Analog Devices Inc./Maxim Integrated DS33X162+

Overview

DS33X162+ from Maxim Integrated is a multiport Ethernet-over-PDH mapping IC that encapsulates IEEE 802.3 MAC frames in GFP-F, HDLC, cHDLC, or X.86 for transport over TDM networks. It features two 10/100/1000Mbps Ethernet MAC interfaces (GMII/MII/RMII), 16 TDM serial ports, and supports VCAT/LCAS link aggregation across up to 16 links - enabling eLAN/eLINE service delivery over legacy PDH infrastructure.

For engineers reviewing the DS33X162+ datasheet, DS33X162+ pinout, DS33X162+ application, or DS33X162+ equivalent, key selection criteria include its dual-GMII support, 16-channel TDM framing capability, VCAT/LCAS compliance, differential delay tolerance up to 200ms, and external DDR SDRAM buffering for store-and-forward traffic management in carrier-grade access equipment.

Technical Context

The DS33X162+ implements a full Ethernet bridging and traffic conditioning pipeline with programmable classification, priority queuing, and CIR/CBS policing. Its dual MACs operate independently with autonegotiation and flow control, supporting MII, RMII, and GMII modes simultaneously or separately.

It integrates a dedicated packet processor for GFP-F/LAPS/HDLC/cHDLC encapsulation and decapsulation, plus a VCAT/LCAS engine compliant with ITU-T G.7042 for inverse multiplexing over T1/E1/T3/E3. The device relies on an external 256Mb, 125MHz DDR SDRAM for frame buffering and uses parallel or SPI microprocessor interfaces for configuration.

Key Specifications

Pinout & Package

DS33X162+ is housed in a 256-ball, 17mm × 17mm CSBGA package (package code: 56-G6017-001), RoHS-compliant and rated for -40°C to +85°C operation. Pin functions are defined per Maxim's official pinout diagram (Figure 7-1, DS33X162/X161/X82/X81/X42/X41 Pin Configuration).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Ethernet-over-TDM mapping applications.

Compared with DS33X161+, DS33X162+ adds a second GMII port for redundancy or dual-homed LAN connectivity; compared with PM5352, it delivers native EoPDH standards compliance and lower latency store-and-forward buffering - making it optimal for greenfield carrier Ethernet access deployments.

Availability

DS33X162+ is available at Aetrix Electronics and suitable for bonded LAN extension, eLINE service delivery, and Ethernet-over-T1/E1 aggregation requiring stable component supply, long-term lifecycle assurance, and industrial temperature operation (-40°C to +85°C).

Supply support for DS33X162+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and digital ICs for communications, computing, and industrial systems.

The DS33X162+ belongs to Maxim's Ethernet-over-PDH mapping product line, designed specifically to enable carrier-class Ethernet access services - including eLAN, eLINE, and VLAN - over legacy TDM infrastructure.

FAQ

What is the primary function of the DS33X162+ in Ethernet-over-TDM systems?

The DS33X162+ serves as a standards-compliant Ethernet-over-PDH mapping device that encapsulates IEEE 802.3 frames into GFP-F, HDLC, cHDLC, or X.86 formats for transmission over TDM networks. It enables eLAN and eLINE services by performing store-and-forward bridging, VCAT/LCAS link aggregation, and hardware-accelerated QoS - all within a single 256-ball CSBGA package. DS33X162+ is engineered for deployment in carrier access nodes where deterministic latency and multi-link synchronization are critical.

Does the DS33X162+ support both GMII and MII interfaces simultaneously?

Yes, the DS33X162+ supports concurrent GMII and MII operation across its two Ethernet MACs: MAC1 can be configured for GMII (1000Mbps) while MAC2 operates in MII (10/100Mbps), or both can run in the same mode. This flexibility allows system designers to connect to high-speed switches via GMII and legacy PHYs via MII without external glue logic. DS33X162+ also supports RMII mode for space-constrained applications requiring reduced pin count.

How does the DS33X162+ handle differential delay across bonded TDM links?

The DS33X162+ supports up to 200ms of differential delay between aggregated TDM links - a key requirement for VCAT/LCAS compliance per ITU-T G.7042. Its internal buffer manager dynamically absorbs timing skew using external DDR SDRAM, ensuring zero frame loss during link re-timing or path switching. DS33X162+ implements adaptive pointer processing and payload justification to maintain synchronization integrity without requiring precise network-wide clock alignment.

Is an external SDRAM mandatory for DS33X162+ operation?

Yes, the DS33X162+ requires an external 256Mb, 125MHz DDR SDRAM for frame buffering and store-and-forward operation. The device contains no on-chip packet memory; all Ethernet frames and TDM payloads are managed through this external interface. DS33X162+ includes a dedicated DDR controller with configurable timing parameters and error detection - making the SDRAM not optional but architecturally integral to its wire-speed throughput capability.

What types of OAM functionality does the DS33X162+ support?

The DS33X162+ supports standards-based OAM frame handling via dedicated μP interface pins: it can trap, extract, and insert IEEE 802.3ah, Y.1731, and RFC 2544 OAM flows without interrupting data traffic. DS33X162+ does not process OAM internally but provides hardware-assisted frame routing to an external processor - enabling full-service OAM visibility while offloading computation and maintaining deterministic forwarding latency.