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Analog Devices Inc./Maxim Integrated DS33X41+

Part No.:
DS33X41+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Specialized
Package:
256-LBGA, CSBGA
Datasheet:
AetrixDS33X41+.pdf
Description:
IC INTFACE SPECIALIZED 256CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:669

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Product details

Overview

DS33X41+ from Maxim Integrated is a single-port Ethernet-over-PDH mapping device that encapsulates IEEE 802.3 MAC frames in GFP-F, HDLC, cHDLC, or X.86 for transmission over T1/E1/J1, T3/E3, or xDSL TDM streams. It supports VCAT/LCAS link aggregation across up to 4 TDM ports, provides wire-speed bridging and traffic conditioning, and operates across -40°C to +85°C for carrier-grade access networks.

For engineers reviewing the DS33X41+ datasheet, DS33X41+ pinout, DS33X41+ application, or DS33X41+ equivalent, this page delivers verified technical context on Ethernet-to-TDM encapsulation, QoS policy enforcement, DDR SDRAM buffering, SPI/parallel microprocessor interface support, and industrial-temperature operation - all critical for EoPDH service deployment and board-level integration.

Technical Context

The DS33X41+ implements a store-and-forward architecture with dual-layer classification (VLAN/Q-in-Q/DSCP) and per-flow CIR/CBS policing for deterministic bandwidth control. Its packet processor handles GFP-F/LAPS/HDLC/cHDLC encapsulation and decapsulation with full OAM frame trapping, extraction, and insertion via μP interface.

It integrates a 10/100/1000Mbps GMII/MII/RMII MAC with autonegotiation and flow control, supports up to 200ms differential delay tolerance in VCAT/LCAS mode, and interfaces to external 125MHz DDR SDRAM for frame buffering - enabling transparent LAN extension over legacy PDH infrastructure without protocol translation.

Key Specifications

ParameterValue and Actual Design Meaning
Ethernet Ports1 × 10/100/1000Mbps MAC with GMII/MII/RMII support and autonegotiation
TDM Ports4 × synchronous serial ports supporting T1/E1/J1, T3/E3, or xDSL physical layers
EncapsulationGFP-F, LAPS (X.86), HDLC, and cHDLC - selectable per port for standards-compliant EoPDH
VCAT/LCASSupports dynamic link aggregation across up to 4 TDM links with LCAS hitless capacity adjustment
QoS FeaturesVLAN, Q-in-Q, 802.1p priority tagging, DSCP classification, and programmable priority queuing
Memory InterfaceExternal 256Mb DDR SDRAM at 125MHz for frame buffering and traffic shaping
Processor InterfaceParallel 8-bit μP bus and SPI™ slave interface for configuration, OAM, and real-time management
Supply Voltages1.8V core, 2.5V I/O, and 3.3V analog supplies - independently regulated for mixed-signal integrity

Pinout & Package

DS33X41+ is housed in a 256-ball, 17mm × 17mm CSBGA package (package code: 56-G6017-001) with 0.8mm ball pitch and exposed thermal pad. Pin functions are defined per Maxim's DS33X162/X161/X82/X81/X42/X41 pinout diagram (Figure 7-1, Rev 063008).

Pin/TerminalCircuit RoleDesign Meaning
GMII_TXD[7:0]Ethernet Transmit Data Bus8-bit parallel output carrying GMII transmit octets; requires matched-length routing for timing compliance
MII_RXD[3:0]Ethernet Receive Data Bus (MII)4-bit receive path used when configured in MII mode; not active in GMII/RMII modes
WAN_TXCLK/WAN_RXCLKTDM Serial Clock Input/OutputSeparate transmit/receive clock pairs per TDM port; supports synchronous bidirectional interconnect up to 52Mbps
DDR_CLK/DDR_DQSDDR SDRAM Clock & StrobeDifferential clock and data strobe for 125MHz DDR interface; critical for frame buffer throughput stability
μP_CS/μP_RD/μP_WRParallel Microprocessor ControlChip select, read, and write strobes for 8-bit μP interface; enables register access and OAM frame handling
SPI_MOSI/SPI_MISO/SPI_SCLKSPI Serial Interface SignalsFull-duplex SPI slave interface supporting configuration and status polling without parallel bus overhead
JTAG_TCK/TMS/TDI/TDOIEEE 1149.1 Boundary ScanStandard test access port for production validation, debug, and in-system programming

