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Analog Devices Inc./Maxim Integrated DS33X82+
- Part No.:
- DS33X82+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Specialized
- Package:
- 256-LBGA, CSBGA
- Datasheet:
-
DS33X82+.pdf
- Description:
- IC INTFACE SPECIALIZED 256CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,570
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Product details
Overview
DS33X82+ from Maxim Integrated is an Ethernet-over-PDH mapping device with 8 TDM ports and dual 10/100/1000Mbps Ethernet MAC interfaces (GMII/MII/RMII), supporting GFP-F, HDLC, cHDLC, and X.86 encapsulation for wire-speed store-and-forward bridging over PDH/TDM networks. It enables eLAN/eLINE service delivery across T1/E1/J1, T3/E3, and xDSL infrastructure in carrier-grade access equipment.
For engineers reviewing the DS33X82+ datasheet, DS33X82+ pinout, DS33X82+ application, or DS33X82+ equivalent, key selection criteria include VCAT/LCAS link aggregation support for up to 16 links, 200ms differential delay tolerance, QoS with VLAN/Q-in-Q/802.1p/DSCP, and external DDR SDRAM buffering at 125MHz - all critical for Ethernet Access Service deployment in metro edge and DSLAM trunk cards.
Technical Context
The DS33X82+ implements a dual-MAC architecture with independent transmit/receive packet processors for encapsulation (GFP-F/HDLC/X.86) and decapsulation, coupled with a programmable traffic manager supporting CIR/CBS policing and priority queuing. Its buffer manager interfaces directly to external 256Mb DDR SDRAM for frame storage and latency control.
VCAT/LCAS functionality enables dynamic inverse multiplexing across up to 16 TDM links with hitless capacity adjustment, while OAM frame extraction/insertion via μP interface supports RFC 3440-compliant service management. The device operates across -40°C to +85°C using 1.8V/2.5V/3.3V supplies and includes IEEE 1149.1 JTAG for boundary-scan testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| TDM Ports | 8 bidirectional synchronous serial ports supporting T1/E1/J1, T3/E3, V.35, or optical interconnect up to 52Mbps per link. |
| Ethernet Interfaces | Dual IEEE 802.3-compliant MACs with GMII/MII/RMII support, autonegotiation, and full/half-duplex flow control. |
| Encapsulation Protocols | GFP-F, LAPS (X.86), HDLC, and cHDLC - enabling standards-compliant EoPDH transport per ITU-T Y.1307/Y.1308. |
| VCAT/LCAS Support | Dynamic link aggregation across up to 16 TDM links with hitless bandwidth adjustment and up to 200ms differential delay compensation. |
| QoS Capabilities | VLAN tagging (802.1q), Q-in-Q stacking, 802.1p priority marking, DSCP classification, and per-queue traffic shaping. |
| Memory Interface | External 256Mb, 125MHz DDR SDRAM controller for frame buffering - essential for jitter-tolerant store-and-forward operation. |
| Processor Interface | Parallel 8-/16-bit μP bus and SPI™ slave interface for configuration, OAM handling, and real-time status monitoring. |
Pinout & Package
DS33X82+ is housed in a 256-ball, 17mm × 17mm CSBGA package (package code: 56-G6017-001), RoHS-compliant and rated for industrial temperature range (-40°C to +85°C). Pin assignments are identical across DS33X162+/X161+/X82+/X81+/X42+/X41+ variants per Figure 7-1 of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GMII_TXD[7:0] | Ethernet Transmit Data Bus | 8-bit parallel output for GMII mode; used with GMII_TXEN/GMII_TXER to drive 1000Mbps Ethernet PHY. |
| MII_RXD[3:0] | Ethernet Receive Data Bus | 4-bit parallel input for MII mode; synchronized to MII_RXCLK for 10/100Mbps operation. |
| TDM_CLK[7:0] | TDM Port Clock Input | Per-port reference clock for synchronous TDM framing; supports multiple rates including 1.544MHz (T1) and 2.048MHz (E1). |
| DDR_DQ[15:0] | DDR SDRAM Data Bus | 16-bit bidirectional data path to external 256Mb DDR SDRAM; operates at 125MHz for frame buffering. |
| μP_A[15:0] | Microprocessor Address Bus | 16-bit address lines for parallel μP interface; enables direct register access and OAM frame exchange with host processor. |
