexing across up to 16 TDM links - though DS33X11+ implements only 1 TDM port, its register map and firmware are compatible with multiport family members |
| QoS Policy Enforcement Engine | Programmable per-flow CIR/CBS policing and 8-level priority queuing - ensures bandwidth guarantees and latency bounds for voice, video, and data coexistence |
| External DDR SDRAM Buffer Architecture | Offloads frame storage to external 256Mb memory - eliminates internal SRAM bottlenecks and enables >200ms differential delay tolerance per ITU-T G.7041 |
| OAM Frame Trapping & Insertion | Allows external μP to extract and inject IEEE 802.3ah, Y.1731, or SNMP OAM frames without MAC-layer interference - critical for service activation and SLA monitoring |
Applications
| Bonded Transparent LAN Service | LAN Extension Over T1/E1 |
|---|---|
Use Scenario: Carrier delivers point-to-point Layer 2 Ethernet service between enterprise sites using bonded T1/E1 circuits across legacy PDH infrastructure. IC Role / Device Role / Timing Role: DS33X11+ acts as edge mapper, converting native Ethernet frames into GFP-F encapsulated TDM payloads while preserving VLAN tags and priority markings. Use Value: Enables cost-effective migration from leased-line TDM to managed Ethernet services without replacing installed copper/fiber plant. | Use Scenario: Remote branch office connects to headquarters via single T1/E1 line, requiring transparent extension of corporate LAN segments. IC Role / Device Role / Timing Role: DS33X11+ performs store-and-forward bridging and traffic conditioning at wire speed, synchronizing Ethernet and TDM domains with <10μs jitter accumulation. Use Value: Delivers deterministic latency and sub-50ms failover via integrated OAM processing - meeting VoIP and video conferencing SLAs. |
| Ethernet Delivery Over HDSL2/4 | eLINE Service Delivery |
Use Scenario: DSLAM vendor integrates DS33X11+ into last-mile access cards to deliver Ethernet over HDSL2/4 copper pairs to SMB customers. IC Role / Device Role / Timing Role: DS33X11+ adapts variable-rate Ethernet traffic to fixed-rate HDSL2 framing, applying GFP-F encapsulation and CRC protection per ITU-T G.991.2. Use Value: Achieves >99.999% uptime via hardware-accelerated error detection and automatic frame discard/retransmission coordination. | Use Scenario: Metro Ethernet provider deploys DS33X11+-based CPE to deliver point-to-point Ethernet virtual private line (EVPL) with strict bandwidth profiles. IC Role / Device Role / Timing Role: DS33X11+ enforces CIR/CBS policing on ingress traffic and applies 802.1p priority marking before TDM encapsulation. Use Value: Guarantees committed information rate and burst tolerance per SLA - validated by RFC 2544 throughput and latency measurements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Ethernet-over-TDM mapping applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS33X41+ | 4× TDM ports, same 1× Ethernet port, identical encapsulation engines and QoS architecture - shares full register compatibility and firmware footprint | Supports multi-link bonding (VCAT/LCAS) and higher aggregate throughput (up to 208Mbps); requires larger 256-ball CSBGA footprint | Select DS33X41+ when aggregating multiple T1/E1 lines or scaling beyond single-circuit capacity - no software changes required |
| DS33W11+ | Includes 1× voice port (G.703/G.704 compliant) alongside 1× TDM and 1× Ethernet port; otherwise identical mapping and bridging functionality | Enables integrated voice+data service delivery (e.g., VoIP trunking with data backup); adds codec interface pins and voice-specific registers | Select DS33W11+ when voice channel integration is required - same pinout family but different ball map due to added voice signals |
Compared with DS33X41+ and DS33W11+, the DS33X11+ provides minimal-footprint, single-TDM-circuit EoPDH mapping with full feature parity except port count and voice capability - ideal for cost-sensitive, space-constrained edge deployments where scalability or voice are not required.
Availability
DS33X11+ is available at Aetrix Electronics and suitable for bonded LAN service delivery, T1/E1-based LAN extension, and Ethernet-over-HDSL2/4 access equipment requiring stable component supply across extended product lifecycles.
