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Analog Devices Inc./Maxim Integrated DS33X81+

Part No.:
DS33X81+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Specialized
Package:
256-LBGA, CSBGA
Datasheet:
AetrixDS33X81+.pdf
Description:
IC INTFACE SPECIALIZED 256CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,469

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Product details

Overview

DS33X81+ from Maxim Integrated is an Ethernet-over-PDH mapping IC that encapsulates IEEE 802.3 MAC frames (10/100/1000Mbps) using GFP-F, HDLC, cHDLC, or X.86 for transport over TDM networks. It features one Ethernet port, eight TDM ports, no voice interface, and operates across -40°C to +85°C. It enables eLINE and eLAN services in carrier-grade access equipment.

For engineers reviewing the DS33X81+ datasheet, DS33X81+ pinout, DS33X81+ application, or DS33X81+ equivalent, key selection criteria include its 8-channel TDM interface bandwidth, GMII/MII/RMII Ethernet compatibility, VCAT/LCAS link aggregation support, QoS policy enforcement via CIR/CBS policing, and DDR SDRAM buffering architecture.

Technical Context

The DS33X81+ implements a store-and-forward bridging engine with wire-speed Ethernet traffic classification, VLAN/Q-in-Q tagging, and DSCP-based priority queuing. Its packet processor supports programmable encapsulation modes (GFP-F, HDLC, cHDLC, X.86) and OAM frame extraction/insertion via μP interface.

It integrates dual clock domains: synchronous WAN serial interfaces (up to 52Mbps per TDM link) and asynchronous Ethernet MAC interfaces (GMII/MII/RMII), coordinated by a JTAG-accessible register map and SPI/parallel microprocessor interface for real-time configuration.

Key Specifications

ParameterValue and Actual Design Meaning
Ethernet Ports1 × 10/100/1000Mbps MAC supporting GMII, MII, and RMII interfaces with autonegotiation and flow control
TDM Ports8 × synchronous serial ports supporting T1/E1/J1, T3/E3, OC-1, G.SHDSL, HDSL2/4 up to 52Mbps aggregate
EncapsulationGFP-F, HDLC, cHDLC, and X.86 (LAPS) - selectable per channel for standards-compliant EoPDH service delivery
VCAT/LCASSupports dynamic link aggregation across up to 16 links with ≤200ms differential delay tolerance for resilient bandwidth scaling
QoS EngineHardware-accelerated traffic shaping with CIR/CBS policing, 802.1p, DSCP, and Q-in-Q VLAN prioritization
Memory InterfaceExternal 256Mb, 125MHz DDR SDRAM buffer for frame storage and latency compensation
Power Supply1.8V, 2.5V, and 3.3V independent supply domains for I/O, core, and analog blocks

Pinout & Package

The DS33X81+ is housed in a 256-ball, 17mm × 17mm CSBGA package (package code: 56-G6017-001), RoHS-compliant and rated for industrial temperature range (-40°C to +85°C).

Pin/TerminalCircuit RoleDesign Meaning
GMII_TXD[7:0]Ethernet Transmit Data Bus8-bit parallel output for GMII mode; timing-critical path requiring controlled impedance routing
MII_RXD[3:0]Ethernet Receive Data Bus4-bit parallel input for MII mode; shared with RMII when configured for 10/100 operation
TDM_CLK[7:0]TDM Serial Clock InputPer-port synchronous clock input for framing alignment; supports master/slave mode selection
SDRAM_DQ[15:0]DDR SDRAM Data Bus16-bit bidirectional data interface to external DDR SDRAM; requires matched trace lengths and termination
SPI_CS, SPI_SCLK, SPI_MOSI, SPI_MISOSerial Peripheral Interface4-wire SPI interface for register configuration and status polling; operates up to 25MHz
JTAG_TCK, TMS, TDI, TDOIEEE 1149.1 Boundary ScanTest access port for production validation, debug, and in-system programming

Key Features

FeatureDesign Value
Programmable EncapsulationSelectable GFP-F, HDLC, cHDLC, or X.86 per TDM channel enables interoperability with diverse PDH network elements
VCAT/LCAS AggregationDynamic bandwidth allocation across up to 16 TDM links allows incremental service provisioning without circuit re-provisioning
Hardware QoS EnforcementDedicated CIR/CBS policer and 8-level priority queue ensure SLA-compliant traffic handling for mixed-service deployments
OAM Frame HandlingμP-accessible OAM extraction/insertion enables external processor to manage Ethernet service layer operations (e.g., Y.1731, IEEE 802.1ag)
Multi-Interface MACSingle MAC supporting GMII (1000Mbps), MII (100Mbps), and RMII (10/100Mbps) reduces board-level interface complexity

Applications

Bonded Transparent LAN ServiceLAN Extension Over T1/E1

Use Scenario: Carrier delivers point-to-point Layer 2 Ethernet connectivity between enterprise sites using bonded T1/E1 circuits.

IC Role / Device Role / Timing Role: DS33X81+ performs GFP-F encapsulation of Ethernet frames into TDM payloads and manages VCAT/LCAS bundling across multiple T1/E1 links.

Use Value: Enables deterministic bandwidth scaling and sub-50ms failover via LCAS, meeting carrier-grade SLA requirements for business Ethernet services.

Use Scenario: Remote office extends corporate LAN across legacy T1 infrastructure without deploying fiber or new routers.

IC Role / Device Role / Timing Role: DS33X81+ acts as a wire-speed bridge and encapsulator, converting native Ethernet frames to HDLC-framed TDM streams for transparent transport.

Use Value: Eliminates need for protocol translation gateways; preserves end-to-end Ethernet frame integrity and VLAN tags across the TDM segment.