| JTAG_TCK/TMS/TDI/TDO | IEEE 1149.1 Test Interface | Boundary-scan test access for PCB-level diagnostics and manufacturing verification. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Ethernet MACs with GMII/MII/RMII | Enables flexible PHY interfacing - GMII for 1Gbps, MII for 100Mbps, RMII for space-constrained 10/100 designs - without external glue logic. |
| Programmable Encapsulation Engine | Hardware-accelerated GFP-F, HDLC, cHDLC, and X.86 encoding/decoding ensures deterministic latency and zero CPU overhead for EoPDH framing. |
| VCAT/LCAS Link Aggregation | Supports dynamic bandwidth allocation and hitless reconfiguration across up to 16 TDM links - critical for SLA-compliant eLINE service provisioning. |
| QoS Policy Engine | Hardware-based classification, marking (VLAN/Q-in-Q/802.1p/DSCP), and scheduling enables five-level priority queuing for mixed-service traffic. |
| OAM Frame Handling | Configurable trapping, extraction, and insertion of IEEE 802.3ah/ITU-T Y.1731 OAM frames via μP interface - simplifies remote service monitoring and fault isolation. |
Applications
| Bonded Transparent LAN Service | LAN Extension over T1/E1 |
|---|---|
|
Use Scenario: Carrier delivers point-to-point Layer 2 Ethernet service across geographically dispersed sites using bonded T1/E1 circuits. IC Role / Device Role / Timing Role: DS33X82+ performs GFP-F encapsulation, VCAT/LCAS aggregation, and wire-speed bridging between Ethernet LAN and TDM WAN domains. Use Value: Enables 100Mbps+ aggregate bandwidth over legacy copper infrastructure with sub-50μs forwarding latency and full OAM visibility. |
Use Scenario: Enterprise extends campus LAN across metro distances using existing T1/E1 leased lines instead of fiber. IC Role / Device Role / Timing Role: DS33X82+ maps Ethernet frames into HDLC-framed TDM streams while preserving VLAN tags and priority markings. Use Value: Eliminates need for separate routers/switches and protocol converters - reduces BOM cost and power by 40% vs. discrete solution. |
| Ethernet Delivery over G.SHDSL | eLINE Service in DSLAM Trunk Cards |
|
Use Scenario: ISP deploys Ethernet access over symmetric DSL lines to SMB customers with guaranteed bandwidth and SLA enforcement. IC Role / Device Role / Timing Role: DS33X82+ applies CIR/CBS policing and 802.1p prioritization before encapsulating traffic for G.SHDSL physical layer transmission. Use Value: Delivers deterministic jitter performance (<100ns peak-to-peak) and strict bandwidth compliance required for VoIP and video SLAs. |
Use Scenario: Central office DSLAM uses DS33X82+ on trunk card to backhaul Ethernet traffic from subscriber line cards to core IP/MPLS network. IC Role / Device Role / Timing Role: DS33X82+ acts as TDM-to-Ethernet media converter with embedded bridging, filtering, and QoS policy enforcement. Use Value: Supports up to 200ms differential delay across aggregated links - essential for stable bonding in heterogeneous TDM plant environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Ethernet-over-PDH mapping applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DS33X162+ | 16 TDM ports, same dual-MAC architecture, identical feature set and pinout - differs only in port count and internal resource allocation. | Targeted at higher-density aggregation nodes requiring >8 TDM links; occupies same 256-ball CSBGA footprint. | Select DS33X162+ when scaling beyond 8 TDM links while retaining identical software stack and board layout. |
| DS33X42+ | 4 TDM ports, otherwise identical architecture, feature set, and package - reduced internal buffer and queue resources. | Suitable for cost-sensitive edge deployments with limited TDM connectivity, such as remote branch offices or small cell backhaul. | Choose DS33X42+ where TDM port count is ≤4 and BOM cost optimization is prioritized over future scalability. |
Compared with DS33X82+, DS33X162+ offers double the TDM port density with identical feature depth and software compatibility, while DS33X42+ reduces port count and internal resources to lower unit cost - all three share the same 256-ball CSBGA package, DDR SDRAM interface, and EoPDH protocol stack.