Key Features

FeatureDesign Value
GFP-F/LAPS/HDLC/cHDLC EncapsulationStandards-compliant framing for EoPDH eLINE/eLAN services per ITU-T Y.1303/Y.1306 and RFC 3572
VCAT/LCAS Link AggregationEnables scalable bandwidth delivery across 4 TDM links with hitless capacity adjustment and failure recovery
Programmable QoS Policy EngineHardware-accelerated classification, marking, and scheduling using VLAN, DSCP, and 802.1p fields
OAM Frame Handling via μP InterfaceOffloads OAM processing to external host processor while maintaining full frame visibility and insertion control
External DDR SDRAM BufferingSupports >200ms frame buffering depth for differential delay compensation in bonded TDM applications
Multi-Interface MAC SupportSingle silicon instance supports GMII, MII, and RMII modes - simplifies PHY selection and board reuse

Applications

Bonded Transparent LAN ServiceLAN Extension Over T1/E1

Use Scenario: Carrier delivers point-to-multipoint enterprise LAN connectivity across geographically dispersed sites using bonded T1/E1 circuits.

IC Role / Device Role / Timing Role: DS33X41+ performs GFP-F encapsulation of Ethernet frames into TDM payloads and manages VCAT/LCAS bundling across 4 T1/E1 links.

Use Value: Enables deterministic 52Mbps aggregate bandwidth with sub-50μs latency and 200ms differential delay tolerance - meeting SLA requirements for financial trading networks.

Use Scenario: Remote office extends corporate LAN over existing T1 infrastructure without deploying fiber or managed switches.

IC Role / Device Role / Timing Role: DS33X41+ bridges local Ethernet traffic into HDLC-framed TDM streams and reconstructs frames at the central office.

Use Value: Eliminates need for separate routers or media converters; supports wire-speed bridging and VLAN-aware forwarding for multi-tenant segmentation.

Ethernet Delivery Over G.SHDSLeLINE Service Delivery

Use Scenario: ISP deploys last-mile broadband using G.SHDSL copper lines with Ethernet backhaul to DSLAM aggregation points.

IC Role / Device Role / Timing Role: DS33X41+ maps Ethernet MAC frames to X.86 (LAPS) format compatible with SHDSL framer ICs and line drivers.

Use Value: Achieves 2.3Mbps–22.7Mbps symmetric rates over single-pair copper with full OAM visibility and QoS tagging preservation.

Use Scenario: Metro Ethernet provider offers private Layer 2 virtual circuit service between customer locations using legacy PDH transport.

IC Role / Device Role / Timing Role: DS33X41+ terminates Ethernet ingress, applies Q-in-Q tunneling, and encapsulates traffic into GFP-F for T3/E3 transport.

Use Value: Delivers carrier-class eLINE with strict bandwidth guarantees (CIR/CBS policing), OAM monitoring, and 99.999% uptime compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Ethernet-over-PDH mapping applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DS33X42+2 Ethernet ports vs. 1; identical TDM port count, encapsulation, and VCAT/LCAS capabilityRequired for dual-homed LAN uplinks or redundant service paths; adds MAC resource overheadSelect DS33X42+ only if dual Ethernet termination is needed; DS33X41+ reduces BOM cost and layout area for single-port deployments
DS33X81+8 TDM ports vs. 4; same 1 Ethernet port; larger 256-ball CSBGA packageSupports higher-density TDM aggregation (e.g., 8×T1 trunking); increases PCB routing complexity and powerChoose DS33X81+ for future-proofing or multi-node hub applications; DS33X41+ optimizes cost and thermal footprint for edge access nodes

Compared with DS33X42+ and DS33X81+, the DS33X41+ delivers optimal balance of TDM port count, Ethernet interface simplicity, and thermal efficiency for single-link EoPDH edge demarcation - reducing component count and power by 30% versus dual-port or 8-port variants while retaining full GFP-F, VCAT/LCAS, and QoS feature parity.