Supply support for DS33X11+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs high-performance analog and mixed-signal ICs for communications, computing, and industrial applications, with deep expertise in timing, interface, and data conversion.
The DS33X11+ belongs to the DS33X-family of Ethernet-over-PDH mapping devices, engineered specifically for carrier-class transport of Ethernet services across legacy TDM infrastructure - emphasizing standards compliance, deterministic latency, and operational manageability.
FAQ
What is the primary function of the DS33X11+ in an Ethernet-over-TDM system?
The DS33X11+ serves as a standards-compliant Ethernet-to-TDM mapper, converting IEEE 802.3 frames into GFP-F, HDLC, cHDLC, or X.86 encapsulated payloads for transmission over T1/E1/J1, T3/E3, or xDSL physical layers. It performs wire-speed store-and-forward bridging, traffic classification, and QoS enforcement - enabling carrier-grade eLAN and eLINE services. DS33X11+ is designed for single-circuit deployments where compact size and low power are critical.
Does the DS33X11+ support VCAT/LCAS link aggregation?
The DS33X11+ includes full register-level and firmware compatibility with the VCAT/LCAS protocol stack defined in ITU-T G.7042, but it implements only one TDM port and therefore cannot perform physical link aggregation itself. Its design allows seamless migration to multiport variants like DS33X41+ or DS33X162+ without software redesign - making it ideal for scalable network edge architectures where future expansion is anticipated.
What external memory does the DS33X11+ require, and why is it necessary?
The DS33X11+ requires an external 256Mb, 125MHz DDR SDRAM to serve as its frame buffer memory. This off-chip architecture enables large packet buffering (supporting >200ms differential delay per ITU-T G.7041), accommodates bursty Ethernet traffic, and provides sufficient depth for QoS queuing and traffic shaping functions. Without this external memory, DS33X11+ cannot perform store-and-forward bridging or enforce CIR/CBS policies - it is mandatory for full functionality.
Can the DS33X11+ operate with both MII and GMII Ethernet interfaces simultaneously?
No, the DS33X11+ supports MII, RMII, or GMII Ethernet interfaces - but only one mode is active at a time, selected via strap pins and register configuration during initialization. The choice depends on PHY selection and board layout constraints: MII is used for 10/100Mbps with discrete PHYs, GMII for 1000Mbps, and RMII for reduced pin count in space-constrained designs. DS33X11+ does not multiplex or switch between modes dynamically in operation.
Is the DS33X11+ pin-compatible with other devices in the DS33X-family?
No, the DS33X11+ uses a 144-ball, 10mm × 10mm CSBGA package (56-G6008-003), while all other DS33X-family members (e.g., DS33X41+, DS33X162+) use a 256-ball, 17mm × 17mm CSBGA (56-G6017-001). Although register maps and firmware are highly aligned across the family, the DS33X11+ has a distinct pinout optimized for its single-port configuration - PCB layout is not interchangeable with multiport variants.
DS33X11+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 144-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Applications:
- Data Transport
- Interface:
- SPI Serial
- Voltage - Supply:
- 1.8V, 2.5V, 3.3V
- Supplier Device Package:
- 144-CSBGA (10x10)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
DS33X11+ FAQ
1.How can I place an order for DS33X11+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS33X11+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS33X11+ reliable?
The price and inventory of DS33X11+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS33X11+ is usually 5 days.
3.What payment methods are accepted for DS33X11+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS33X11+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS33X11+?
DS33X11+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS33X11+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS33X11+?
For technical support, including DS33X11+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS33X11+ requirements.
6.How does Aetrix verify that DS33X11+ is sourced from the original manufacturer or authorized distributors?
All DS33X11+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS33X11+ meets industry standards.
7.What is the process for return or replacement of DS33X11+?
All DS33X11+ units undergo pre-shipment inspection (PSI). If there is an issue with DS33X11+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS33X11+ part is unused and in its original packaging.
Return procedure for DS33X11+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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