Availability
DS33X82+ is available at Aetrix Electronics and suitable for Ethernet Access Service gateways, DSLAM trunk cards, and metro edge demarcation devices requiring stable component supply, long-term lifecycle support, and industrial-temperature operation.
Supply support for DS33X82+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and digital ICs for communications, computing, and industrial systems.
The DS33X82+ belongs to Maxim's Ethernet-over-PDH mapping product line, designed specifically to enable carrier-class Ethernet Access Services (eLAN, eLINE, VLAN) over legacy TDM infrastructure with full standards compliance and operational simplicity.
FAQ
What is the primary function of the DS33X82+ in Ethernet Access Service deployments?
The DS33X82+ serves as a standards-compliant Ethernet-over-PDH mapper that encapsulates IEEE 802.3 frames into GFP-F, HDLC, cHDLC, or X.86 for transport across TDM networks. In eLINE and eLAN services, DS33X82+ provides wire-speed bridging, VCAT/LCAS link aggregation, and QoS enforcement - enabling carriers to deliver SLA-governed Ethernet services over existing T1/E1/J1 and T3/E3 infrastructure without fiber upgrades.
Does the DS33X82+ support both 10/100Mbps and 1000Mbps Ethernet interfaces simultaneously?
Yes, the DS33X82+ integrates two independent IEEE 802.3 MACs supporting GMII, MII, and RMII interfaces. Each MAC can be configured separately: one may operate in GMII mode for 1000Mbps connection to a Gigabit PHY, while the other runs in MII mode for 100Mbps to a Fast Ethernet PHY - enabling mixed-speed LAN/WAN segmentation within a single DS33X82+ device.
What external memory is required for DS33X82+ operation, and why is it necessary?
The DS33X82+ requires an external 256Mb, 125MHz DDR SDRAM to serve as its frame buffer memory. This external memory is mandatory because the DS33X82+ performs store-and-forward bridging with deep packet buffering - essential for absorbing jitter, accommodating differential delay in VCAT/LCAS links, and supporting bursty Ethernet traffic over synchronous TDM streams without frame loss.
How does the DS33X82+ handle OAM (Operations, Administration, and Maintenance) frames for service monitoring?
The DS33X82+ supports IEEE 802.3ah and ITU-T Y.1731 OAM through configurable frame trapping, extraction, and insertion via its parallel or SPI microprocessor interface. When enabled, OAM frames are diverted from the data path to the host processor for analysis or generation - allowing real-time link monitoring, fault detection, and performance measurement without impacting user traffic throughput on DS33X82+.
Is the DS33X82+ pin-compatible with other members of the DS33X family, such as DS33X162+ or DS33X42+?
Yes, the DS33X82+ shares identical pinout, package (256-ball CSBGA), power sequencing, and interface timing with DS33X162+, DS33X42+, DS33X81+, and DS33X41+. This pin compatibility allows designers to scale port count up or down - e.g., from DS33X82+ to DS33X162+ - without PCB redesign, while maintaining software compatibility and identical DDR SDRAM and PHY interface requirements.
DS33X82+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 256-LBGA, CSBGA
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Data Transport
- Interface:
- Serial
- Voltage - Supply:
- 1.8V, 2.5V, 3.3V
- Supplier Device Package:
- 256-CSBGA (17x17)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
DS33X82+ FAQ
1.How can I place an order for DS33X82+ through Aetrix?
Please submit a Request for Quotation (RFQ) for DS33X82+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DS33X82+ reliable?
The price and inventory of DS33X82+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DS33X82+ is usually 5 days.
3.What payment methods are accepted for DS33X82+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DS33X82+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DS33X82+?
DS33X82+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DS33X82+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DS33X82+?
For technical support, including DS33X82+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DS33X82+ requirements.
6.How does Aetrix verify that DS33X82+ is sourced from the original manufacturer or authorized distributors?
All DS33X82+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DS33X82+ meets industry standards.
7.What is the process for return or replacement of DS33X82+?
All DS33X82+ units undergo pre-shipment inspection (PSI). If there is an issue with DS33X82+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DS33X82+ part is unused and in its original packaging.
Return procedure for DS33X82+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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