Availability

DS33X41+ is available at Aetrix Electronics and suitable for bonded transparent LAN service, LAN extension over T1/E1, and eLINE service delivery requiring stable component supply across industrial temperature ranges and long product lifecycles.

Supply support for DS33X41+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs high-performance analog and mixed-signal ICs for communications, computing, and industrial systems - emphasizing signal integrity, power efficiency, and system-level integration.

The DS33X41+ belongs to Maxim's Ethernet-over-PDH mapping product line, engineered specifically for carrier-class TDM-to-Ethernet transport in metro access, business service gateways, and DSLAM edge cards.

FAQ

What Ethernet interface modes does the DS33X41+ support?

The DS33X41+ supports GMII, MII, and RMII Ethernet interface modes via configurable pin strapping and register settings. GMII is used for 1000Mbps operation with 8-bit wide data paths; MII supports 10/100Mbps with 4-bit data; RMII reduces pin count for 10/100Mbps with 2-bit data and shared reference clock. All modes include autonegotiation and IEEE 802.3x flow control. The DS33X41+ does not support RGMII or SGMII interfaces.

Does the DS33X41+ integrate an Ethernet PHY?

No, the DS33X41+ does not integrate an Ethernet PHY. It provides MAC-layer interfaces (GMII/MII/RMII) and requires an external PHY IC for physical layer signaling - such as the MAX24108 or compatible 10/100/1000BASE-T transceivers. This separation allows flexible PHY selection based on distance, medium (copper/fiber), and regulatory compliance requirements for the DS33X41+ design.

What external memory is required for DS33X41+ operation?

The DS33X41+ requires an external 256Mb DDR SDRAM operating at 125MHz for frame buffering, traffic shaping, and store-and-forward functionality. Maxim specifies Micron MT46V32M16 or equivalent DDR-200 compliant devices. The DS33X41+ implements full DDR timing control including DQS gating, read/write leveling, and refresh management - no external memory controller is needed.

How does DS33X41+ handle OAM frames in Ethernet-over-PDH applications?

The DS33X41+ supports OAM frame handling through dedicated μP interface registers that allow external processors to trap, extract, and insert OAM frames (e.g., IEEE 802.3ah, Y.1731) without interrupting data plane forwarding. Trapped frames are presented via the parallel or SPI interface; extracted frames are queued for host processing; inserted frames are scheduled into the transmit path with precise timing alignment. This offloads OAM processing while preserving end-to-end visibility for the DS33X41+.

Is DS33X41+ pin-compatible with other devices in the DS33X family?

The DS33X41+ shares the same 256-ball CSBGA package and pinout with DS33X162+, DS33X161+, DS33X82+, DS33X81+, and DS33X42+, as confirmed in Maxim's Figure 7-1 (Rev 063008). However, pin functionality differs across variants - for example, unused Ethernet or TDM pins on DS33X41+ may be repurposed as GPIO or clock outputs on higher-port variants. Board-level reuse requires register-level compatibility verification, not just mechanical pin matching.

DS33X41+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
256-LBGA, CSBGA
Packaging:
Bulk
Product Status:
Obsolete
Applications:
Data Transport
Interface:
Parallel/Serial
Voltage - Supply:
1.8V, 2.5V, 3.3V
Supplier Device Package:
256-CSBGA (17x17)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

DS33X41+ FAQ

1.How can I place an order for DS33X41+ through Aetrix?

Please submit a Request for Quotation (RFQ) for DS33X41+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS33X41+ reliable?

The price and inventory of DS33X41+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS33X41+ is usually 5 days.

3.What payment methods are accepted for DS33X41+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS33X41+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS33X41+?

DS33X41+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS33X41+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS33X41+?

For technical support, including DS33X41+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS33X41+ requirements.

6.How does Aetrix verify that DS33X41+ is sourced from the original manufacturer or authorized distributors?

All DS33X41+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS33X41+ meets industry standards.

7.What is the process for return or replacement of DS33X41+?

All DS33X41+ units undergo pre-shipment inspection (PSI). If there is an issue with DS33X41+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS33X41+ part is unused and in its original packaging.

Return procedure for DS33X41+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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