E-Line Service DeliveryeLAN Service Aggregation

Use Scenario: Service provider offers dedicated Ethernet virtual circuit (EVC) between two customer locations over shared PDH backbone.

IC Role / Device Role / Timing Role: DS33X81+ applies VLAN ID filtering and 802.1p priority marking to isolate and prioritize EVC traffic on shared TDM infrastructure.

Use Value: Guarantees per-customer traffic separation and QoS enforcement without requiring separate physical circuits.

Use Scenario: Metro aggregation node consolidates multiple customer LANs onto a single OC-1 or E3 uplink using multiplexed TDM channels.

IC Role / Device Role / Timing Role: DS33X81+ bridges and filters traffic across 8 TDM ports while applying Q-in-Q tagging for hierarchical service demarcation.

Use Value: Supports multi-tenant service delivery with independent VLAN management per customer, reducing port count and operational overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Ethernet-over-TDM mapping applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DS33X82+Two Ethernet ports vs. one; identical TDM count (8), same package and feature set otherwiseRequired where dual LAN uplinks or LAN/LAN bridging is needed; not suitable for single-port cost-optimized designsSelect DS33X82+ only if dual Ethernet interface functionality is required; DS33X81+ provides optimal BOM cost for single-LAN deployments
DS33X41+Four TDM ports (vs. eight); same single Ethernet port, identical encapsulation and QoS capabilitiesTargeted at lower-bandwidth T1/E1 edge nodes or branch offices with fewer TDM circuits to manageChoose DS33X41+ for reduced TDM port count and lower power consumption; DS33X81+ suits full-featured central office or aggregation points

Compared with DS33X82+ and DS33X41+, the DS33X81+ uniquely balances 8-channel TDM capacity with single-Ethernet simplicity-making it the optimal choice for eLINE service cards and TDM-based LAN extension where port count and cost must be tightly aligned.

Availability

DS33X81+ is available at Aetrix Electronics and suitable for bonded transparent LAN service, LAN extension over T1/E1, E-Line delivery, and eLAN aggregation requiring stable component supply and long-term industrial temperature support.

Supply support for DS33X81+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and digital ICs for communications, computing, and industrial applications.

The DS33X81+ belongs to Maxim's Ethernet-over-PDH mapping product line, designed specifically for carrier-class TDM-to-Ethernet transport in metro access and business service edge platforms.

FAQ

What Ethernet interface standards does the DS33X81+ support?

The DS33X81+ supports IEEE 802.3-compliant 10/100/1000Mbps Ethernet via GMII, MII, and RMII physical interfaces. It includes autonegotiation, full/half-duplex flow control, and MDIO-based PHY management. All three modes are implemented in hardware and configurable via registers - the DS33X81+ does not require external glue logic to switch between them.

Does the DS33X81+ support VCAT/LCAS for link aggregation?

Yes, the DS33X81+ supports VCAT (Virtual Concatenation) and LCAS (Link Capacity Adjustment Scheme) per ITU-T G.7042. It enables dynamic bandwidth allocation across up to 16 TDM links with ≤200ms differential delay tolerance. The DS33X81+ handles VCAT control frame generation, LCAS status monitoring, and hitless bandwidth adjustment without host processor intervention.

What encapsulation protocols are supported by the DS33X81+ for TDM transport?

The DS33X81+ supports GFP-F (Generic Framing Procedure – Framed), HDLC (High-Level Data Link Control), cHDLC (Cisco HDLC), and X.86 (LAPS - Link Access Procedure for SDH). Each TDM port can be independently configured for any of these protocols, enabling interoperability with legacy and modern PDH/SONET/SDH infrastructure. The DS33X81+ implements full encode/decode and CRC generation/validation in hardware.

Is external memory required for DS33X81+ operation?

Yes, the DS33X81+ requires an external 256Mb, 125MHz DDR SDRAM for frame buffering and latency compensation. The device includes a dedicated DDR controller with programmable timing parameters and supports burst reads/writes. Without this external SDRAM, the DS33X81+ cannot perform store-and-forward bridging or traffic shaping - the DS33X81+ will not operate in functional mode if the SDRAM interface is unpopulated or misconfigured.

What is the operating temperature range and package type of the DS33X81+?

The DS33X81+ is specified for industrial operation from -40°C to +85°C and is packaged in a 256-ball, 17mm × 17mm CSBGA (package code 56-G6017-001) with lead-free/RoHS-compliant finish. This package supports automated assembly and meets IPC/JEDEC standards for thermal and mechanical reliability in carrier-grade networking equipment.

DS33X81+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
256-LBGA, CSBGA
Packaging:
Tray
Product Status:
Active
Applications:
Data Transport
Interface:
Parallel/Serial
Voltage - Supply:
1.8V, 2.5V, 3.3V
Supplier Device Package:
256-CSBGA (17x17)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

DS33X81+ FAQ

1.How can I place an order for DS33X81+ through Aetrix?

Please submit a Request for Quotation (RFQ) for DS33X81+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DS33X81+ reliable?

The price and inventory of DS33X81+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS33X81+ is usually 5 days.

3.What payment methods are accepted for DS33X81+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS33X81+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DS33X81+?

DS33X81+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DS33X81+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DS33X81+?

For technical support, including DS33X81+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS33X81+ requirements.

6.How does Aetrix verify that DS33X81+ is sourced from the original manufacturer or authorized distributors?

All DS33X81+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS33X81+ meets industry standards.

7.What is the process for return or replacement of DS33X81+?

All DS33X81+ units undergo pre-shipment inspection (PSI). If there is an issue with DS33X81+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DS33X81+ part is unused and in its original packaging.

Return procedure for DS33X81+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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